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電子部品におけるプラスチック:技術および世界市場

Plastics in Electronics Components: Technologies and Global Markets

発行 BCC Research 商品コード 232001
出版日 ページ情報 英文 177 Pages
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電子部品におけるプラスチック:技術および世界市場 Plastics in Electronics Components: Technologies and Global Markets
出版日: 2017年09月26日 ページ情報: 英文 177 Pages
概要

世界の電子部品市場は2016年に重量ベースで39億ポンドに達しました。同市場は2017年から2022年にかけて7.7%のCAGR (年間複合成長率) で推移し、2017年の42億ポンドから2020年までには約61億ポンドへ拡大する見込みです。

当レポートでは、世界の電子部品用プラスチック市場とその技術について調査し、電子部品に使用されるポリマーとその開発動向、電子部品製品、特許、業界動向および技術動向の分析を提供しており、主要企業のプロファイルなどをまとめ、お届けいたします。

第1章 イントロダクション

第2章 サマリー・ハイライト

第3章 市場・技術背景

  • 概要
  • 電子デバイス市場の概要
  • コンピューター
  • エレクトロニクスディスプレイ
  • プリンター
  • 「オールインワン」マシン
  • 電話
  • ファクス
  • スキャナー
  • モバイル電子デバイス
  • 自動車市場

第4章 市場分析:技術種類別

  • 概要
  • ポリマーの種類
  • 熱可塑性物質
    • 標準ナイロン
    • 熱可塑性ポリマー
    • ポリフェニレンサルファイド
    • ポリイミド
    • ポリカーボネート
    • ポリフタルアミド・その他の高温ナイロン
    • 液晶ポリマー
    • スルホンポリマー
    • 合金/混合
    • フルオロポリマー
    • ポリアリールエーテルケトン
    • 環状オレフィンコポリマー (COC)
    • 熱可塑性物質市場の推計・予測サマリー
  • 熱硬化性樹脂
    • 概要
    • 一般的な特徴
    • エポキシ樹脂
    • ポリウレタン
    • フェノール類
    • 不飽和ポリエステル
    • フタル酸ジアリル
    • BTエポキシ樹脂・シアン酸エステル
    • 熱硬化性樹脂市場の推計・予測サマリー

第5章 主要部品・プリント基板 (PCB) ・カプセル材料の概要

  • イントロダクション
  • 本調査の注目点
  • 樹脂の消費
    • 背景
    • 市場
    • 成長
    • 成長促進因子
  • プリント基板 (PCB)
    • 概要
    • ラミネートの特性要件
    • 物理組成
    • アセンブリー技術
    • PCB基板
    • PCBに使用される特定ポリマー
    • PCBに使用されるその他の材料、ほか
  • カプセル材料
    • 定義・背景
    • カプセル材料の主な目的
    • エポキシカプセル化フォーミュレーション
    • カプセル化電気・電子部品
    • エポキシカプセル材料システム
    • シリコンカプセル材料
    • 熱可塑性物質カプセル材料
    • 主なカプセル材料メーカーとその製品ライン
    • 市場推計・予測

第5章 成形電子部品

  • 概要
    • 背景
    • 使用ポリマー
    • 市場成長促進因子
  • コネクター
    • 背景
    • 動向
    • アプリケーション
    • マテリアルの選定
    • 難燃性
    • コネクター関連の規格
    • メーカー
    • エンドユーズ市場
    • 市場推計・予測
  • スイッチ
    • 背景
    • 市場推計・予測
  • コイルフォーマー
    • 背景
    • メーカー
    • 市場推計・予測
  • リレー
    • 背景
    • 市場推計・予測
  • コンデンサー
    • 背景
    • アプリケーション
    • コンデンサー材料
    • 消費:市場セグメント別
    • 市場推計・予測
  • その他の成形電子部品
    • レジスター
    • 市場推計・予測
  • 市場推計・予測のサマリー

第7章 特許レビュー/新規開発

  • 背景
  • 微細化の重要性
  • 薄壁型電子部品
  • フレキシブルエレクトロニクス
  • ウェアラブルエレクトロニクス
  • IoE (Internet of Everything)
  • 樹脂の選択に影響を及ぼす電子部品メーカーの変化
  • 業界関連の最新の特許

第8章 電子部品産業の概要・プラスチックメーカー

  • 主要な半導体メーカー・顧客
  • 製造・マーケティングの側面
  • プラスチックメーカー
  • 材料種類によるポリマーメーカー

第9章 環境問題

  • 概要
  • プリント基板 (PCB) の廃棄
  • ブロミンフリーのプリント基板 (PCB)
  • ハロゲンフリーの熱可塑性物質向け難燃剤
  • リサイクル
  • 電子産業のインターフェース

第10章 電子部品関連のパフォーマンス要件

  • 概要
  • 可燃性基準
  • 可燃性検査
  • その他の基準

第11章 主要企業のプロファイル

BCC Researchについて

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目次
Product Code: PLS027E

Report Highlights

The global electronics components market reached nearly 3.9 billion pounds in 2016. This market is estimated to reach nearly 6.1 billion pounds in 2022 from 4.2 billion pounds in 2017 at a compound annual growth rate (CAGR) of 7.7% for 2017-2022.

Report Includes:

  • An overview of the global market for plastics in electronic components
  • Analyses of global market trends, with data from 2016, estimates for 2017, and projections of compound annual growth rates (CAGRs) through 2022
  • Information about pricing of resins, molders of electronic components, testing agencies, and requirements related to electronic components
  • Coverage of single devices, such as connectors, capacitors, switches, bobbins, multiple-component devices such as printed circuit boards and interconnects, and encapsulants.
  • Comprehensive company profiles of major players in the industry

Report Scope

This study covers all electronics components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures.

The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronics components, and it looks at interpolymer competition.

Analyst Credentials

Andrew McWilliams spent more than 25 years as a consultant with Ernst & Young, McKinsey & Company and A.T. Kearny focused on manufacturing before segueing into research analysis. He has been covering myriad technology categories for BCC Research for more than 15 years. McWilliams has a BA from Princeton University and an MA from Harvard University. He has worked in more than 40 countries and he resides in the greater Boston area.

Table of Contents

Chapter 1: Introduction

  • Study Goals and Objectives
  • Reasons for Doing This Study
  • Scope of Report
  • Information Sources
  • Methodology
  • Geographic Breakdown
  • Analyst's Credentials
  • Related BCC Research Reports

Chapter 2: Summary and Highlights

Chapter 3: Market and Technology Background

  • Overview
  • Snapshot of the Electronics Device Market
  • Computers
    • Overview
    • Desktops
  • Electronics Displays
    • Background
  • Printers
    • Overview
    • Inkjet Printers
    • Monochrome Laser Printers
    • Color Laser Printers
    • Manufacturers
  • “All-in-One” Machines
  • Phones
    • Corded
    • Cordless
  • Fax Machines
  • Scanners
  • Mobile Electronics Devices
    • Phones
    • Laptops/Notebooks/Netbooks
    • Tablets
    • E-Readers
    • Portable Music Players
  • Automotive Market
    • Overview
    • Electric Cars
    • CAFE Issues
    • Overview of Electronics Components in Automotive Products
    • Material Usage
    • Connectors
    • Sensors
    • Flexible Circuitry in Automotive Applications

Chapter 4: Market Breakdown by Technology Type

  • Overview
  • Types of Polymers
  • Thermoplastics
    • Standard Nylons
    • Thermoplastic Polymers
    • Polyphenylene Sulfide
    • Polyimides
    • Polycarbonates
    • Polyphthalamides and Other High-Temperature Nylons
    • Liquid Crystal Polymers
    • Sulfone Polymers
    • Alloys/Blends
    • Fluoropolymers
    • Polyaryletherketones
    • Cyclic Olefin Copolymers
    • Thermoplastic Market Estimates and Forecasts Summary
  • Thermoset Polymers
    • Overview
    • General Properties
    • Epoxy Resins
    • Polyurethanes
    • Phenolics
    • Unsaturated Polyesters
    • Diallyl Phthalate
    • BT-Epoxy Resins and Cyanate Esters
    • Thermoset Market Estimates and Forecasts Summary

Chapter 5: Overview of Key Components, PCBs and Encapsulants

  • Introduction
  • Focus of This Report
  • Resin Consumption
    • Background
    • Markets
    • Growth
    • Market Drivers
  • Printed Circuit Boards
    • Overview
    • Property Requirements for Laminates
    • Physical Composition
    • Assembly Technologies
    • PCB Substrates
    • Specific Polymers Used in Printed Circuit Boards
    • Other Materials Used in Printed Circuit Boards
    • Fiber Reinforcements
    • Production of Circuitry
    • Environmental Issues
    • Flexible Printed Circuit Boards
    • Soldering
    • Production Statistics
    • Industry Trends
    • Electronics Packaging
    • Market Estimates and Forecasts
  • Encapsulants
    • Definitions and Background
    • Primary Purposes of Encapsulation
    • Encapsulant Materials
    • Epoxy Encapsulation Formulations
    • Encapsulated Electrical and Electronics Components
    • Epoxy Encapsulant Systems
    • Silicone Encapsulants
    • Thermoplastic Encapsulants
    • Selected Major Encapsulant Producers and Their Product Lines
    • Market Estimates and Forecasts

Chapter 6: Molded Electronics Products

  • Overview
    • Background
    • Polymers Used
    • Market Drivers
  • Connectors
    • Background
    • Trends
    • Applications for Electronics Connectors
    • Material Selection
    • Flame Retardance
    • Standards Relating to Connectors
    • Manufacturers
    • End-Use Markets
    • Market Estimates and Forecasts
  • Switches
    • Background
    • Market Estimates and Forecasts
  • Coil Formers
    • Background
    • Manufacturers
    • Market Estimates and Forecasts
  • Relays
    • Background
    • Market Estimates and Forecasts
  • Capacitors
    • Background
    • Applications
    • Capacitor Materials
    • Consumption by Market Segment
    • Market Estimates and Forecasts
  • Other Molded Electronics Components
    • Resistors
    • Market Estimates and Forecasts
  • Summary of Market Estimates and Forecasts

Chapter 7: Patent Review/ New Developments

  • Background
  • Importance of Miniaturization
  • Thin-Walling Electronics Components
    • Background
    • Effects of Thin-Walling on Performance Requirements and Design
    • Application Requirements
    • Material and Process Selection
    • Properties Required
    • Challenges in Downsizing
    • Software that Aids Thin-wall Design
  • Flexible Electronics
    • Overview
  • Wearable Electronics
  • Cloud Computing and Big Data
  • The Internet of Everything
  • Changes in Electronics Component Manufacturing that Could Influence Resin Choices
  • Recent Patents Related to the Industry

Chapter 8: Electronics Components Industry Overview and Plastics Producers

  • Top Semiconductor Producers and Customers
  • Manufacturing and Marketing Aspects
    • Globalization
    • What Component Suppliers Are Doing
  • Plastics Producers
    • Overview
  • Polymer Producers According to Material Type
    • Thermosets
    • Thermoplastics

Chapter 9: Environmental Issues

  • Overview
  • Printed Circuit Board Disposal
  • Bromine-Free Printed Circuit Boards
  • Halogen-Free Flame Retardants for Thermoplastics
  • Recycling
  • Electronics Industry Interface
    • Overview
    • Reasons for Increased Environmental Regulations for Electronics Equipment
    • The European Union RoHS Directive
    • The European Union WEEE Directive
    • EPEAT

Chapter 10: Performance Requirements Related to Electronics Components

  • Overview
  • Flammability Standards
    • Definitions
  • Flammability Tests
    • Overview
    • UL 94
    • Glow-Wire Flammability Index - IEC 60695
    • UL 1694
    • UL 746C
  • Other Standards
    • UL 1446
    • UL 1950

Chapter 11: Company Profiles

  • Appendix: Acronyms

About BCC Research

  • About BCC Research
  • BCC Membership
  • BCC Custom Research

List of Tables

  • Summary Table: Global Electronics Components Market, by Type of Polymer, Through 2022 (Million Pounds)
    • Table 1: Examples of Standard Nylons Used to Mold Electronics Components, by Trade Name
    • Table 2: Global Standard Nylon Electronics Components Consumption, by Application, Through 2022 (Million Pounds)
    • Table 3: Examples of Polybutylene Terephthalates Used to Mold Electronics Components, by Trade Name
    • Table 4: Global Polybutylene Terephthalate Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 5: Global PET/PCT Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 6: Examples of Polyphenylene Sulfide and Polyphenylene Sulfide Blends Used to Mold Electronics Components, by Trade Name
    • Table 7: Global Polyphenylene Sulfide Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 8: Global Polyimide* Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 9: Examples of Polycarbonates Used to Mold Electronics Components, by Trade Name
    • Table 10: Global Polycarbonate Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 11: Examples of Polyphthalamide Polymers used to Mold Electronics Components, by Trade Name
    • Table 12: Global Polyphthalamides and High-Temperature Nylon Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 13: Examples of Liquid Crystal Polymers Used to Mold Electronics Components, by Trade Name
    • Table 14: Global Liquid Crystal Polymer Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 15: Global Sulfone Polymer Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 16: Global Polymer Alloy/Blend Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 17: Global Fluoropolymer Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 18: Examples of PAEK Used to Mold Electronics Components, by Trade Name
    • Table 19: Global Polyaryletherketone Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 20: Global Thermoplastic Electronics Components Market, by Type, Through 2022 (Million Pounds)
    • Table 21: Thermoset Properties and Manufacturing Processes
    • Table 22: Examples of Epoxy Resins Used for Electronics Components, by Trade Name
    • Table 23: Global Epoxy Resin Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 24: Examples of Polyurethane Systems Used for Electronics Components, by Trade Name
    • Table 25: Global Polyurethane Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 26: Examples of Phenolics Used for Electronics Components, by Trade Name
    • Table 27: Global Phenolic Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 28: Examples of Unsaturated Polyester and Vinyl Ester and Compounds Used for Electronics Components, by Trade Name
    • Table 29: Global Unsaturated Polyester Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 30: Global Diallyl Phthalate Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 31: Global Thermoset Electronics Components Market, by Type, Through 2022 (Million Pounds)
    • Table 32: Important Technical Factors to Consider When Selecting Printed Circuit Board Substrate Materials
    • Table 33: Comparison between Rigid and Flexible Circuit Boards
    • Table 34: Major Producers of Rigid and Flexible Circuit Boards
    • Table 35: Polymers Suitable for Production of 3D-MIDs Using LDS Technology
    • Table 36: Advantages and Disadvantages of LDS and Two-component Molding for 3D-MIDs
    • Table 37: Global PCB Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 38: Global PCB* Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 39: Global PCB Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 40: Types of Encapsulant Materials -- Advantages and Disadvantages
    • Table 41: Epoxy Encapsulant Formulations
    • Table 42: Global Electronics Encapsulants Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 43: Global Electronics Encapsulants Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 44: Global Electronics Encapsulants Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 45: Major Manufacturers of Electronics Connectors
    • Table 46: Global Electronics Connector Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 47: Global Electronics Connector Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 48: Global Electronics Connector Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 49: Global Electronics Components Switch Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 50: Global Electronics Components Switch Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 51: Global Electronics Components Switch Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 52: Selected Manufacturers Molding Coil Formers for Electronics Applications
    • Table 53: Global Coil-Former Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 54: Global Coil-Former Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 55: Global Coil-Former Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 56: Global Relay Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 57: Global Relay Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 58: Global Relay Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 59: Global Capacitor Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 60: Global Other Electronics Components Market, by Polymer Type, Through 2022 (Million Pounds)
    • Table 61: Global Other Electronics Components Market, by Thermoplastic Type, Through 2022 (Million Pounds)
    • Table 62: Global Other Electronics Components Market, by Thermoset Type, Through 2022 (Million Pounds)
    • Table 63: Global Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 64: Global Thermoplastic Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 65: Global Thermoset Electronics Components Market, by Application, Through 2022 (Million Pounds)
    • Table 66: Top Global Semiconductor Producer Companies, 2016 ($ Billions)
    • Table 67: Top Global Semiconductor Customers, 2016 ($ Billions)
    • Table 68: Trade Names of Selected Plastics Used in Electronics Components

List of Figures

  • Summary Figure: Global Electronics Components Market, by Type of Polymer, 2016-2022 (Million Pounds)
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