株式会社グローバルインフォメーション
TEL: 044-952-0102
表紙
市場調査レポート

半導体シリコンウエハーの世界市場

Global Semiconductor Silicon Wafer Market

発行 BCC Research 商品コード 915158
出版日 ページ情報 英文 163 Pages
即納可能
価格
本日の銀行送金レート: 1USD=109.53円で換算しております。
Back to Top
半導体シリコンウエハーの世界市場 Global Semiconductor Silicon Wafer Market
出版日: 2019年10月25日 ページ情報: 英文 163 Pages
概要

半導体ウェハーの世界市場は2018年から2023年までの期間、5.7%のCAGR (年平均成長率) で成長を続け、2023年にはその市場規模は213億米ドルに達する見込みです。

当レポートでは、半導体ウエハーの世界市場を取り上げ、市場現況と動向とを分析して将来予測を行っています。また市場をエンドユーザ産業別、結晶成長法別、ウェハー接合プロセス別、ノードサイズ別、また地域別に分類しそれぞれ詳細な分析と予測を提供しています。

第1章 序論

  • 調査目標および目的
  • 調査理由
  • レポート範囲
  • 対象読者
  • 情報ソース
  • 調査手法および情報ソース
  • 地域的分析
  • アナリストの経歴
  • BCCの注文調査
  • BCC Researchの関連レポート

第2章 エグゼクティブサマリー

第3章 半導体デバイス製造と材料の性質

  • 半導体デバイスの製造ステップ
    • ウェハー加工
    • 製作
    • パッケージング
  • シリコン (Si)
    • シリコンと周期律表
    • 炭素族
    • シリコン
  • 化合物半導体
    • ガリウムヒ素 (GaAs)
    • インジウムリン (InP)
    • 窒化ガリウム (GaN)
    • II - VI属: 酸化物、硫化物、セレン化物、テルル化物
    • IV属: シリコンベース化合物および合金
  • ゲート構成手法
    • TTL (トランジスタ-トランジスタ・ロジック)
    • CMOS
  • `FET (電界効果トランジスタ)
    • MISFET/MOSFET
    • バイポーラCMOS
    • MESFET
    • HEMT (高電子移動度トランジスタ)
    • HBT (ヘテロ接合バイポーラトランジスタ)
  • ウェハーサイズ
    • 450 mmウェハーへの挑戦

第4章 結晶成長法

  • 序論
  • チョクラルスキー法 (CZ) および関連手法
  • ブリッジマン・ストックバーガー法および関連手法
  • 浮融帯溶融法 (FZ) および類似手法
  • 市場概要
  • 結晶成長後のウェハー加工

第5章 ウェハー接合プロセス

  • 直接接合
  • 表面活性化接合 (SAB)
  • プラズマ活性化接合 (PAB)
  • 陽極接合
  • 市場概要

第6章 ノードサイズ

  • 序論
  • エッチング加工概要
  • ムーアの法則
  • 10 nm以下
  • 12 nm - 22 nm
  • 28 nm以上
  • 市場概要

第7章 地域市場

  • 南北アメリカ市場
  • 欧州・中東・アフリカ市場
  • アジア太平洋市場
  • 市場概要

第8章 世界市場

  • 電気通信
  • 計測器および科学研究
  • 医療
  • エネルギー、防衛、および監視
  • コンピューティングおよびエンタテインメント
  • 産業用および自動車用
  • 小売業、その他

第9章 特許分析

  • カテゴリー別分析
  • 年度別分析
  • 国別分析
  • 譲受人プロファイル

第10章 企業プロファイル

  • ウェハー製造および加工装置ベンダー
  • 添加物サプライヤ
  • ウエハー製造企業
  • ファウンドリおよび半導体デバイス設計企業
  • 主要企業
図表

List of Tables

  • Summary Table: Global Market for Semiconductor Wafers, Through 2023
    • Table 1: Physical Properties of the Main Compound Semiconductor Materials Compared to Silicon
    • Table 2: Group III-V Compound Semiconductors, by Chemical Composition
    • Table 3: Group II-VI Compound Semiconductors, by Chemical Composition
    • Table 4: Group IV Compound Semiconductors
    • Table 5: Other Compounds: Semiconductors, by Chemical Composition
    • Table 6: Global Market for Semiconductor Wafers, by Crystal Growth Method, Through 2023
    • Table 7: Global Market Volume for Semiconductor Wafers, by Crystal Growth Method, Through 2023
    • Table 8: Global Market for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
    • Table 9: Global Market Volume for Semiconductor Wafers, by Wafer-Bonding Method, Through 2023
    • Table 10: Global Market for Semiconductor Wafers, by Node Size, Through 2023
    • Table 11: Global Market Volume for Semiconductor Wafers, by Node Size, Through 2023
    • Table 12: Global Market for Semiconductor Wafers, by Region, Through 2023
    • Table 13: Global Market Volume for Semiconductor Wafers, by Region, Through 2023
    • Table 14: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, Through 2023
    • Table 15: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 16: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 17: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 18: Global Market Volume for Semiconductor Wafers, in Telecommunications End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 19: Global Market for Semiconductor Wafers in Telecommunication End-Use Applications, by Node Size, Through 2023
    • Table 20: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Node Size, Through 2023
    • Table 21: Global Market for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
    • Table 22: Global Market Volume for Semiconductor Wafers in Telecommunications End-Use Applications, by Region, Through 2023
    • Table 23: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, Through 2023
    • Table 24: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 25: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 26: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 27: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 28: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
    • Table 29: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Node Size, Through 2023
    • Table 30: Global Market for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
    • Table 31: Global Market Volume for Semiconductor Wafers in Instrumentation and Scientific Research End-Use Applications, by Region, Through 2023
    • Table 32: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, Through 2023
    • Table 33: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 34: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 35: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 36: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 37: Global Market for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
    • Table 38: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Node Size, Through 2023
    • Table 39: Global Market for Semiconductor Wafers in Healthcare End-Use Applications by Region, Through 2023
    • Table 40: Global Market Volume for Semiconductor Wafers in Healthcare End-Use Applications, by Region, Through 2023
    • Table 41: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, Through 2023
    • Table 42: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 43: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 44: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 45: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 46: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
    • Table 47: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Node Size, Through 2023
    • Table 48: Global Market for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
    • Table 49: Global Market Volume for Semiconductor Wafers in Energy, Defense and Surveillance End-Use Applications, by Region, Through 2023
    • Table 50: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, Through 2023
    • Table 51: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 52: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 53: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 54: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 55: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size Through 2023
    • Table 56: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Node Size, Through 2023
    • Table 57: Global Market for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
    • Table 58: Global Market Volume for Semiconductor Wafers in Computing and Entertainment End-Use Applications, by Region, Through 2023
    • Table 59: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, Through 2023
    • Table 60: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 61: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 62: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 63: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 64: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
    • Table 65: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Node Size, Through 2023
    • Table 66: Global Market for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
    • Table 67: Global Market Volume for Semiconductor Wafers in Industrial and Automotive End-Use Applications, by Region, Through 2023
    • Table 68: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, Through 2023
    • Table 69: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 70: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Crystal Growth Method, Through 2023
    • Table 71: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 72: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Wafer-Bonding Method, Through 2023
    • Table 73: Global Market for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
    • Table 74: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Node Size, Through 2023
    • Table 75: Global Market for Semiconductor Wafers in Retail and Others End-Use Applications, by Region, Through 2023
    • Table 76: Global Market Volume for Semiconductor Wafers in Retail and Other End-Use Applications, by Region, Through 2023
    • Table 77: U.S. Patents on Semiconductor Wafer Technologies, by Patent Category, 1976 Through Aug. 2018
    • Table 78: U.S. Patent Trends: Semiconductor Wafer Technologies, by Year Granted, 1976 Through Aug. 2018
    • Table 79: U.S. Patent Shares of Semiconductor Wafer Technologies, by Assignee's Country, 1976 Through Aug. 2018
    • Table 80: U.S. Patent Holders of Semiconductor Wafer Technologies, 1976 Through Aug. 2018
    • Table 81: Patent Holders with Three or More U.S. Patents on Food Processing and Food Packaging Technologies, 1976 Through July 2018

List of Figures

  • Summary Figure: Global Market for Semiconductor Wafers, Through 2017-2023
目次
Product Code: SMC112A

Report Highlights:

The global market for semiconductor wafers should grow from $16.2 billion in 2018 to $21.3 billion by 2023 with a compound annual growth rate (CAGR) of 5.7% for the period of 2018-2023.

Americas semiconductor wafers market should grow from $4.5 billion in 2018 to $5.8 billion by 2023 with a compound annual growth rate (CAGR) of 5.4% for the period of 2018-2023.

EMEA semiconductor wafers market should grow from $4.0 billion in 2018 to $5.1 billion by 2023 with a compound annual growth rate (CAGR) of 5.0% for the period of 2018-2023.

Report Scope:

This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).

Dollar value and shipment volume are broken down along the following end uses -

  • Telecommunications.
  • Instrumentation and scientific research.
  • Healthcare.
  • Energy, defense and surveillance.
  • Computing and entertainment.
  • Industrial and automotive.
  • Retail and others.

Each of the end applications is further broken down by crystal growth methods -

  • Bridgman and allied methods (Bridgman).
  • Float-zone (FZ).
  • Czochralski (CZ) and allied methods (Czochralski).

Each end application is broken down by the following wafer-bonding methods -

  • Direct bonding.
  • Surface-activated bonding.
  • Anodic bonding.
  • Plasma bonding.

Each end application is further broken down by node size -

  • 10 nm and lower.
  • 12 to 22 nm.
  • 28 nm and above.

Each end-application is further broken down by regional market -

  • Americas.
  • Europe, Middle East and Africa (EMEA).
  • Asia Pacific (APAC).

Report Includes:

  • 72 data tables and 10 additional tables
  • An overview of the global markets for semiconductor silicon wafers
  • Analyses of global market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
  • Identification of potential applications of semiconductor silicon wafers in consumer electronics, telecommunications, automotive, defence, and healthcare industry
  • Overview of various bonding technologies in the semiconductor silicon wafers industry, including direct bonding, surface activated bonding, plasma activated bonding and anodic bonding
  • Coverage of major innovation initiatives in silicon wafer fabrication technology
  • Detailed analysis of major vendors and suppliers of the industry, including 3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba and Wafer World Inc

Table of Contents

Chapter 1: Introduction

  • Study Goals and Objectives
  • Reasons for Doing the Study
  • Scope of the Report
  • Intended Audience
  • Methodology and Information Sources
  • Geographic Breakdown
  • Analyst's Credentials
  • BCC Custom Research
  • Related BCC Research Reports

Chapter 2: Executive Summary

Chapter 3: Semiconductor Device Manufacturing and Material Properties

  • Steps in Semiconductor Device Manufacturing
    • Wafering
    • Fabrication
    • Packaging
  • Silicon (Si)
    • Silicon and the Periodic Table
    • The Carbon Family
    • Silicon
  • Compound Semiconductors
    • Gallium Arsenide (GaAs)
    • Indium Phosphide (InP)
    • Gallium Nitride (GaN)
    • Group II-VI: Oxides, Sulfides, Selenides and Tellurides
    • Group IV: Silicon-Based Compounds and Alloys
  • Gate Definition Methodology
    • Transistor-Transistor Logic (TTL)
    • Complementary Metal Oxide Semiconductor (CMOS)
    • Field Effect Transistor (FET)
    • Metal Oxide/Insulator Semiconductor Field Effect Transistor (MISFET/MOSFET)
    • Bipolar CMOS (BiCMOS)
    • Metal Semiconductor Field Effect Transistor (MESFET)
    • High Electron Mobility Transistor (HEMT)
    • Hetero-Junction Bipolar Transistor (HBT)
  • Wafer Sizing
    • The 450 mm Wafer Challenge

Chapter 4: Crystal Growth Methods

  • Introduction
  • Czochralski (CZ) and Related Methods
    • Methodology
    • Key Vendors and Innovations
  • Bridgman-Stockbarger and Related Methods
    • Methodology
    • Key Vendors and Innovations
  • Float Zone (FZ) and Allied Methods
    • Methodology
    • Key Vendors and Innovations
  • Market Overview
  • Post-Crystal Growth Wafer Processing
    • Ingot Formation, Grinding and Trimming
    • Wafer Slicing and Rounding
    • Lapping

Chapter 5: Wafer-Bonding Process

  • Direct Bonding
    • Methodology
    • Advantages
  • Surface-Activated Bonding (SAB)
    • Methodology
    • Advantages
  • Plasma-Activated Bonding (PAB)
    • Methodology
    • Advantages
  • Anodic Bonding
    • Methodology
    • Advantages
  • Market Overview

Chapter 6: Node Sizes

  • Introduction
  • Overview of the Etching Process
    • Equipment Involved
    • Process Challenges
  • Moore's Law
  • 10 nm and Less
    • Architecture
    • Key Developments
  • 12 nm to 22 nm
    • Architecture
    • Key Developments
  • 28 nm and More
    • Architecture
    • Key Developments
  • Market Overview

Chapter 7: Regional Markets

  • Americas
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • EMEA
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • APAC
    • User Profile
    • Macroeconomic Overview
    • Key Companies
  • Market Overview

Chapter 8: Global Markets

  • Telecommunications
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Instrumentation and Scientific Research
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Healthcare
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Energy, Defense and Surveillance
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Computing and Entertainment
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Industrial and Automotive
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market
  • Retail and Others
    • Market Overview
    • Breakdown by Crystal Growth Method
    • Breakdown by Wafer-Bonding Method
    • Breakdown by Node Size
    • Breakdown by Regional Market

Chapter 9: Patent Analysis

  • Introduction
  • Breakdown by Category
  • Breakdown by Year
  • Breakdown by Country
  • Profile of Assignees

Chapter 10: Company Profiles

  • Wafer Manufacturing and Processing Equipment Vendors
    • Pricing Dynamics
    • Key Companies
    • Semiconductor Material Suppliers
    • Pricing Dynamics
    • Key Companies
  • Additive Materials Suppliers
    • Pricing Dynamics
    • Key Companies
  • Wafer Manufacturers
    • Pricing Dynamics
    • Key Companies
  • Foundries and Semiconductor Device Designers
    • Pricing Dynamics
    • Key Companies
  • Companies
    • 3M
    • II-VI EPIWORKS
    • AIXTRON
    • APPLIED MATERIALS
    • ALINEASON
    • BREWER SCIENCE INC.
    • CMK SRO
    • DISCO CORP.
    • ELECTRONICS AND MATERIALS CORP. LTD (E&M)
    • ELKEM
    • EV GROUP
    • GLOBALWAFERS JAPAN CO. LTD.
    • HEMLOCK SEMICONDUCTOR CORP.
    • KOKUSAI ELECTRIC
    • INTEL
    • LINTEC CORP.
    • MECHATRONIK SYSTEMTECHNIK GMBH
    • MICRON
    • NICHIA CORP.
    • NISSAN CHEMICAL CORP.
    • OKMETIC
    • POWERCHIP
    • SAMSUNG
    • SHANGHAI SIMGUI TECHNOLOGY
    • SHIN-ETSU CHEMICAL CO. LTD.
    • SILTRONIX SILICON TECHNOLOGIES
    • SILICON MATERIALS INC.
    • SILICON VALLEY MICROELECTRONICS
    • SILTRONIC AG
    • SK HYNIX
    • SK SILTRON
    • SOITEC
    • SUMCO CORP.
    • SUSS MICRO TEC AG
    • SYNOVA
    • THERMCRAFT
    • TOKUYAMA CORP.
    • TOSHIBA
    • TSMC
    • ULVAC INC.
    • UMC
    • VIRGINIA SEMICONDUCTOR
    • WACKER CHEMIE AG
    • WAFER WORKS CORP.
    • WAFER WORLD INC
Back to Top