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市場調査レポート

高温用途の半導体デバイス:市場機会

Semiconductor Devices for High Temperature Applications: Market Opportunities

発行 BCC Research 商品コード 824928
出版日 ページ情報 英文 198 Pages
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高温用途の半導体デバイス:市場機会 Semiconductor Devices for High Temperature Applications: Market Opportunities
出版日: 2019年04月16日 ページ情報: 英文 198 Pages
概要

世界における高温用途の半導体デバイス市場は、2018年の39億米ドルから、2023年までに94億米ドルへ達すると予測され、2018年から2023年間は19.2%のCAGR (年間複合成長率) が見込まれています。

当レポートでは、世界における高温用途の半導体デバイス市場を調査し、市場・技術の概要、各セグメントおよび地域別による市場分析と予測、市場機会の分析、特許動向、および主要企業のプロファイルなどを提供しています。

第1章 イントロダクション

第2章 サマリー・ハイライト

第3章 市場・技術背景

  • 高温用途半導体デバイスの市場定義・進化
  • 将来の展望・予測
  • 市場力学
  • 高温用途半導体デバイスにおける主な発展
  • キーオピニオンリーダーによる引用
  • バリューチェーン分析

第4章 市場分析:窒化ガリウム (GaN)

  • イントロダクション
  • GaN市場分析:GaN製品別
  • GaN市場分析:ウェハーサイズ別
  • GaN市場分析:用途別

第5章 市場分析:炭化ケイ素 (SiC)

  • イントロダクション
  • SiC市場分析:GaN製品別
  • SiC市場分析:用途別

第6章 市場分析:ヒ化ガリウム (GaAs)

  • イントロダクション
  • GaAs市場分析:ウェハー製造方法別
  • GaAs市場分析:用途別

第7章 市場分析:ダイアモンド半導体基板

  • イントロダクション
  • ダイアモンド半導体基板市場:タイプ別
  • ダイアモンド半導体基板市場:用途別

第8章 市場分析:地域別

  • イントロダクション
  • 北米
  • 欧州
  • アジア太平洋
  • ラテンアメリカ
  • その他

第9章 市場機会の分析

  • GaN・SiC市場の促進要因としての5G・自動車技術の開発
  • ダイアモンドが提供する巨大な機会
  • 石油・ガス産業が提供する成長機会
  • 新興諸国における未開発の機会
  • 市場シェア分析

第10章 特許レビュー・新規開発

第11章 企業プロファイル

  • トップ10サプライヤー
    • CREE INC.
    • 富士通
    • GAN SYSTEMS INC.
    • GENERAL ELECTRIC
    • INFINEON TECHNOLOGIES AG
    • NXP SEMICONDUCTORS NV
    • QORVO INC.
    • RENESAS ELECTRONICS CORP.
    • TEXAS INSTRUMENTS INC.
    • 東芝
  • トップ10バイヤー
    • ALLEGRO MICROSYSTEMS LLC
    • COBHAM PLC
    • LATTICE SEMICONDUCTOR CORP.
    • PULSE ELECTRONICS CORP.
    • SHARP MICROELECTRONICS OF THE AMERICAS
    • SMART MODULAR TECHNOLOGIES (WWH) INC.
    • TDK CORP.
    • VICOR CORP.
  • サプライチェーン参入企業
    • ADVANCED WIRELESS SEMICONDUCTOR COMPANY
    • APPLIED DIAMOND INC.
    • ASCATRON AB
    • AVOGY INC.
    • EFFICIENT POWER CONVERSION CORP.
    • GENESIC SEMICONDUCTOR INC.
    • INTELLIGENT EPITAXY TECHNOLOGY INC.
    • LITTELFUSE INC.
    • NEXGEN POWER SYSTEMS INC.
    • NORSTEL AB
    • ROHM SEMICONDUCTOR
    • 住友電気工業
    • THE DOW CHEMICAL CO.
    • TRANSPHORM INC.
    • UNITED SILICON CARBIDE INC.
図表

List of Tables

  • Summary Table: Global Market for Semiconductor Devices for High-Temperature Applications, by Material Type, Through 2023
    • Table 1: Global Market for GaN Semiconductor Devices for High-Temperature Applications, by Region, Through 2023
    • Table 2: Global Market for GaN Power Semiconductors for High-Temperature Applications, by Type, Through 2023
    • Table 3: Global Market for GaN Power Semiconductors for High-Temperature Applications, by Wafer Size, Through 2023
    • Table 4: Global Market for GaN Power Semiconductors for High-Temperature Applications, by Application, Through 2023
    • Table 5: Global Market for GaN RF Devices for High-Temperature Applications, by Type, Through 2023
    • Table 6: Global Market for GaN RF Devices for High-Temperature Applications, by Wafer Size, Through 2023
    • Table 7: Global Market for GaN RF Devices for High-Temperature Applications, by Application, Through 2023
    • Table 8: Global Market for GaN 2-inch Wafer Size, by GaN Product, Through 2023
    • Table 9: Global Market for GaN 2-inch Wafer Size, by Application, Through 2023
    • Table 10: Global Market for GaN 4-inch Wafer Size, by GaN Product, Through 2023
    • Table 11: Global Market for GaN 4-inch Wafer Size, by Application, Through 2023
    • Table 12: Global Market for GaN 6-inch Wafer Size, by GaN Product, Through 2023
    • Table 13: Global Market for GaN 6-inch Wafer Size, by Application, Through 2023
    • Table 14: Global Market for GaN 8-inch Wafer Size, by GaN Product, Through 2023
    • Table 15: Global Market for GaN 8-inch Wafer Size, by Application, Through 2023
    • Table 16: Global Market for GaN Applications in Information and Communication Technology, by GaN Product, Through 2023
    • Table 17: Global Market for GaN Applications in Information and Communication Technology, by Wafer Size, Through 2023
    • Table 18: Global Market for GaN Applications in Automotive, by GaN Product, Through 2023
    • Table 19: Global Market for GaN Applications in Automotive, by Wafer Size, Through 2023
    • Table 20: Global Market for GaN Applications in Consumer Electronics, by GaN Product, Through 2023
    • Table 21: Global Market for GaN Applications in Consumer Electronics, by Wafer Size, Through 2023
    • Table 22: Global Market for GaN Applications in Defense and Aerospace, by GaN Product, Through 2023
    • Table 23: Global Market for GaN Applications in Defense and Aerospace, by Wafer Size, Through 2023
    • Table 24: Global Market for GaN Applications in Industry and Medicine, by GaN Product, Through 2023
    • Table 25: Global Market for GaN Applications in Industry and Medicine, by Wafer Size, Through 2023
    • Table 26: Global Market for GaN in Other Applications, by GaN Product, Through 2023
    • Table 27: Global GaN Market for Other Applications, by Wafer Size, Through 2023
    • Table 28: Global Market for SiC Semiconductor Devices for High-Temperature Applications, by Region, Through 2023
    • Table 29: Global Market for Black Silicon Carbide, by SiC Application, Through 2023
    • Table 30: Global Market for Green Silicon Carbide, by SiC Application, Through 2023
    • Table 31: Global Market for Other SiC Products, by SiC Application, Through 2023
    • Table 32: Global Market for SiC Applications in Power Electronics and Semiconductors, by SiC Product, Through 2023
    • Table 33: Global Market for SiC Applications in Steel and Energy, by SiC Product, Through 2023
    • Table 34: Global Market for SiC Applications in Automotive, by SiC Product, Through 2023
    • Table 35: Global Market for SiC Applications in Aerospace and Aviation, by SiC Product, Through 2023
    • Table 36: Global Market for SiC Applications in the Military and Defense Industry, by SiC Product, Through 2023
    • Table 37: Global Market for SiC Applications in Medical and Healthcare, by SiC Product, Through 2023
    • Table 38: Global Market for SiC in Other Applications, by SiC Product, Through 2023
    • Table 39: Global Market for GaAs Semiconductor Devices for High-Temperature Applications, by Region, Through 2023
    • Table 40: Global Market for the GaAs Liquid-Encapsulated Czochralski Wafer Technique, by Application, Through 2023
    • Table 41: Global Market for the GaAs Vertical Gradient Freeze Wafer Technique, by Application, Through 2023
    • Table 42: Global Market for the GaAs MBE Wafer Technique, by Application, Through 2023
    • Table 43: Global Market for the GaAs Metal-Organic Vapor Phase Epitaxy Wafer Technique, by Application, Through 2023
    • Table 44: Global Market for Other GaAs Wafers, by Application, Through 2023
    • Table 45: Global Market for GaAs in Mobile Devices, by Wafer Production Method, Through 2023
    • Table 46: Global Market for GaAs in Photovoltaic Devices, by Wafer Production Method, Through 2023
    • Table 47: Global Market for GaAs in Wireless Communication, by Wafer Production Method, Through 2023
    • Table 48: Global Market for GaAs in Optoelectronic Devices, by Wafer Production Method, Through 2023
    • Table 49: Global Market for GaAs in Aerospace and Defense, by Wafer Production Method, Through 2023
    • Table 50: Global Market for GaAs in Other Applications, by Wafer Production Method, Through 2023
    • Table 51: Global Market for Diamond Semiconductor Substrate for High-Temperature Applications, by Region, Through 2023
    • Table 52: Global Market for Natural Diamond Semiconductor Substrate, by Application, Through 2023
    • Table 53: Global Market for Synthetic Diamond Semiconductor Substrate, by Application, Through 2023
    • Table 54: Global Market for Healthcare Applications of Diamond Semiconductor Substrate, by Type, Through 2023
    • Table 55: Global Market for Consumer Electronics Applications of Diamond Semiconductor Substrate, by Type, Through 2023
    • Table 56: Global Market for Construction and Mining Applications of Diamond Semiconductor Substrate, by Type, Through 2023
    • Table 57: Global Market for Other Applications of Diamond Semiconductor Substrate, by Type, Through 2023
    • Table 58: North American Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2023
    • Table 59: North American Market for Semiconductor Devices for High-Temperature Applications, by Type, Through 2023
    • Table 60: European Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2023
    • Table 61: European Market for Semiconductor Devices for High-Temperature Applications, by Type, Through 2023
    • Table 62: Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2023
    • Table 63: Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Type, Through 2023
    • Table 64: Latin American Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2023
    • Table 65: Latin American Market for Semiconductor Devices for High-Temperature Applications, by Type, Through 2023
    • Table 66: Rest of the World Market for Semiconductor Devices for High-Temperature Applications, by Country, Through 2023
    • Table 67: Rest of the World Market for Semiconductor Devices for High-Temperature Applications, by Type, Through 2023
    • Table 68: Market Share Analysis of Semiconductor Devices for High-Temperature Applications, 2017
    • Table 69: High-Voltage Semiconductor Device
    • Table 70: Temperature Sensing Semiconductor Device
    • Table 71: High-Tech Temperature Control Device for Semiconductor Manufacturing Facility
    • Table 72: Semiconductor Device Having Temperature Sensor Circuits
    • Table 73: Temperature Sensor Circuit and Semiconductor Device Including Temperature Sensor Circuit
    • Table 74: Aluminum Nitride Electrostatic Chuck Used in High-Temperature and High Plasma Power Density Semiconductor Manufacturing Process
    • Table 75: Semiconductor Device Including a Temperature Sensor Circuit
    • Table 76: Semiconductor Device with Temperature Detecting Diode
    • Table 77: Semiconductor Device and Temperature Sensor System
    • Table 78: Semiconductor Switch with Integrated Temperature Sensor
    • Table 79: Method for Manufacturing Semiconductor Substrate, Method for Manufacturing Semiconductor Device, Semiconductor Substrate, and Semiconductor Device
    • Table 80: Semiconductor Device Having a Positive Temperature Coefficient Structure
    • Table 81: Power Up of Semiconductor Device Having a Temperature Circuit and Method Therefore
    • Table 82: Power Semiconductor Device with Temperature Protection
    • Table 83: Low Temperature Formation of High-Quality Silicon Oxide Films in Semiconductor Device Manufacturing
    • Table 84: Temperature Estimation Device and Semiconductor Device
    • Table 85: High-Tech Temperature Control Device of Semiconductor Manufacturing Equipment
    • Table 86: Semiconductor Device
    • Table 87: Light- and Temperature-Sensitive Semiconductor Sensor
    • Table 88: Remote Communication and Powered Sensing/Control/Identification Devices Using High-Temperature Compatible Semiconductor Materials
    • Table 89: Improving Life of a Semiconductor by Reducing Temperature Changes Therein via Switching Frequency
    • Table 90: Semiconductor Device, Temperature Sensor and Power Supply Voltage Monitor
    • Table 91: Semiconductor Device and Semiconductor Module
    • Table 92: Semiconductor Device and Semiconductor Device Package Including the Same
    • Table 93: Semiconductor Device with Structure with Positive Temperature Coefficient
    • Table 94: High-Frequency Semiconductor Device
    • Table 95: High Frequency Semiconductor Module
    • Table 96: Semiconductor Device
    • Table 97: High-Temperature Ceramic Socket Configured to Test Packaged Semiconductor Device
    • Table 98: Package for High-Frequency Semiconductor and High-Frequency Semiconductor Device
    • Table 99: Developments at Cree Inc., 2018
    • Table 100: Developments at Fujitsu Ltd., 2017 and 2018
    • Table 101: Developments at GaN Systems Inc., 2018
    • Table 102: Developments at General Electric, 2017
    • Table 103: Developments at Infineon Technologies AG, 2016 and 2018
    • Table 104: Developments at NXP Semiconductor, 2018
    • Table 105: Developments at Qorvo Inc., 2018
    • Table 106: Developments at Renesas Electronics Corp., 2018
    • Table 107: Developments at Texas Instruments Inc., 2018
    • Table 108: Developments at Toshiba Corp., 2017
    • Table 109: Developments at Allegro MicroSystems LLC, 2018
    • Table 110: Developments at Cobham PLC, 2016
    • Table 111: Developments at Lattice Semiconductor Corp., 2016 and 2017
    • Table 112: Developments at Pulse Electronics Corp., 2018
    • Table 113: Developments at Sharp Microelectronics of the Americas, 2016
    • Table 114: Developments at SMART Modular Technologies Inc.,2016, 2017 and 2018
    • Table 115: Developments at TDK Corp., 2017 and 2018
    • Table 116: Developments at Vicor Corp., 2018
    • Table 117: Developments at Ascatron AB, 2017
    • Table 118: Developments at EPC Corp., 2018
    • Table 119: Developments at Littelfuse Inc., 2018
    • Table 120: Developments at NexGen Power Systems Inc., 2018
    • Table 121: Developments at Norstel AB, 2017
    • Table 122: Developments at ROHM Semiconductor,2017 and 2018
    • Table 123: Developments at Sumitomo Electric Semiconductor Materials Inc., 2017 and 2018
    • Table 124: Developments at Transphorm Inc., 2018
    • Table 125: Developments at United Silicon Carbide Inc., 2016, 2017 and 2018

List of Figures

  • Summary Figure: Global Market for Semiconductor Devices for High-Temperature Applications, by Material Type, 2017-2023
    • Figure 1: Value Chain for Semiconductor Devices for High-Temperature Applications
    • Figure 2: Global Market for GaN Semiconductor Devices for High-Temperature Applications, by Region, 2017-2023
    • Figure 3: Global Market for GaN Power Semiconductors for High-Temperature Applications, by Type, 2017-2023
    • Figure 4: Global Market for GaN Power Semiconductors for High-Temperature Applications, by Wafer Size, 2017-2023
    • Figure 5: Global Market for GaN Power Semiconductors for High-Temperature Applications, by Application, 2017-2023
    • Figure 6: Global Market for GaN RF Devices for High-Temperature Applications, by Type, 2017-2023
    • Figure 7: Global Market for GaN RF Devices for High-Temperature Applications, by Wafer Size, 2017-2023
    • Figure 8: Global Market for GaN RF Devices for High-Temperature Applications, by Application, 2017-2023
    • Figure 9: Global Market for GaN 2-inch Wafer Size, by GaN Products, 2017-2023
    • Figure 10: Global Market for GaN 2-inch Wafer Size, by Application, 2017-2023
    • Figure 11: Global Market for GaN 4-inch Wafer Size, by GaN Product, 2017-2023
    • Figure 12: Global Market for GaN 4-inch Wafer Size, by Application, 2017-2023
    • Figure 13: Global Market for GaN 6-inch Wafer Size, by GaN Product, 2017-2023
    • Figure 14: Global Market for GaN 6-inch Wafer Size, by Application, 2017-2023
    • Figure 15: Global Market for GaN 8-inch Wafer Size, by GaN Product, 2017-2023
    • Figure 16: Global Market for GaN 8-inch Wafer Size, by Application, 2017-2023
    • Figure 17: Global Market for GaN Applications in Information and Communication Technology, by GaN Product, 2017-2023
    • Figure 18: Global Market for GaN Applications in Information and Communication Technology, by Wafer Size, 2017-2023
    • Figure 19: Global Market for GaN Applications in Automotive, by GaN Product, 2017-2023
    • Figure 20: Global Market for GaN Applications in Automotive, by Wafer Size, 2017-2023
    • Figure 21: Global Market for GaN Applications in Consumer Electronics, by GaN Product, 2017-2023
    • Figure 22: Global Market for GaN Applications in Consumer Electronics, by Wafer Size, 2017-2023
    • Figure 23: Global Market for GaN Applications in Defense and Aerospace, by GaN Product, 2017-2023
    • Figure 24: Global Market for GaN Applications in Defense and Aerospace, by Wafer Size, 2017-2023
    • Figure 25: Global Market for GaN Applications in Industry and Medicine, by GaN Product, 2017-2023
    • Figure 26: Global Market for GaN Applications in Industry and Medicine, by Wafer Size, 2017-2023
    • Figure 27: Global Market for GaN in Other Applications, by GaN Products, 2017-2023
    • Figure 28: Global GaN Market for Other Applications, by Wafer Size, 2017-2023
    • Figure 29: Global Market for SiC Semiconductor Devices for High-Temperature Applications, by Region, 2017-2023
    • Figure 30: Global Market for Black Silicon Carbide, by SiC Application, 2017-2023
    • Figure 31: Global Market for Green Silicon Carbide, by SiC Application, 2017-2023
    • Figure 32: Global Market for Other SiC Products, by SiC Application, 2017-2023
    • Figure 33: Global Market for SiC Applications in Power Electronics and Semiconductors, by SiC Product, 2017-2023
    • Figure 34: Global Market for SiC Applications in Steel and Energy, by SiC Product, 2017-2023
    • Figure 35: Global Market for SiC Applications in Automotive, by SiC Product, 2017-2023
    • Figure 36: Global Market for SiC Applications in Aerospace and Aviation, by SiC Product, 2017-2023
    • Figure 37: Global Market for SiC Applications in the Military and Defense Industry, by SiC Product, 2017-2023
    • Figure 38: Global Market for SiC Applications in Medical and Healthcare, by SiC Product, 2017-2023
    • Figure 39: Global Market for SiC in Other Applications, by SiC Product, 2017-2023
    • Figure 40: Global Market for GaAs Semiconductor Devices for High-Temperature Applications, by Region, 2017-2023
    • Figure 41: Global Market for the GaAs Liquid-Encapsulated Czochralski Wafer Technique, by Application, 2017-2023
    • Figure 42: Global Market for the GaAs Vertical Gradient Freeze Wafer Technique, by Application, 2017-2023
    • Figure 43: Global Market for GaAs MBE Wafer Technique, by Application, 2017-2023
    • Figure 44: Global Market for the GaAs Metal-Organic Vapor Phase Epitaxy Wafer Technique, by Application, 2017-2023
    • Figure 45: Global Market for Other GaAs Wafers, by Application, 2017-2023
    • Figure 46: Global Market for GaAs in Mobile Devices, by Wafer Production Method, 2017-2023
    • Figure 47: Global Market for GaAs in Photovoltaic Devices, by Wafer Production Method, 2017-2023
    • Figure 48: Global Market for GaAs in Wireless Communications, by Wafer Production Method, 2017-2023
    • Figure 49: Global Market for GaAs in Optoelectronic Devices, by Wafer Production Method, 2017-2023
    • Figure 50: Global GaAs Market for GaAs in Aerospace and Defense, by Wafer Production Method, 2017-2023
    • Figure 51: Global Market for GaAs in Other Applications, by Wafer Production Method, 2017-2023
    • Figure 52: Global Market for Diamond Semiconductor Substrate for High-Temperature Applications, by Region, 2017-2023
    • Figure 53: Global Market for Natural Diamond Semiconductor Substrate, by Application, 2017-2023
    • Figure 54: Global Market for Synthetic Diamond Semiconductor Substrate, by Application, 2017-2023
    • Figure 55: Global Market for Healthcare Applications of Diamond Semiconductor Substrate, by Type, 2017-2023
    • Figure 56: Global Market for Consumer Electronics Applications of Diamond Semiconductor Substrate, by Type, 2017-2023
    • Figure 57: Global Market for Construction and Mining Applications of Diamond Semiconductor Substrate, by Type, 2017-2023
    • Figure 58: Global Market for Other Applications of Diamond Semiconductor Substrate, by Type, 2017-2023
    • Figure 59: North American Market for Semiconductor Devices for High-Temperature Applications, by Country, 2017-2023
    • Figure 60: North American Market for Semiconductor Devices for High-Temperature Applications, by Type, 2017-2023
    • Figure 61: European Market for Semiconductor Devices for High-Temperature Applications, by Country, 2017-2023
    • Figure 62: European Market for Semiconductor Devices for High-Temperature Applications, by Type, 2017-2023
    • Figure 63: European Market for Semiconductor Devices for High-Temperature Applications, by Type, 2017-2023
    • Figure 64: Asia-Pacific Market for Semiconductor Devices for High-Temperature Applications, by Type, 2017-2023
    • Figure 65: Latin American Market for Semiconductor Devices for High-Temperature Applications, by Country, 2017-2023
    • Figure 66: Latin American Market for Semiconductor Devices for High-Temperature Applications, by Type, 2017-2023
    • Figure 67: Rest of the World Market for Semiconductor Devices for High-Temperature Applications, by Country, 2017-2023
    • Figure 68: Rest of the World Market for Semiconductor Devices for High-Temperature Applications, by Type, 2017-2023
    • Figure 69: Shares of Patents Related to Semiconductor Devices for High-Temperature Applications, by Year, 2013-2017
    • Figure 70: Shares of Patents Related to Semiconductor Devices for High-Temperature Applications, by Region, 2015-2017
目次
Product Code: SMC114A

Report Highlights:

The global market for semiconductor devices for high-temperature applications should grow from $3.9 billion in 2018 to $9.4 billion by 2023 with a compound annual growth rate (CAGR) of 19.2% for the period of 2018-2023.

Silicon carbide market should grow from $1.4 billion in 2018 to $3.2 billion by 2023 with a CAGR of 18.3% for the period of 2018-2023.

Gallium nitride market should grow from $1.3 billion in 2018 to $2.9 billion by 2023 with a CAGR of 18.6% for the period of 2018-2023.

Report Scope:

The market for semiconductor devices used in high-temperature applications is segmented into categories by -

  • Type: GaN, SiC, GaAs, and diamond semiconductor substrate.
  • GaN product: power semiconductors and GaN radio frequency (RF) devices.
  • GaN wafer size: 2-inch, 4-inch, 6-inch, and 8-inch wafer sizes.
  • GaN application: information and communication technology, automotive, consumer electronics, defense and aerospace, and others.
  • SiC products: black silicon carbide, green silicon carbide and others.
  • SiC application: electronics and semiconductors, steel and energy, automotive, aerospace and aviation, military and defense, medical and healthcare, and others.
  • GaAs wafer production method: vertical gradient freeze (VGF), liquid-encapsulated Czochralski (LEC), molecular beam epitaxy (MBE), metal-organic vapor phase epitaxy (MOVPE), and others.
  • GaAs application: mobile devices, photovoltaic devices, wireless communication, optoelectronic devices, aerospace and defense, and others.
  • Diamond semiconductor substrate type: natural and synthetic.
  • Diamond semiconductor substrate application: healthcare, consumer electronics, construction and mining, and others.
  • Region: North America is segmented into the U.S., Canada and Mexico; Europe is segmented into the U.K., Germany, Italy, Russia, and the other Commonwealth Independent States; Asia-Pacific is segmented into China, Japan, India, and the rest of Asia-Pacific; Latin America covers Brazil and the rest of Latin America; and the Rest of the World (RoW) covers the Middle East and Africa.
  • In addition to industry and competitive analyses of the semiconductor devices for high-temperature applications market, this report also provides an exhaustive patent analysis and company profiles for key players active in the global market.

Report Includes:

  • 69 data tables and 57 additional tables
  • An overview of the global markets and applications of high temperature semiconductor devices
  • Analyses of market trends, with data from 2017, 2018, and projections of compound annual growth rates (CAGRs) through 2023
  • Explanation of drivers, restraints, key developments and future outlook of the high temperature semiconductor devices industry
  • Description of Gallium Nitride (GaN), Silicon Carbide (SiC), and Gallium Arsenide (GaAs); their products and application
  • Detailed profiles of the major players in the market, including Cree Inc., Infineon Technologies Ag, Allegro Microsystems Llc, Smart Modular Technologies (WWH) Inc., Genesic Semiconductor Inc., The Dow Chemical Co., and United Silicon Carbide Inc.

Table of Contents

Chapter 1: Introduction

  • Study Goals and Objectives
  • Reasons for Doing This Study
  • Scope of Report
  • Research Methodology
  • Intended Audience
  • Information Sources
  • Geographic Breakdown
  • Analyst's Credentials
  • BCC Custom Research
  • Related BCC Research Reports

Chapter 2: Summary and Highlights

Chapter 3: Market and Technology Background

  • Market Definition and Evolution of Semiconductor Devices for High-Temperature Applications
  • Future Outlook and Expectations
  • Market Dynamics
    • Drivers
    • Restraints
  • Key Developments in Semiconductor Devices for High-Temperature Applications
    • Gallium Nitride
    • Silicon Carbide
    • Gallium Arsenide
    • Diamond
  • Quotes by Key Opinion Leaders
  • Value Chain Analysis
    • Raw Materials
    • Components
    • Design and Conception
    • Manufacture
    • Assembly, Packaging and Testing
    • Customer Service

Chapter 4: Market Breakdown by Gallium Nitride

  • Introduction
  • GaN Market Breakdown by GaN Product
    • Power Semiconductors
    • Schottky Diodes
    • High Electron Mobility Transistors
    • Integrated Circuits
    • GaN-on-Si
    • GaN RF Devices
    • HEMTs
    • GaN-based ICs
    • GaN-based Opto-semiconductors
  • GaN Market Breakdown by Wafer Size
    • 2-inch Wafer Size
    • 4-inch Wafer Size
    • 6-inch Wafer Size
    • 8-inch Wafer Size
  • GaN Market Breakdown by Application
    • Information and Communication Technology Applications
    • Automotive Applications
    • Consumer Electronics Applications
    • Defense and Aerospace Applications
    • Industrial and Medical Applications
    • Other Applications

Chapter 5: Market Breakdown by Silicon Carbide

  • Introduction
  • SiC Market Breakdown by SiC Product
    • Black Silicon Carbide
    • Green Silicon Carbide
    • Other Materials
  • SiC Market Breakdown by Application
    • Power Electronics and Semiconductor Applications
    • Steel and Energy Applications
    • Automotive Applications
    • Aerospace and Aviation Applications
    • Military and Defense Applications
    • Medical and Healthcare Applications
    • Other Applications

Chapter 6: Market Breakdown by GaAs

  • Introduction
  • GaAs Market Breakdown by Wafer Production Method
    • Liquid-Encapsulated Czochralski Method
    • Vertical Gradient Freeze Method
    • Molecular Beam Epitaxy
    • Metal-Organic Vapor Phase Epitaxy
    • Other Methods
  • GaAs Market Breakdown by Application
    • Mobile Devices
    • Photovoltaic Devices
    • Wireless Communications
    • Optoelectronic Devices
    • Aerospace and Defense Applications
    • Other Applications

Chapter 7: Market Breakdown by Diamond Semiconductor Substrate

  • Introduction
  • Diamond Semiconductor Substrate Market by Type
    • Natural Diamond
    • Synthetic Diamond
  • Diamond Semiconductor Substrate Market by Application
    • Healthcare Applications
    • Consumer Electronics
    • Construction and Mining Applications
    • Other Applications

Chapter 8: Market Breakdown by Region

  • Introduction
  • North America
    • Market Snapshot
  • Europe
    • Market Snapshot
  • Asia-Pacific
    • Market Snapshot
  • Latin America
    • Market Snapshot
  • Rest of the World
    • Market Snapshot

Chapter 9: Analysis of Market Opportunities

  • Development of 5G and Automotive Technology as Drivers of the GaN and SiC Markets
  • Huge Opportunities Offered by Diamond
  • Growth Opportunities Offered by the Oil and Gas Industry
  • Untapped Opportunities in Developing Countries
  • Market Share Analysis

Chapter 10: Patent Review and New Developments

  • Patent Review by Year and Country
  • Important Patents for Semiconductor Devices for High-Temperature Applications

Chapter 11: Company Profiles

  • Top Ten Suppliers
  • CREE INC.
  • FUJITSU LTD.
  • GAN SYSTEMS INC.
  • GENERAL ELECTRIC
  • INFINEON TECHNOLOGIES AG
  • NXP SEMICONDUCTORS NV
  • QORVO INC.
  • RENESAS ELECTRONICS CORP.
  • TEXAS INSTRUMENTS INC.
  • TOSHIBA CORP.
  • Top Ten Buyers
  • ALLEGRO MICROSYSTEMS LLC
  • COBHAM PLC
  • LATTICE SEMICONDUCTOR CORP.
  • PULSE ELECTRONICS CORP.
  • SHARP MICROELECTRONICS OF THE AMERICAS
  • SMART MODULAR TECHNOLOGIES (WWH) INC.
  • TDK CORP.
  • VICOR CORP.
  • Supply Chain Participants
  • ADVANCED WIRELESS SEMICONDUCTOR COMPANY
  • APPLIED DIAMOND INC.
  • ASCATRON AB
  • AVOGY INC.
  • EFFICIENT POWER CONVERSION CORP.
  • GENESIC SEMICONDUCTOR INC.
  • INTELLIGENT EPITAXY TECHNOLOGY INC.
  • LITTELFUSE INC.
  • NEXGEN POWER SYSTEMS INC.
  • NORSTEL AB
  • ROHM SEMICONDUCTOR
  • SUMITOMO ELECTRIC SEMICONDUCTOR MATERIALS INC.
  • THE DOW CHEMICAL CO.
  • TRANSPHORM INC.
  • UNITED SILICON CARBIDE INC.
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