Product Code: SMC103B
Report Highlights:
The global market for printed circuit board should grow from $64.6 billion in 2018 to reach $75.8 billion by 2023 at a compound annual growth rate (CAGR) of 3.2% for the period of 2018-2023.
Asia-Pacific market for printed circuit board reached $44.7 billion in 2018 and should reach $54.0 billion by 2023 at a CAGR of 3.8% for the period of 2018-2023.
North American market for printed circuit board reached $11.3 billion in 2018 and should reach $12.6 billion by 2023 at a CAGR of 2.2% for the period of 2018-2023.
Report Scope:
The market scope is defined through consideration of various end-user applications, including mobile phones and tablets, networking devices, instrumentation and scientific research, healthcare, defense, surveillance and aviation, energy, consumer electronics, computing and storage, industrial, automotive and transportation, and retail. Market estimates are classified on the basis of PCB types and geographic regions. Various types of PCBs covered in this report are one-to two-layer rigid, multilayer rigid, microvia or high-density interconnects (HDI), flex, and Rigid flex.
Report Includes:
- An overview of the global market for Printed Circuit Board (PCB)
- Analyses of global market trends, with data from 2017, estimates for 2018 and projections of CAGRs through 2023
- Definition, types and characteristics of PCB adoption in end applications
- Discussion of the influence of internet of things (IoT), automotive and manufacturing sectors to the growth of PCB industry
- Company profiles of major players in the market, including Nippon Mektron, Zhen Ding Technology Holding Limited, TTM Technologies, Young Poong Electronics Co., Ltd., Unimicron Technology Corp., and Samsung Electro-Mechanics
Table of Contents
Chapter 1: Introduction
- Introduction
- Study Goals and Objectives
- Reasons for Doing This Study
- Intended Audience
- Scope of Report
- Research Methodology
- Geographic Breakdown
- Analysts' Credentials
- BCC Custom Research
- Related BCC Research Reports
Chapter 2: Summary and Highlights
Chapter 3: Market Overview
- Introduction
- Definitions
- Application-Specific Integrated Circuits
- Application-Specific Standard Products
- BiCMOS
- Complementary Metal Oxide Semiconductor
- Double Data Rate Synchronous Dynamic Random-Access Memory
- Design for Manufacturability
- Design for Test
- Dual Inline Package
- Dynamic Random-Access Memory
- Design Rule Check
- Digital Signal Processor
- Electronic Design Automation
- Etching
- Lamination
- Field Programmable Gate Array
- Logical View and Netlist
- Low-Voltage Differential Signaling
- Layout Versus Schematic
- Programmable Logic Device
- Polyester Substrates
- Restriction on Hazardous Substances
- Roll-To-Roll Processing
- Register-Transfer Level
- Single In-Line Pin Package
- Small Outline Dual Inline Memory Module
- Silicon on Insulator
- Static Random-Access Memory
- Substrates
- Physical Properties of Substrates
- Substrate Types
- Transistor-Transistor Logic
- PCB and Packaging
- Chip-scale Package/Wafer Level Package
- Multichip Module
- System in Package
- Ball Grid Array
- Flip Chip
- Package on Package
- Price Trend Analysis
- Current Market Scenario
- Market Dynamics
- Drivers
- Restraints
- Opportunities
Chapter 4: Market Breakdown by Type
- Introduction
- One-to-Two-Layer Rigid
- Multilayer Rigid
- Microvia
- Flex
Chapter 5: Market Breakdown by End-User Application
- Introduction
- Networking Devices
- Healthcare
- Defense, Surveillance, and Aviation
- Energy
- Consumer Electronics
- Computing and Storage
- Industrial
- Automotive and Transportation
- Retail
Chapter 6: Market Breakdown by Region
- Introduction
- North America
- Europe
- Asia-Pacific
- Rest of World
Chapter 7: Competitive Landscape
- Market Share Analysis
- Key Market Developments
- Stakeholder Analysis
- Material Specialists
- Dedicated PCB Makers
- Integrated PCB Makers
- End-User Companies
- Computing Technology Specialists
- Measurement Specialists
Chapter 8: Company Profiles
- AT&S
- Company Overview
- Financials
- Products
- ADVANCED CIRCUITS
- Company Overview
- AGY
- Company Overview
- COMPEQ
- Company Overview
- Financials
- Products
- DYNAMIC ELECTRONICS CO., LTD.
- EVERETT CHARLES TECHNOLOGIES (XCERRA CORP.)
- MEIKO ELECTRONICS CO., LTD.
- NAN YA PCB CORP.
- Company Overview
- Financials
- Products
- SAMSUNG ELECTRO-MECHANICS
- Company Overview
- Financials
- Products
- SHENGYI TECHNOLOGY CO., LTD.
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- SUMITOMO ELECTRIC INDUSTRIES LTD.
- TRIPOD
- Company Overview
- Products
- TTM TECHNOLOGIES
- Company Overview
- Financials
- Products
- UNIMICRON TECHNOLOGY CORP.
- Company Overview
- Financials
- Products
- ZHEN DING TECHNOLOGY HOLDING LTD.
- Company Overview
- Financials
- Products
フレキシブルプリント回路基板 (FPC) の世界市場
フレキシブルプリント回路基板 (FPCB) の世界市場
世界におけるプリント基板 (PCB) 市場の考察、機会、分析、市場シェア、予測
電子部品用接着剤の世界市場の分析・予測 (2017-2027年)：形態・タイプ (導電性・熱伝導性・UV硬化型)・用途別
電子接着剤の世界市場 〜2020年 - 形状 (液体、固形、ペースト)、種類 (導電性、熱伝導性、紫外線硬化性)、用途 (プリント基板、半導体・IC)、地域別の予測
フォトレジスト (g線およびi線、KrF、ArFドライ、液浸ArF)、およびフォトレジスト補助剤 (反射防止コーティング、フォトレジスト現像液、端面洗浄剤、その他) の世界市場： 半導体およびIC、プリント基板、ならびにその他の用途向け - 業界分析、市場規模、市場シェア、成長度、市場動向、ならびに将来予測
