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市場調査レポート

耐放射線強化エレクトロニクスの世界市場 - 分析・予測 (2018-2023年):RHBD、RHBP、RHBS

Global Radiation Hardened Electronics Market: Focus on Manufacturing Techniques (Rad-Hard by Design (RHBD), Rad-Hard by Process (RHBP), and Rad-Hard by Software (RHBS)); Component Type; and End Users - Analysis and Forecast, 2018-2023

発行 BIS Research Inc. 商品コード 785684
出版日 ページ情報 英文 206 Pages
納期: 即日から翌営業日
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本日の銀行送金レート: 1USD=111.21円で換算しております。
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耐放射線強化エレクトロニクスの世界市場 - 分析・予測 (2018-2023年):RHBD、RHBP、RHBS Global Radiation Hardened Electronics Market: Focus on Manufacturing Techniques (Rad-Hard by Design (RHBD), Rad-Hard by Process (RHBP), and Rad-Hard by Software (RHBS)); Component Type; and End Users - Analysis and Forecast, 2018-2023
出版日: 2019年01月31日 ページ情報: 英文 206 Pages
概要

世界の耐放射線強化エレクトロニクス市場は、2023年までに17億1,000万米ドルへ達すると予測されています。

当レポートでは、世界の耐放射線強化エレクトロニクス市場を調査し、市場の概要、市場成長の促進要因・課題・機会、各セグメント別の市場規模、地域市場の分析、および主要企業のプロファイルなどを提供しています。

エグゼクティブサマリー

第1章 市場力学

  • 市場成長推進因子
  • 市場課題
  • 市場機会

第2章 競合考察

  • 主な戦略・発展
  • 競合ベンチマーキング
  • 市場シェア分析

第3章 産業分析

  • 概要
  • エンドユーザー向け耐放射線強化製品規格要件の比較
  • NewSpace (ニュースペース) における耐放射線強化エレクトロニクスの進化
  • 耐放射線強化エレクトロニクスメーカー・仕様
  • サプライチェーン分析
  • 産業の魅力:ポーターのファイブフォース分析

第4章 世界の耐放射線強化エレクトロニクス市場

  • 前提条件・制限事項
  • 市場概要

第5章 世界の耐放射線強化エレクトロニクス市場:製造技術別

  • 市場概要
  • デザインによる耐放射線強化:Rad-Hard by Design (RHBD)
  • プロセスによる耐放射線強化:Rad-Hard by Process (RHBP)
  • ソフトウェアによる耐放射線強化:Rad-Hard by Software (RHBS)

第6章 世界の耐放射線強化エレクトロニクス市場:コンポーネントタイプ別

  • 市場概要
  • マイクロプロセッサー・コントローラー
  • ディスクリート半導体
  • 電源
  • メモリ
  • FPGA (フィールドプログラマブルゲートアレイ)
  • アナログ・混合信号
  • センサー
  • アプリケーション専用IC
  • その他

第7章 世界の耐放射線強化エレクトロニクス市場:エンドユーザー別

  • 市場概要
  • 宇宙
  • 軍事
  • 原子力発電所
  • その他

第8章 世界の耐放射線強化エレクトロニクス市場:地域別

  • 市場概要
  • 北米
  • 欧州
  • アジア太平洋 (APAC)
  • その他 (ROW)

第9章 企業プロファイル

  • 概要
  • Analog Devices Inc.
  • BAE Systems
  • Cobham plc
  • Data Device Corporation
  • Honeywell International Inc.
  • IBM Corporation
  • Infineon Technologies Inc.
  • Microchip Technology Inc.
  • Micropac Industries Inc.
  • Renesas Electronics Corporation
  • Solid State Devices Inc.
  • STMicroelectronics N.V
  • Texas Instruments Inc.
  • The Boeing Company
  • Xilinx Inc.
  • その他の主要企業

第10章 調査範囲・調査手法

図表

List of Tables

  • Table 1: Market Snapshot: Global Radiation Hardened Electronics Market, 2017 and 2023
  • Table 1.1: Impact Analysis of Market Drivers
  • Table 1.2: Impact Analysis of Market Challenges
  • Table 1.3: Impact Analysis of Market Opportunities
  • Table 1.4 Satellite Launches, 2016-2018
  • Table 1.5 Satellite Launches, 2017
  • Table 1.6 Comparison between COTS and QML Rad-Hard
  • Table 2.1: Product Launch
  • Table 2.2: Acquisitions
  • Table 2.3: Partnerships, Agreements, and Contracts in the Radiation Hardened Electronics Market
  • Table 2.4: Other Developments
  • Table 3.1: End User Specifications
  • Table 3.2: List of Certifications
  • Table 3.3: Analysing Factors of Threat from New Entrants
  • Table 3.4: Analysing Factors of Threat from Substitutes
  • Table 3.5: Analysing Factors of Bargaining Power of Buyers
  • Table 3.6: Analyzing Factors of Bargaining Power of Suppliers
  • Table 3.7: Analysing Factors of Intensity of Competitive Rivalry
  • Table 5.1: Global Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
  • Table 6.1: Global Radiation Hardened Electronics Market (by Component Type), 2017-2023
  • Table 6.2: Microprocessors and Controllers Market (by Qualified Manufacturers List)
  • Table 6.3: Discrete Semiconductor Market (by Qualified Manufacturers List):
  • Table 6.4: Power Sources Market (by Qualified Manufacturers List):
  • Table 6.5: Memory Market (by Qualified Manufacturers List):
  • Table 6.6: Field-Programmable Gate Array (FPGAs) Market (by Qualified Manufacturers):
  • Table 6.7: Sensors Market (by Qualified Manufacturers):
  • Table 6.8: Application-Specific Integrated Circuit (ASIC) Market (by Qualified Manufacturers):
  • Table 7.1: Global Radiation Hardened Electronics Market (by End User), 2017-2023
  • Table 7.2: Global Radiation Hardened Electronics Market (by Space), 2017-2023
  • Table 8.1: Global Radiation Hardened Electronics Market (by Region), 2017-2023
  • Table 8.2: North America Radiation Hardened Electronics Market (by End User), 2017-2023
  • Table 8.3: North America Radiation Hardened Electronics Market (by Components), 2017-2023
  • Table 8.4: North America Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
  • Table 8.5: Europe Radiation Hardened Electronics Market (by End User), 2017-2023
  • Table 8.6: Europe Radiation Hardened Electronics Market (by Components), 2017-2023
  • Table 8.7: Europe Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
  • Table 8.8: Asia-Pacific Radiation Hardened Electronics Market (by End User), 2017-2023
  • Table 8.9: Asia-Pacific Radiation Hardened Electronics Market (by Components), 2017-2023
  • Table 8.10: Asia-Pacific Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
  • Table 8.11: Rest of the World Radiation Hardened Electronics Market (by Components), 2017-2023
  • Table 8.12: Rest of the World Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
  • Table 8.13: Rest-of-the-World Radiation Hardened Electronics Market (by End User) 2017-2023

List of Figures

  • Figure 1: Global Radiation Hardened Electronics Market Snapshot
  • Figure 2: Global Radiation Hardened Electronics Market (by Component Type), 2017 and 2023
  • Figure 3: Global Radiation Hardened Electronics Market (by Manufacturing Technique), 2017 and 2023
  • Figure 4: Global Radiation Hardened Electronics Market (by End User), 2017 and 2023
  • Figure 5: Global Radiation Hardened Electronics Market: Global Scenario, 2017 and 2023
  • Figure 1.1: Market Dynamics Snapshot
  • Figure 2.1: Key Strategies Adopted by Market Players
  • Figure 2.2: Percentage Share of Strategies Adopted by the Market Players, January 2015 - October 2018
  • Figure 2.3: Competitive Benchmarking, 2017
  • Figure 2.4: Market Share of Leading Players in Global Radiation Hardened Electronics Market, 2017
  • Figure 3.1: Supply Chain Analysis
  • Figure 3.2: Radiation Hardened Electronics: Porter's Five Forces Analysis
  • Figure 4.1: Global Radiation Hardened Electronics Market, 2018-2023
  • Figure 5.1: Global Radiation Hardened Market (by Manufacturing Technique)
  • Figure 5.2: Rad-Hard by Design, 2017 - 2023
  • Figure 5.3: Rad-Hard by Process, 2017 - 2023
  • Figure 5.4: Rad-Hard by Software, 2017 - 2023
  • Figure 6.1: Classification of Radiation Hardened Electronics Market (by Component Type)
  • Figure 6.2: Global Radiation Hardened Electronics Market (by Microprocessors and Controllers), 2017 - 2023
  • Figure 6.3: Global Radiation Hardened Electronics Market (by Discrete Semiconductors), 2017 - 2023
  • Figure 6.4: Global Radiation Hardened Electronics Market (by Power Sources), 2017 - 2023
  • Figure 6.5: Global Radiation Hardened Electronics Market (by Memory), 2017-2023
  • Figure 6.6: Global Radiation Hardened Electronics Market (by Field-Programmable Gate Array), 2017 - 2023
  • Figure 6.7: Global Radiation Hardened Electronics Market (by Analog and Mixed Signals), 2017 - 2023
  • Figure 6.8: Global Radiation Hardened Electronics Market (by Sensors), 2017 - 2023
  • Figure 6.9: Global Radiation Hardened Electronics Market (by Application-Specific Integrated Circuit), 2017 - 2023
  • Figure 6.10: Global Radiation Hardened Electronics Market (by Others), 2017-2023
  • Figure 7.1: Classification of Radiation Hardened Electronics Market (by End User)
  • Figure 7.2: Global Radiation Hardened Electronics Market (by Space), 2017 - 2023
  • Figure 7.3: Global Radiation Hardened Electronics Market (by Military), 2017 - 2023
  • Figure 7.4: Global Radiation Hardened Electronics Market (by Nuclear Power Plants), 2017-2023
  • Figure 7.5: Global Radiation Hardened Electronics Market (by Others), 2017 - 2023
  • Figure 8.1: Classification of Radiation Hardened Electronics Market (by Region)
  • Figure 8.2: Regional Distribution of the Global Radiation Hardened Electronics Market, 2017 and 2023
  • Figure 8.3: North America Radiation Hardened Electronics Market, 2017- 2023
  • Figure 8.4: The U.S. Radiation Hardened Electronics Market, 2017-2023
  • Figure 8.5: Canada Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.6: Rest-of-North America Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.7: Europe Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.8: The U.K. Radiation Hardened Electronics Market, 2017-2023
  • Figure 8.9: Germany Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.10: France Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.11: Russia Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.12: Spain Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.13: Rest-of-Europe Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.14: Asia-Pacific Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.15: China Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.16: Japan Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.17: South Korea Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.18: Australia Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.19: India Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.20: Rest-of-Asia-Pacific Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.21: Rest-of-the-World Radiation Hardened Electronics Market, 2017-2023
  • Figure 8.22: Brazil Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.23: U.A.E. Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.24: South Africa Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 8.25: Mexico Radiation Hardened Electronics Market, 2017 - 2023
  • Figure 9.1: Share of Key Companies
  • Figure 9.2: Analog Devices Inc.: Overall Financials, 2015-2017
  • Figure 9.3: Analog Devices Inc.: Business Revenue Mix, 2015-2017
  • Figure 9.4: Analog Devices Inc.: Region Revenue Mix, 2015-2017
  • Figure 9.5: SWOT Analysis - Analog Devices Inc.
  • Figure 9.6: BAE Systems: Overall Financials, 2015-2017
  • Figure 9.7: BAE Systems: Business Revenue Mix, 2015-2017
  • Figure 9.8: BAE Systems: Region Revenue Mix, 2015-2017
  • Figure 9.9: SWOT Analysis - BAE Systems
  • Figure 9.10: Cobham plc: Overall Financials, 2015-2017
  • Figure 9.11: Cobham plc: Business Revenue Mix, 2015-2017
  • Figure 9.12: Cobham plc: Region Revenue Mix, 2015-2017
  • Figure 9.13: SWOT Analysis - Cobham plc
  • Figure 9.14: SWOT Analysis - Data Device Corporation
  • Figure 9.15: Honeywell International Inc.: Overall Financials, 2015-2017
  • Figure 9.16: Honeywell International Inc.: Business Revenue Mix, 2015-2017
  • Figure 9.17: Honeywell International Inc.: Region Revenue Mix, 2015-2017
  • Figure 9.18: SWOT Analysis - Honeywell International Inc.
  • Figure 9.19: IBM Corporation: Overall Financials, 2015-2017
  • Figure 9.20: IBM Corporation: Business Revenue Mix, 2015-2017
  • Figure 9.21: IBM Corporation: Region Revenue Mix, 2015-2017
  • Figure 9.22: SWOT Analysis - IBM Corporation
  • Figure 9.23: Infineon Technologies Inc.: Overall Financials, 2015-2017
  • Figure 9.24: Infineon Technologies Inc.: Business Revenue Mix, 2015-2017
  • Figure 9.25: Infineon Technologies Inc.: Region Revenue Mix, 2015-2017
  • Figure 9.26: SWOT Analysis - Infineon Technologies Inc.
  • Figure 9.27: Microchip Technology Inc.: Overall Financials, 2015-2017
  • Figure 9.28: Microchip Technology Inc.: Business Revenue Mix, 2015-2017
  • Figure 9.29: Microchip Technology Inc.: Region Revenue Mix, 2015-2017
  • Figure 9.30: SWOT Analysis - Microchip Technology Inc.
  • Figure 9.31: SWOT Analysis - Micropac Industries Inc.
  • Figure 9.32: Renesas Electronics Corporation: Overall Financials, 2015-2017
  • Figure 9.33: Renesas Electronics Corporation: Region Revenue Mix, 2017
  • Figure 9.34: SWOT Analysis - Renesas Electronics Corporation
  • Figure 9.35: SWOT Analysis - Solid State Devices Inc.
  • Figure 9.36: STMicroelectronics N.V: Overall Financials, 2015-2017
  • Figure 9.37: STMicroelectronics N.V: Business Revenue Mix, 2015-2017
  • Figure 9.38: STMicroelectronics N.V: Region Revenue Mix, 2015-2017
  • Figure 9.39: SWOT Analysis - STMicroelectronics NV
  • Figure 9.40: Texas Instruments Inc.: Overall Financials, 2015-2017
  • Figure 9.41: Texas Instruments Inc.: Business Revenue Mix, 2015-2017
  • Figure 9.42: Texas Instruments Inc.: Region Revenue Mix, 2015-2017
  • Figure 9.43: SWOT Analysis - Texas Instruments Inc.
  • Figure 9.44: The Boeing Company: Overall Financials, 2015-2017
  • Figure 9.45: The Boeing Company: Business Revenue Mix, 2015-2017
  • Figure 9.46: The Boeing Company: Region Revenue Mix, 2015-2017
  • Figure 9.47: SWOT Analysis - The Boeing Company
  • Figure 9.48: Xilinx Inc.: Overall Financials, 2016-2018
  • Figure 9.49 Xilinx Inc.: Business Revenue Mix, 2016-2018
  • Figure 9.50 Xilinx Inc.: Region Revenue Mix, 2016-2018
  • Figure 9.51: SWOT Analysis - Xilinx Inc.
  • Figure 10.1: Global Radiation Hardened Electronics Market Scope
  • Figure 10.2: Research Design and Flow
  • Figure 10.3: Top-Down and Bottom-up Approach
  • Figure 10.4: Radiation Hardened Electronics Market: Influencing Factors
  • Figure 10.5: Assumptions and Limitations
目次
Product Code: AD064A

"The Global Radiation Hardened Electronics Market Anticipated to Reach $1.71 Billion by 2023, Reports BIS Research."

The global radiation hardened electronics market is expected to witness stable growth during the forecast period 2018-2023, due to factors such as the increase of space missions and developing reconfigurable components for communication, navigation, science, space exploration, and remote sensing. The radiation hardened electronics market comprises sophisticated radiation hardened electronics systems used for various space, military, and commercial applications. Radiation hardened electronics components play a critical role in sustaining harmful space radiations, thus preventing physical damage and failure of the components. The global radiation hardened electronics market is expected to grow, owing to the increasing number of commercial satellites and increasing use of radiation hardened products in the military and other harsh environment applications.

According to BIS Research analysis, the global radiation hardened electronics market generated $1.45 billion in 2018 and is estimated to grow at a CAGR of 3.34%, during 2018-2023. Region-wise, North America dominated the global radiation hardened electronics market in 2017, with the U.S. acquiring the most significant market share, globally. However, Asia-Pacific is expected to pace at the highest growth rate during the forecast period, 2018-2023.

The following points provide a detailed description of the report content and the topics covered in the report:

  • The study examines the prime supply-side factors, which affect the growth of the market, along with the current and future trends, market drivers, restraints, and challenges prevalent in the global radiation hardened electronics market.
  • A detailed market share analysis, which focuses on the ¬key market developments and strategies, followed by the top players in the market, has been included in this report. Additionally, the report includes competitive benchmarking of the players in the global radiation hardened electronics market.
  • A detailed Porter's Five Forces has been included in the report.
  • This report identifies the global radiation hardened electronics market under different segments such as component types, manufacturing techniques, end users, and region.
  • The global radiation hardened electronics market for the major regions, including North America, Europe, Asia-Pacific, and Latin America, Middle East, and Africa, has been analyzed in the report.
  • In the company profiles section, the study provides a detailed analysis of 15 key players in the global radiation hardened electronics market, namely, Analog Devices Inc., BAE Systems, Cobham plc, Data Device Corporation, Honeywell International, IBM, Infineon Technologies, Microchip Technology, Micropac Industries, Renesas Electronic Corporation, Solid State Devices, STMicroelectronics, Texas Instruments, Inc., The Boeing Company, and Xilinx. This section covers their business financials, company snapshots, key products and services, major developments, and the individual SWOT analysis.

Executive Summary

Radiation hardening is a process of developing electronic components that remain unaffected by the damage caused by radiations which come from different sources including nuclear reactors, high-altitude flights, and particle accelerators through nuclear accidents, nuclear warfare, or space. The radiation hardened electronics provide resistant to malfunctions caused due to electromagnetic radiation and particle radiation.

The growing use of space-based electronics for satellites, crewed spacecraft, and deep-space is putting pressure on the radiation hardened electronics manufacturers to deliver technologies with high performance and low cost. The radiation hardened electronics market comprises the sophisticated radiation hardened electronics systems used for various space, military, and commercial applications. Moreover, radiation hardened electronics components play a critical role in sustaining harmful space radiations, thus preventing physical damage and failure of the components. Some of the leading players in the global radiation hardened electronics market include Analog Devices Inc., BAE Systems, Cobham plc, Data Device Corporation, Honeywell International, IBM, Infineon Technologies, Microchip Technology, Micropac Industries, Renesas Electronic Corporation, Solid State Devices, STMicroelectronics, Texas Instruments, Inc., The Boeing Company, and Xilinx, among others.

The market reported revenue of $1.45 billion in 2018 and is expected to grow at a significant CAGR, during the forecast period 2018-2023. The global radiation hardened electronics market has been segmented into nine-component types: microprocessors and controllers, sensors, application-specific integrated circuit, field-programmable gate array, memory, power sources, discrete semiconductors, analog and mixed signals, and others. The microprocessors and controllers component type market acquired the largest share in 2017. However, application-specific integrated circuit market is expected to grow at the highest CAGR during the forecast period, 2018-2023.

North America acquired the largest share of the global radiation hardened electronics market, followed by Europe, Asia-Pacific, and Rest-of-the-World (RoW). The U.S. and Canada are some of the prominent countries in North America responsible for the development of the radiation hardened electronics market. The U.S. dominated the overall market of the radiation hardened electronics in 2017. However, Asia-Pacific is expected to grow at the highest CAGR during the forecast period, 2018-2023. One of the major factors of the expected growth in the region is the increasing use of radiation hardened electronics in small satellites for various applications such as earth observation, navigation, and communication, among others. Also, China, India, and Japan are some of the major countries driving the growth of the radiation hardened electronics market in the Asia-Pacific region.

In addition, electronics manufacturers are working toward innovating radiation hardened electronics products and extending their regional presence. Further, given the huge potential of the radiation hardened electronics market, the industry is expected to observe a greater number of key strategic developments occurring among key technology players. Besides, with the ongoing efforts of industry players to develop innovative high-end solutions for different end users, the radiation hardened electronics market is anticipated to grow at a stable rate during the forecast period 2018-2023.

Table of Contents

Executive Summary

1. Market Dynamics

  • 1.1. Market Drivers
    • 1.1.1. Advancement in Microprocessor and FPGA Technologies
    • 1.1.2. Rising Demand from Communication Satellite Segment
    • 1.1.3. Increasing Space Missions
  • 1.2. Market Challenges
    • 1.2.1. High Designing and Developing Cost
    • 1.2.2. Difficulties in Creating Real Testing Environment
  • 1.3. Market Opportunities
    • 1.3.1. Increasing demand of COTS in Healthcare and Consumer Electronics
    • 1.3.2. Increasing Demand for Reconfigurable Radiation Hardened Components

2. Competitive Insights

  • 2.1. Key Strategies and Developments
    • 2.1.1. New Product Launch
    • 2.1.2. Acquisitions
    • 2.1.3. Partnerships, Agreements, and Contracts
    • 2.1.4. Other Developments
  • 2.2. Competitive Benchmarking
  • 2.3. Market Share Analysis

3. Industry Analysis

  • 3.1. Overview
  • 3.2. Comparison of Radiation Hardened Products Standard Requirements for End User
  • 3.3. Evolving Radiation Hardened Electronics in New Space
  • 3.4. Radiation Hardened Electronics Manufacturers and Certifications
  • 3.5. Supply Chain Analysis
  • 3.6. Industry Attractiveness: Porter's Five Forces
    • 3.6.1. Threat from New Entrants
    • 3.6.2. Threat from Substitutes
    • 3.6.3. Bargaining Power of Buyers
    • 3.6.4. Bargaining Power of Suppliers
    • 3.6.5. Intensity of Competitive Rivalry

4. Global Radiation Hardened Electronics Market, 2017 to 2023

  • 4.1. Assumptions and Limitations
  • 4.2. Market Overview

5. Global Radiation Hardened Electronics Market (by Manufacturing Technique)

  • 5.1. Market Overview
  • 5.2. Rad-Hard by Design (RHBD)
    • 5.2.1. Total Ionizing Doze
    • 5.2.2. Single Event Effect
  • 5.3. Rad-Hard by Process (RHBP)
    • 5.3.1. Silicon on Insulator (SOI)
    • 5.3.2. Silicon on Sapphire (SOS)
  • 5.4. Rad-Hard by Software (RHBS)

6. Global Radiation Hardened Electronics Market (by Component Type)

  • 6.1. Market Overview
  • 6.2. Microprocessors and Controllers
  • 6.3. Discrete Semiconductors
  • 6.4. Power Sources
  • 6.5. Memory
  • 6.6. Field-Programmable Gate Array
  • 6.7. Analog and Mixed Signals
  • 6.8. Sensors
  • 6.9. Application-Specific Integrated Circuit
  • 6.10 Others

7. Global Radiation Hardened Electronics Market (by End User)

  • 7.1. Market Overview
  • 7.2. Space
    • 7.2.1. New Space
    • 7.2.2. Conventional Space
    • 7.2.3. Space End-User Market by QLM V Qualification
    • 7.2.4. Business Opportunities for Radiation Hardened Electronics in Small Satellite
  • 7.3. Military
    • 7.3.1. Military End-User Market by QLM Q Qualification
  • 7.4. Nuclear Power Plants
  • 7.5. Others

8. Global Radiation Hardened Electronics Market (by Region)

  • 8.1. Market Overview
  • 8.2. North America
    • 8.2.1. North America Radiation Hardened Electronics Market Size (by End User)
    • 8.2.2. North America Radiation Hardened Electronics Market Size (by Component Type)
    • 8.2.3. North America Radiation Hardened Electronics Market Size (by Manufacturing Technique)
    • 8.2.4. North America Radiation Hardened Electronics Market Size (by Country)
      • 8.2.4.1. The U.S.

8.2.4.1.1. The U.S. Market (by ITAR Affiliation)

      • 8.2.4.2. Canada
      • 8.2.4.3. Rest-of-North America
  • 8.3. Europe
    • 8.3.1. Europe Radiation Hardened Electronics Market Size (by End User)
    • 8.3.2. Europe Radiation Hardened Electronics Market Size (by Component Type)
    • 8.3.3. Europe Radiation Hardened Electronics Market Size (by Manufacturing Technique)
    • 8.3.4. Europe Radiation Hardened Electronics Market Size (by Country)
      • 8.3.4.1. The U.K.
      • 8.3.4.2. Germany
      • 8.3.4.3. France
      • 8.3.4.4. Russia
      • 8.3.4.5. Spain
      • 8.3.4.6. Rest-of-Europe
  • 8.4. Asia-Pacific
    • 8.4.1. Asia-Pacific Radiation Hardened Electronics Market Size (by End User)
    • 8.4.2. Asia-Pacific Radiation Hardened Electronics Market Size (by Component Type)
    • 8.4.3. Asia-Pacific Radiation Hardened Electronics Market Size (by Manufacturing Technique)
    • 8.4.4. Asia-Pacific Radiation Hardened Electronics Market Size (by Country)
      • 8.4.4.1. China
      • 8.4.4.2. Japan
      • 8.4.4.3. South Korea
      • 8.4.4.4. Australia
      • 8.4.4.5. India
      • 8.4.4.6. Rest-of-Asia-Pacific
  • 8.5. Rest-of-the-World
    • 8.5.1. Rest-of-the-World Radiation Hardened Electronics Market Size (by End User)
    • 8.5.2. Rest-of-the-World Radiation Hardened Electronics Market Size (by Component Type)
    • 8.5.3. Rest-of-the-World Radiation Hardened Electronics Market Size (by Manufacturing Technique)
    • 8.5.4. Rest-of-the-World Radiation Hardened Electronics Market Size (by Country)
      • 8.5.4.1. Brazil
      • 8.5.4.2. U.A.E.
      • 8.5.4.3. South Africa
      • 8.5.4.4. Mexico

9. Company Profiles

  • 9.1. Overview
  • 9.2. Analog Devices Inc.
    • 9.2.1. Company Overview
    • 9.2.2. Product and Services
    • 9.2.3. Overall Financials
    • 9.2.4. Financial Summary
    • 9.2.5. SWOT Analysis
  • 9.3. BAE Systems
    • 9.3.1. Company Overview
    • 9.3.2. Products and Services
    • 9.3.3. Overall Financials
    • 9.3.4. Financial Summary
    • 9.3.5. SWOT Analysis
  • 9.4. Cobham plc
    • 9.4.1. Company Overview
    • 9.4.2. Products and Services
    • 9.4.3. Overall Financials
    • 9.4.4. Financial Summary
    • 9.4.5. SWOT Analysis
  • 9.5. Data Device Corporation
    • 9.5.1. Company Overview
    • 9.5.2. Corporate Summary
    • 9.5.3. Products and Services
    • 9.5.4. SWOT Analysis
  • 9.6. Honeywell International Inc.
    • 9.6.1. Company Overview
    • 9.6.2. Products and Services
    • 9.6.3. Overall Financials
    • 9.6.4. Financial Summary
    • 9.6.5. SWOT Analysis
  • 9.7. IBM Corporation
    • 9.7.1. Company Overview
    • 9.7.2. Product and Services
    • 9.7.3. Overall Financials
    • 9.7.4. Financial Summary
    • 9.7.5. SWOT Analysis
  • 9.8. Infineon Technologies Inc.
    • 9.8.1. Company Overview
    • 9.8.2. Products and Services
    • 9.8.3. Overall Financials
    • 9.8.4. Financial Summary
    • 9.8.5. SWOT Analysis
  • 9.9. Microchip Technology Inc.
    • 9.9.1. Company Overview
    • 9.9.2. Products and Services
    • 9.9.3. Overall Financials
    • 9.9.4. Financial Summary
    • 9.9.5. SWOT Analysis
  • 9.10 Micropac Industries Inc.
    • 9.10.1. Company Overview
    • 9.10.2. Corporate Summary
    • 9.10.3. SWOT Analysis
  • 9.11 Renesas Electronics Corporation
    • 9.11.1. Company Overview
    • 9.11.2. Products and Services
    • 9.11.3. Overall Financials
    • 9.11.4. Financial Summary
    • 9.11.5. SWOT Analysis
  • 9.12 Solid State Devices Inc.
    • 9.12.1. Company Overview
    • 9.12.2. Corporate Summary
    • 9.12.3. Products and Services
    • 9.12.4. SWOT Analysis
  • 9.13 STMicroelectronics N.V
    • 9.13.1. Company Overview
    • 9.13.2. Products and Services
    • 9.13.3. Overall Financials
    • 9.13.4. Financial Summary
    • 9.13.5. SWOT Analysis
  • 9.14 Texas Instruments Inc.
    • 9.14.1. Company Overview
    • 9.14.2. Products and Services
    • 9.14.3. Overall Financials
    • 9.14.4. Financial Summary
    • 9.14.5. SWOT Analysis
  • 9.15 The Boeing Company
    • 9.15.1. Company Overview
    • 9.15.2. Product and Services
    • 9.15.3. Overall Financials
    • 9.15.4. Financial Summary
    • 9.15.5. SWOT Analysis
  • 9.16 Xilinx Inc.
    • 9.16.1. Company Overview
    • 9.16.2. Products and Services
    • 9.16.3. Overall Financials
    • 9.16.4. Financial Summary
    • 9.16.5. SWOT Analysis
  • 9.17 Other Key Players
    • 9.17.1. Anaren Inc.
    • 9.17.2. Maxwell Technologies Inc.
    • 9.17.3. Microsemi Corporation
    • 9.17.4. pSemi Corporation
    • 9.17.5. TT Electronics

10. Research Scope & BIS Methodology

  • 10.1. Scope of the Report
  • 10.2. Global Radiation Hardened Electronics Market Research Methodology
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