株式会社グローバルインフォメーション
TEL: 044-952-0102
表紙
市場調査レポート

5Gチップセット企業の上位10社

Top Ten 5G Chipset Companies

発行 BCC Research 商品コード 891233
出版日 ページ情報 英文 67 Pages
即納可能
価格
本日の銀行送金レート: 1USD=109.20円で換算しております。
Back to Top
5Gチップセット企業の上位10社 Top Ten 5G Chipset Companies
出版日: 2019年07月16日 ページ情報: 英文 67 Pages
概要

当レポートでは、世界における5Gチップセットの主要企業10社および産業の成長を促進する主な領域に注目して調査し、世界市場の概要、展開タイプ・ウェハーマテリアル・ICタイプ・スペクトル帯・エンドユーズ・地域別の市場分析と収益予測、競合情勢の分析、および主要企業のプロファイルなどを提供しています。

第1章 イントロダクション

第2章 サマリー・ハイライト

第3章 市場・技術背景

  • 5Gチップセットの市場定義・発展
  • 将来の展望・予測
  • 市場ダイナミクス
    • 促進要因
    • 抑制要因
    • 機会

第4章 5Gチップセット市場

  • イントロダクション
  • 市場:展開タイプ別
  • 市場:ウェハーマテリアルタイプ別
  • 市場:ICタイプ別
  • 市場:スペクトル帯別
  • 市場:エンドユーズ別
  • 市場:地域別

第5章 競合情勢

  • 市場シェア分析
  • 市場戦略分析
  • 主な市場発展

第6章 企業プロファイル

  • ERICSSON, INC.
  • 富士通
  • HEWLETT PACKARD ENTERPRISE
  • HUAWEI TECHNOLOGIES CO. LTD.
  • INTEL CORP.
  • MEDIATEK, INC.
  • NOKIA CORP.
  • QUALCOMM, INC.
  • SAMSUNG ELECTRONICS CO. LTD.
  • ZTE CORP.
図表

List of Tables

  • Summary Table: Global 5G Chipset Market, by Deployment Type, Through 2024
    • Table 1: Global 5G Chipset Market, by Deployment Type, Through 2024
    • Table 2: Global 5G Chipset Market, by Wafer Material Type, Through 2024
    • Table 3: Global 5G Chipset Market, by IC Type, Through 2024
    • Table 4: Global 5G Chipset Market, by Spectrum Bands, Through 2024
    • Table 5: Global 5G Chipset Market, by End Use, Through 2024
    • Table 6: Global 5G Chipset Market, by Region, Through 2024
    • Table 7: Key Developments in 5G Chipset Market, by Top 10 Companies, 2018-2019*
    • Table 8: Key Developments in 5G Chipset Market, by Top 10 Companies, 2017-2019*
    • Table 9: Ericsson, Inc.: 5G Chipset Products and Services
    • Table 10: Ericsson, Inc.: Company Financials, 2015-2018
    • Table 11: Ericsson, Inc.: Recent Developments, 2017-2019
    • Table 12: Ericsson, Inc: Key Management
    • Table 13: Fujitsu Ltd.: 5G Chipset Products and Services
    • Table 14: Fujitsu Ltd.: Company Financials, 2015-2018
    • Table 15: Fujitsu Ltd.: Recent Developments, 2018
    • Table 16: Fujitsu Ltd.: Key Management
    • Table 17: Hewlett Packard Enterprise: 5G Chipset Products and Services
    • Table 18: Hewlett Packard Enterprise: Company Financials, 2015-2018
    • Table 19: Hewlett Packard Enterprise: Recent Developments, 2019
    • Table 20: Hewlett Packard Enterprise: Key Management
    • Table 21: Huawei Technologies Co. Ltd.: 5G Chipset Products and Services
    • Table 22: Huawei Technologies Co. Ltd.: Company Financials, 2015-2018
    • Table 23: Huawei Technologies Co. Ltd.: Recent Developments, 2018-2019
    • Table 24: Huawei Technologies Co. Ltd.: Key Management
    • Table 25: Intel Corp.: 5G Chipset Products and Services
    • Table 26: Intel Corp.: Company Financials, 2015-2018
    • Table 27: Intel Corp.: Recent Developments, 2019
    • Table 28: Intel Corp.: Key Management
    • Table 29: MediaTek, Inc.: 5G Chipset Products and Services
    • Table 30: MediaTek, Inc.: Company Financials, 2015-2018
    • Table 31: MediaTek, Inc.: Recent Developments, 2018-2019
    • Table 32: MediaTek, Inc.: Key Management
    • Table 33: Nokia Corp.: 5G Chipset Products and Services
    • Table 34: Nokia Corp.: Company Financials, 2015-2018
    • Table 35: Nokia Corp.: Recent Developments, 2018-2019
    • Table 36: Nokia Corp.: Key Management
    • Table 37: Qualcomm, Inc.: 5G Chipset Products and Services
    • Table 38: Qualcomm, Inc.: Company Financials, 2015-2018
    • Table 39: Qualcomm, Inc.: Recent Developments, 2018-2019
    • Table 40: Qualcomm, Inc.: Key Management
    • Table 41: Samsung Electronics Co. Ltd.: 5G Chipset Products and Services
    • Table 42: Samsung Electronics Co. Ltd.: Company Financials, 2014-2017
    • Table 43: Samsung Electronics Co. Ltd.: Recent Developments, 2018-2019
    • Table 44: Samsung Electronics Co. Ltd.: Key Management
    • Table 45: ZTE Corp.: 5G Chipset Products and Services
    • Table 46: ZTE Corp.: Company Financials, 2015-2018
    • Table 47: ZTE Corp.: Recent Developments, 2018-2019
    • Table 48: ZTE Corp.: Key Management

List of Figures

  • Summary Figure: Global 5G Chipset Market, by Deployment Type, 2018-2024
    • Figure 1: Global 5G Chipset Market, by Deployment Type, 2018-2024
    • Figure 2: Global 5G Chipset Market, by Wafer Material Type, 2018-2024
    • Figure 3: Global 5G Chipset Market, by IC Type, 2018-2024
    • Figure 4: Global 5G Chipset Market, by Spectrum Bands, 2018-2024
    • Figure 5: Global 5G Chipset Market, by End Use, 2018-2024
    • Figure 6: Global 5G Chipset Market, by Region, 2018-2024
    • Figure 7: Global 5G Chipset Market Share Analysis, by Company, 2018
    • Figure 8: Global Market Share of Key Strategies Adopted, by Companies, 2014-2018
    • Figure 9: Ericsson, Inc.: Revenue Share, by Business Segment, 2017-2018
    • Figure 10: Fujitsu Ltd.: Revenue Share, by Business Segment, 2017-2018
    • Figure 11: Hewlett Packard Enterprise: Revenue Share, by Business Segment, 2017-2018
    • Figure 12: Huawei Technologies Co. Ltd.: Revenue Share, by Business Segment, 2017-2018
    • Figure 13: Intel Corp.: Revenue Share, by Business Segment, 2017-2018
    • Figure 14: MediaTek, Inc.: Revenue Share, by Business Segment, 2017-2018
    • Figure 15: Qualcomm, Inc.: Revenue Share, by Business Segment, 2017-2018
    • Figure 16: Samsung Electronics Co. Ltd.: Revenue Share, by Business Segment, 2016-2017
    • Figure 17: ZTE Corp.: Revenue Share, by Business Segment, 2017-2018
目次
Product Code: IAS151A

Report Highlights:

This report provides detailed information on companies that BCC Research has identified as market leaders. These companies are selected based on revenue, innovations, strength of product portfolio, regional presence, investment capacity and similar other factors. The report also provides brief information of the global 5G chipset market.

Report Scope:

The scope of this report is focused on selected top ten companies in 5G chipset, and the key areas in the field that are driving industry growth allowing these companies to succeed. BCC also explores its industry structure, noting strategic alliances and acquisitions.

The scope also includes analysis of the 5G Chipset market based on deployment, wafer material, IC type, spectrum banks, end use and regional markets. Revenue forecasts for 2018 through 2023 are provided at global level for these segments. The 5G chipset market is segmented into the following categories -

  • Deployment type: network infrastructure, smart gadgets, smartphones, routers/modems, and others.
  • Wafer material type: GaN (Gallium Nitride)-based chipsets, GaAs (Gallium Arsenide)-based chipsets, InP (Indium Phosphide)-based chipsets, SiN (Silicon Nitride)-based chipsets, Si-based chipsets, and others.
  • IC type: RFIC, ASIC, cellular IC, and mmWave IC.
  • Spectrum bands: <3GHz, >3GHz-5GHz, >5GHz-6GHz, and >6GHz.
  • End use: telecom infrastructure, automotive, building automation, industrial automation, retail, Energy and utilities, consumer electronics, and others.
  • Region: North America is segmented into the U.S., Canada, and Mexico; Europe is segmented into the U.K., France, Germany, and Rest of Europe; the U.K. is further segmented into England, Wales, Scotland, and Northern Ireland; Asia-Pacific (APAC) is segmented into China, Japan, India, and Rest of Asia-Pacific; Middle East and Latin America is segmented into UAE, Brazil, and Rest of Middle East and Latin America.

Estimated values used are based on manufacturers' total revenues. Projected and forecast revenue values are in constant U.S. dollars unadjusted for inflation.

This report covers analyses of the global market trends, with data from 2018 to 2024 with projection of CAGR during 2019 to 2024. Estimated values used are based on manufacturers' total revenues. Projected and forecasted revenue values are in constant US dollars, unadjusted for inflation.

Report Includes:

  • An overview of the top ten 5G chipset industry players
  • Analyses of global 5G chipset market trends, with data from 2018 estimates for 2019, and projections of compound annual growth rates (CAGRs) through 2024
  • Characterization and quantification of global 5G chipset market data in terms of end use, material type, spectrum bands, deployment type and geographical region
  • Detailed profiles of the top 10 companies of the 5G chipset industry and explores the underlying technologies to determine its market status, impact on future market segments, and future growth potential
  • Discussion on products, technology advancements, executives, geographical presence, history and strategies of the 5G chipset companies

Table of Contents

Chapter 1: Introduction

  • Introduction
  • Study Goals and Objectives
  • Reasons for Doing This Study
  • Scope of Report
  • Methodology
  • Geographic Breakdown
  • Intended Audience
  • Analyst's Credentials
  • BCC Custom Research
  • Related BCC Research Reports

Chapter 2: Summary and Highlights

Chapter 3: Market and Technology Background

  • Market Definition and the Evolution of 5G Chipset
  • Future Outlook and Expectations
  • Market Dynamics
    • Drivers
    • Restraints
    • Opportunities

Chapter 4: 5G Chipset Market

  • Introduction
  • Market by Deployment Type
  • Market by Wafer Material Type
  • Market by IC Type
  • Market by Spectrum Bands
  • Market by End Use
  • Market by Region

Chapter 5: Competitive Landscape

  • Market Share Analysis
  • Market Strategy Analysis
  • Key Market Developments
    • Product Launch/Product Development
    • Collaboration/Partnership/Alliance/Geographic Expansion

Chapter 6: Company Profiles

  • ERICSSON, INC.
  • FUJITSU LTD.
  • HEWLETT PACKARD ENTERPRISE
  • HUAWEI TECHNOLOGIES CO. LTD.
  • INTEL CORP.
  • MEDIATEK, INC.
  • NOKIA CORP.
  • QUALCOMM, INC.
  • SAMSUNG ELECTRONICS CO. LTD.
  • ZTE CORP.
Back to Top