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市場調査レポート

世界の電子機器筐体用プラスチック市場

Plastics in Electronic Enclosures: Global Markets

発行 BCC Research 商品コード 224412
出版日 ページ情報 英文 231 Pages
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世界の電子機器筐体用プラスチック市場 Plastics in Electronic Enclosures: Global Markets
出版日: 2012年01月01日 ページ情報: 英文 231 Pages
概要

2011年、世界の電子機器筐体用プラスチックの市場は69億ポンドの規模を記録しました。同市場は2012年には74億ポンドに成長し、その後は6.1%の年平均成長率で推移し、2017年には99億ポンドの市場規模に達すると予測されています。

当レポートでは、世界の電子機器筐体用プラスチック市場の現状と見通しについて調査分析し、電子機器筐体および利用樹脂の種類と概要、電子機器筐体の製造・加工技術、技術課題および要件、樹脂タイプ・導入デバイス区分別の樹脂の消費動向および予測(〜2017年)、製造業者のプロファイルなどをまとめ、概略以下の構成でお届けいたします。

第1章 イントロダクション

第2章 サマリー

第3章 電子機器筐体の概要

第4章 電子機器筐体:樹脂の選択肢

  • 背景
  • コスト
  • コストパフォーマンス
  • プラスチック筐体材料のタイプ

第5章 樹脂

  • 概要
  • PC/ABS
  • ABS
  • PS
  • PCS
  • PPO/HIPS
  • PVC
  • 生分解性ポリマー
  • 熱硬化性樹脂
  • 導電性プラスチック
  • ESD

第6章 電子機器筐体用樹脂:一般技術

  • 主要特性の比較
  • 加工
  • 熱に関する考察
  • 物理的パラメーター
  • 特性:サマリー

第7章 電子機器筐体の加工技術

  • 背景
  • 射出成形
  • 構造用フォーム成形
  • 熱成形
  • モバイルデバイス筐体および定置型デバイス筐体の成形における違い

第8章 電子機器筐体の検査機関と要件

第9章 難燃性

第10章 EMI

  • 背景
  • EMI遮蔽:概要
  • 遮蔽のメカニズム
  • 電磁制御(EMC)
  • 遮蔽の重要性
  • EMIの制御
  • 遮蔽の効果
  • 遮蔽の選択肢とコストとパフォーマンス
  • 熱可塑性プラスチックの利用
  • EMI遮蔽化合物とコート剤
  • エレクトロニクス産業/EMI遮蔽のインターフェース

第11章 薄肉化

  • 新しい概念ではない「薄肉化」
  • 薄肉化電子機器筐体に関連する固有の特徴
  • パフォーマンス要件・設計への効果
  • モバイルデバイス筐体と定置型デバイス筐体
  • 適応要件
  • 材料・可能の選択肢

第12章 プライシング

第13章 電子機器筐体用樹脂市場の推計・予測

  • 電子機器筐体部門における樹脂の消費
  • 電子機器筐体での樹脂利用に関するその他の考察

第14章 導入先

  • 電子機器筐体への影響因子
  • 定置型デバイスの例
  • モバイルデバイスの例
  • ハンドヘルド型デバイス筐体の選択における特異点

第15章 樹脂筐体市場の推計・予測:用途別

  • 背景
  • 主要電子機器の世界の売上推計
  • 主要電子機器用樹脂筐体の平均サイズ
  • モバイル&定置型デバイス用筐体市場:樹脂タイプ別
  • モバイルデバイス筐体用樹脂
  • 定置型デバイス筐体用樹脂

第16章 環境シナリオ

  • リサイクル
  • エレクトロニクスと産業の相互関係
  • スチレン排出の問題

第17章 電子機器筐体用樹脂の主要製造業者

第18章 主要電子機器筐体企業の主な見解

第19章 主要電子機器筐体製造業者のプロファイル

第20章 略語など

図表

目次
Product Code: PLS048A

Abstract

REPORT HIGHLIGHTS

The global market for plastics used in electronic enclosures was 6.9 billion pounds in 2011. BCC expects this market to reach 7.4 billion pounds by 2012 and to reach 9.9 billion pounds by 2017, increasing at a compound annual growth rate (CAGR) of 6.1%.

The stationary electronic device segment was 6.7 billion pounds in 2011, which is expected to reach to 7.2 billion pounds in 2012. The segment is then forecast to grow to 9.5 billions pound by 2017, increasing at a CAGR of 5.9% for the five year period.

The mobile electronic device segment was 179.1 million pounds in 2011 and is expected to reach 201 million pounds in 2012. BCC forecasts this market will further grow at a CAGR of 12.6% and will reach 363.4 million pounds in 2017.

REPORT SCOPE

INTRODUCTION

STUDY OBJECTIVES

The surge of new electronic products, led by small and mobile computer-based devices, has resulted in significant changes in resin selection for enclosures. Downsizing and thin walling have necessitated a reevaluation of resins because of more demanding physical-property requirements and molding challenges. In addition, a reevaluation is also necessary for resins used in the stationary portion of the market, which includes enclosures for desktop computers and flat-panel displays.

This study analyzes new developments, particularly the complex scenario of very small enclosures, given that mobile electronic devices have become increasingly smaller and lighter. There have also been changes in the market for stationary electronic devices, especially because of the additional protection required for power supplies within these units.

REASON FOR DOING STUDY

Many past studies on resins used for electronic enclosures cited data that was outdated and, in our opinion, not valid. FEW of these studies carefully defined the parameters. It must also be realized that change is the mantra of the electronic industry. NEW products are constantly being introduced, creating different issues for enclosures.

In many instances, past studies did not take into account important data generated from previous reports. Also not take into consideration were critical factors such as the actual measurement and calculation of surface areas and weights for both stationary and mobile electronic enclosures.

The results of this study were generated from such measurements and subsequent calculations. The report also includes careful estimates of units sold, and, finally, reasonable estimates of future units to be sold.

SCOPE AND FORMAT

Use of electronic enclosures, often called " housings" , is often classified as stationary or mobile. and often compete with each other. Many mobile electronic devices have become multifunctional. This study covers both stationary and mobile electronic devices; some of the latter are also known as handheld devices.

Some of the significant changes within the industry include the shift of desktop computers to notebooks, with the shift to smaller versions called " netbooks" , and the explosion of the cell phone market, which includes upgrades such as iPhones, smart phones, and the popular BlackBerry. MP3 players, such as i-pods, bring music to the world. Tablets such as the popular i-Pad, along with electronic books, or " e-books" , have been the most recently introduced products in this industry.

Another critical factor in this market is the almost complete shift in North America, Japan, and Western Europe from cathode-ray-tube (CRT) monitors to flat-panel monitors for computers and TVs. In both cases, bulky monitors have been replaced, resulting in less volume for enclosures and shifts away from polystyrene (PS) to mostly polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS) resins.

This report deals with electronic enclosures and excludes enclosures used for servers, which utilize modular enclosures. Servers are a nondescript group of enclosures, mostly made from metals, especially sheet-metal materials, along with some reinforced plastics, many of which are thermosets. Many of these enclosures are termed " cabinets" and are made by simply joining smaller units together.

Another factor impacting this market, and covered in detail in this report, relates to the use of flame retardants for resins used in electronic enclosures to conform to new environmental restrictions related to bromine-based variants. In some instances, choices of enclosure resins have changed in order to meet these new standards.

Use of metals in stationary and mobile electronic devices has been considered in this report. However, the use of metals is still very small and difficult to quantify; as such, it was not included in the basic calculations to determine enclosure weights.

The market information contained in this report is considered global. However, a quantitative breakdown of the data by geographic region was not deemed feasible. We have included the most recent global analysis of electronic device sales by major geographic region; this could prove to be a viable attempt to segment this market by major areas.

METHODOLOGY

A comprehensive review was undertaken of trade and technical literature relating to electronic enclosures in terms of resin usage, specific applications, and new technologies and developments, etc. Included in this review were supplier trade literature, texts, and monographs.

In addition to calculating measurements of enclosures, interviews were conducted with major manufacturers of electronic enclosures and with original equipment manufacturers (OEMs) in the electronic industry. Their input was carefully evaluated and meaningful contributions were included in the analysis. These electronic-enclosure manufacturers included Buckeye Enclosures, Bud Industries, Cool Polymers, EAI Enclosures, Electronic Product Design, Fibox Enclosures, Hammond Manufacturing, Hubell/Wiegman, LCR Electronics, Met Case/OKW Enclosures, Plastronic Enclosures, Polycase, Polymer Products, Rose+Bopla, Teko USA Enclosures, Unibox Enclosures, and Vynckier Enclosures.

ABOUT THE AUTHOR

Research analyst Mel Schlechter has more than 40 years in the chemical industry, and specializes in plastics market research. He has been with BCC Research for more than 10 years and holds a B.S. in chemistry, an M.S. in organic chemistry, and an M.B.A. in marketing.

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DISCLAIMER

The information developed in this report is intended to be as reliable as possible at the time of publication and to be of a professional nature. This information does not constitute managerial, legal, or accounting advice; nor should it serve as a corporate policy guide, laboratory manual, or an endorsement of any product, as much of the information is speculative in nature. The author assumes no responsibility for any loss or damage that might result from reliance on the reported information or from its use.

Table of Contents

Chapter- 1: INTRODUCTION - Complimentary

  • STUDY OBJECTIVES
  • REASON FOR DOING STUDY
  • SCOPE AND FORMAT
  • METHODOLOGY
  • ABOUT THE AUTHOR
  • RELATED BCC REPORTS
  • BCC ONLINE SERVICES
  • DISCLAIMER

Chapter- 2: SUMMARY

  • Table 0 : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE ENCLOSURES BY TYPE OF ELECTRONIC ENCLOSURE, THROUGH 2017
  • Figure 0 : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE ENCLOSURES BY TYPE OF ELECTRONIC ENCLOSURE, 2011-2017

Chapter- 3: OVERVIEW OF ELECTRONIC ENCLOSURES

  • DEFINITIONS
  • PLANNING
  • FUNCTIONS
  • BACKGROUND
  • THE EMI ISSUE
  • HEAT-MANAGEMENT
  • DOWNSIZING
  • STILL A COMPETITIVE SCENARIO
  • EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN
  • MATERIAL AND PROCESS SELECTION
  • SIGNIFICANCE OF THIN-WALLING ON RESIN SELECTION
  • ISSUE OF FLAME-RETARDANCY
  • COSTS
  • ORGANIZATIONS PUBLISHING STANDARDS FOR ELECTRONIC ENCLOSURES
  • NEW DEVELOPMENTS
  • MATERIAL OPTIONS FOR ELECTRONIC ENCLOSURES

Chapter- 4: RESIN CHOICES FOR ELECTRONIC ENCLOSURES

  • BACKGROUND
  • COSTS
  • COST-PERFORMANCE
  • TYPES OF PLASTIC ENCLOSURE MATERIALS

Chapter- 5: RESINS

  • OVERVIEW
  • PC/ABS
  • ABS
  • PS
  • PCS
  • PPO/HIPS
  • PVC
  • BIODEGRADABLE POLYMERS
  • THERMOSET RESINS
  • CONDUCTIVE PLASTICS
  • ESD

Chapter- 6: GENERAL TECHNOLOGY OF ELECTRONIC ENCLOSURE RESINS

  • COMPARISON OF KEY PROPERTIES
  • PROCESSING
  • THERMAL CONSIDERATIONS
  • PHYSICAL PARAMETERS
  • PROPERTY SUMMARY

Chapter- 7: PROCESS TECHNOLOGY FOR ELECTRONIC ENCLOSURES

  • BACKGROUND
  • INJECTION-MOLDING
  • STRUCTURAL FOAM MOLDING
  • THERMOFORMING
  • DIFFERENCES IN MOLDING ENCLOSURES FOR MOBILE VS. STATIONARY DEVICES

Chapter- 8: TESTING AGENCIES AND REQUIREMENTS RELATED TO ELECTRONIC ENCLOSURES

  • OVERVIEW
  • FIRE-PROTECTION STANDARDS FOR ELECTRONIC ENCLOSURES
  • UL
  • NEMA
  • OTHER STANDARDS FOR ELECTRONIC ENCLOSURES

Chapter- 9: FLAME RETARDANCY

  • BACKGROUND
  • OVERVIEW
  • THE BROMINE ISSUE

Chapter- 10: EMI ASPECTS

  • BACKGROUND
  • OVERVIEW OF EMI-SHIELDING
  • MECHANISMS OF SHIELDING
  • ELECTROMAGNETIC CONTROL (EMC)
  • THE IMPORTANCE OF SHIELDING
  • CONTROLLING EMI
  • SHIELDING-EFFECTIVENESS
  • COST AND PERFORMANCE OF SHIELDING OPTIONS
  • USE OF THERMOPLASTICS
  • EMI-SHIELDING COMPOUNDS VERSUS COATINGS
  • ELECTRONIC INDUSTRY/EMI-SHIELDING INTERFACE

Chapter- 11: THIN WALLING

  • INTRODUCTION
  • THIN WALLING IS NOT A NOVEL CONCEPT
  • UNIQUE CHARACTERISTICS RELATED TO THIN WALLING ELECTRONIC ENCLOSURES
  • EFFECTS ON PERFORMANCE REQUIREMENTS AND DESIGN
  • MOBILE VS.. STATIONARY ENCLOSURES
  • APPLICATION REQUIREMENTS
  • MATERIAL AND PROCESS SELECTION

Chapter- 12: PRICING

  • Table 33 : LIST PRICES FOR ENCLOSURE RESINS

Chapter- 13: RESIN MARKET ESTIMATES AND FORECASTS FOR ELECTRONIC ENCLOSURES

  • INTRODUCTION
  • RESIN CONSUMPTION IN ELECTRONIC ENCLOSURES
  • OTHER OBSERVATIONS RELATED TO RESIN USAGE IN ELECTRONIC ENCLOSURES

Chapter- 14: APPLICATIONS

  • DEFINITIONS
  • FACTORS AFFECTING ELECTRONIC ENCLOSURES
  • EXAMPLES OF STATIONARY ELECTRONIC DEVICES
  • EXAMPLES OF MOBILE ELECTRONIC DEVICES
  • SPECIFICS IN CHOOSING AN ENCLOSURE FOR A HANDHELD DEVICE

Chapter- 15: RESIN ENCLOSURE MARKET ESTIMATES AND FORECASTS BY APPLICATION

  • BACKGROUND
  • ESTIMATED GLOBAL SALES OF KEY ELECTRONIC DEVICES
  • DETERMINING AVERAGE SIZES OF RESIN-BASED ENCLOSURES FOR THE MAJOR TYPES OF ELECTRONIC DEVICES
  • MARKETS FOR MOBILE AND STATIONARY ELECTRONIC DEVICE ENCLOSURES BY TYPE OF RESIN
  • ENCLOSURE RESINS FOR MOBILE ELECTRONIC DEVICES
  • RESINS FOR STATIONARY ELECTRONIC DEVICE ENCLOSURES
  • Table 71 : GLOBAL CONSUMPTION OF RESINS IN STATIONARY ELECTRONIC ENCLOSURES, THROUGH 2017
  • Table 72 : GLOBAL CONSUMPTION OF RESINS IN ELECTRONIC-DISPLAY ENCLOSURES, THROUGH 2017
  • Table 73 : GLOBAL CONSUMPTION OF RESINS IN DESKTOP-COMPUTER ENCLOSURES, THROUGH 2017
  • Table 74 : GLOBAL CONSUMPTION OF RESINS IN PRINTER ENCLOSURES, THROUGH 2017
  • Table 75 : GLOBAL CONSUMPTION OF RESINS IN FAX-MACHINE ENCLOSURES, THROUGH 2017
  • Table 76 : CONSUMPTION OF RESINS IN SCANNER ENCLOSURES, THROUGH 2017
  • Table 77 : GLOBAL CONSUMPTION OF RESINS FOR ALL-IN-ONE ENCLOSURES, THROUGH 2017
  • Table 78 : GLOBAL CONSUMPTION OF RESINS IN KEYBOARD ENCLOSURES, THROUGH 2017
  • Table 79 : GLOBAL CONSUMPTION OF RESINS IN PHONE ENCLOSURES, THROUGH 2017
  • Table 80 : GLOBAL CONSUMPTION OF RESINS IN OTHER STATIONERY ENCLOSURES, THROUGH 2017

Chapter- 16: THE ENVIRONMENTAL SCENARIO

  • OVERVIEW
  • RECYCLING
  • ELECTRONIC-INDUSTRY INTERFACE
  • STYRENE-EMISSION PROBLEM

Chapter- 17: SELECTED KEY GLOBAL PRODUCERS OF ELECTRONIC ENCLOSURE RESINS

  • Table 82 : KEY GLOBAL PRODUCERS OF ELECTRONIC ENCLOSURE RESINS

Chapter- 18: SELECTED COMMENTS FROM ELECTRONIC ENCLOSURE COMPANIES SELECTED

Chapter- 19: PROFILES OF SELECTED ELECTRONIC ENCLOSURE MANUFACTURERS

  • ALLIED MOULDED PRODUCTS
  • BAFBOX, LTD
  • BISON PROFAB
  • BOSS ENCLOSURES
  • BOX ENCLOSURES
  • BUCKEYE SHAPEFORM
  • BUD INDUSTRIES
  • COMFORT SAFETY PRODUCTS
  • COOL POLYMERS, INC.
  • DUSTSHIELD ENCLOSURES
  • EAI ENCLOSURES
  • FIBOX ENCLOSURES
  • FREETECH PLASTICS
  • HAMMOND MANUFACTURING
  • HUBBELL/WIEGMANN
  • INCLOSIA SOLUTIONS
  • INTEGRA ENCLOSURES, INC.
  • LCD ENCLOSURES
  • LCR ENCLOSURES, INC.
  • OKW ENCLOSURES
  • ITS ENCLOSURES
  • PEERLESS INDUSTRIES
  • POLYCASE, INC.
  • QUBE, INC.
  • ROSE+BOPLA ENCLOSURES
  • SELECTRONIX, LTD.
  • SERPAC ELECTRONIC ENCLOSURES
  • SIGNATURE ENCLOSURES
  • SOLUTIONS DIRECT
  • TAKACHI ELECTRONIC ENCLOSURE COMPANY
  • TRITON SYSTEMS, INC.
  • UNIBOX ENCLOSURES
  • VYNCKIER ENCLOSURE SYSTEMS

Chapter- 20: SELECTED ACRONYMS

List of Tables

  • Summary Table : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE ENCLOSURES BY TYPE OF ELECTRONIC ENCLOSURE, THROUGH 2017
  • Table 1 : COMPARISON OF KEY PERFORMANCE CRITERIA FOR ELECTRONIC ENCLOSURES: METALS VS. PLASTICS
  • Table 2 : DESIGN PARAMETERS
  • Table 3 : COMPARISONS OF RESINS FOR ELECTRONIC ENCLOSURE APPLICATIONS BASED ON COST-PERFORMANCE
  • Table 4 : THE BEST- AND WORST-PERFORMING RESINS AND RESIN BLENDS FOR ELECTRONIC ENCLOSURES
  • Table 5 : FABRICATION METHODS AND USES FOR PS
  • Table 6 : ADVANTAGES AND DISADVANTAGES OF PVC IN ELECTRONIC ENCLOSURES
  • Table 7 : RIGID PVC APPLICATIONS
  • Table 8 : GLOBAL PVC PRODUCERS
  • Table 9 : FIBER-REINFORCED THERMOSET PROPERTIES AND MANUFACTURING PROCESSES
  • Table 10 : TYPICAL SMC FORMULATION
  • Table 11 : SELECTED KEY SMC PRODUCERS
  • Table 12 : DIELECTRIC CONSTANTS FOR SELECTED MATERIALS
  • Table 13 : HOW TO MAKE PLASTICS CONDUCTIVE
  • Table 14 : SELECTED KEY COMPANIES PRODUCING CONDUCTIVE PLASTICS
  • Table 15 : SELECTED KEY ESD PLASTIC PRODUCTS
  • Table 16 : RESIN COMPARISON: MELT-FLOW RATES
  • Table 17 : RESIN COMPARISON: MOLD SHRINKAGE
  • Table 18 : RESIN COMPARISON: TENSILE STRENGTH
  • Table 19 : RESIN COMPARISON: FLEXURAL STRENGTH
  • Table 20 : RESIN COMPARISON: FLEXURAL MODULUS
  • Table 21 : RESIN COMPARISON: NOTCHED IZOD IMPACT (FOOT-POUND/INCH, 1/8-INCH SPECIMEN)
  • Table 22 : RESIN COMPARISON: CLTE
  • Table 23 : RESIN COMPARISON: HDT
  • Table 24 : RESIN COMPARISON: WATER ABSORPTION
  • Table 25 : RESIN COMPARISON: DIELECTRIC STRENGTH
  • Table 26 : CRITERIA FOR UL 94 V CLASSIFICATIONS
  • Table 27 : BURN SPECIFICATIONS FOR UL 94 MATERIAL RATINGS
  • Table 28 : SELECTED KEY NEMA, UL, AND CSA STANDARDS
  • Table 29 : TYPICAL FLAME RETARDANCY LEVELS FOR POLYSTYRENE
  • Table 30 : PHOSPHATE FLAME-RETARDANTS USED IN ELECTRONIC ENCLOSURE APPLICATIONS
  • Table 31 : CURRENT SCENARIO FOR POLYNUCLEAR, BROMINATED FLAME-RETARDANTS IN REGARD TO ELECTRONIC ENCLOSURES
  • Table 32 : GENERAL RATINGS OF SHIELDING-EFFECTIVENESS
  • Table 33 : LIST PRICES FOR ENCLOSURE RESINS
  • Table 34 : GLOBAL ELECTRONIC ENCLOSURE MARKET BY KEY RESINS, THROUGH 2017
  • Table 35 : GLOBAL SALES OF ELECTRONIC DEVICES BY MAJOR GEOGRAPHICAL AREA, 2012 AND 2017
  • Table 36 : GLOBAL MARKET FOR PC/ABS ENCLOSURES, THROUGH 2017
  • Table 37 : GLOBAL MARKET FOR PC/ABS FOR STATIONARY DEVICES, THROUGH 2017
  • Table 38 : GLOBAL MARKET FOR PC/ABS ENCLOSURES FOR MOBILE DEVICES THROUGH 2017
  • Table 39 : GLOBAL MARKET FOR ABS ENCLOSURES, THROUGH 2017
  • Table 40 : GLOBAL MARKET FOR ABS ENCLOSURES FOR STATIONARY DEVICES, THROUGH 2017
  • Table 41 : GLOBAL MARKET FOR ABS ENCLOSURES FOR MOBILE DEVICES, THROUGH 2017
  • Table 42 : GLOBAL ENCLOSURE MARKET FOR HIPS BY APPLICATION, THROUGH 2017
  • Table 43 : GLOBAL MARKET FOR PC ENCLOSURES, THROUGH 2017
  • Table 44 : GLOBAL MARKET FOR PC ENCLOSURES FOR STATIONARY DEVICES, THROUGH 2017
  • Table 45 : GLOBAL MARKET FOR PC ENCLOSURES FOR MOBILE DEVICES, THROUGH 2017
  • Table 46 : GLOBAL MARKET FOR PPO/HIPS ENCLOSURES IN STATIONARY, DEVICES THROUGH 2017
  • Table 47 : GLOBAL MARKET FOR OTHER RESINS IN ENCLOSURES, THROUGH 2017
  • Table 48 : GLOBAL MARKET FOR OTHER RESINS IN ENCLOSURES FOR MOBILE DEVICES, THROUGH 2017
  • Table 49 : GLOBAL MARKET FOR OTHER RESINS FOR ENCLOSURES IN STATIONARY DEVICES, THROUGH 2017
  • Table 50 : ELECTRONIC DISPLAY COMPARISONS
  • Table 51 : TOTAL GLOBAL DISPLAY AREA BY FLAT-PANEL TECHNOLOGY
  • Table 52 : TYPICAL REQUIREMENTS FOR NOTEBOOK/NETBOOK PLASTIC ENCLOSURES
  • Table 53 : GLOBAL SALES AND FORECAST FOR ELECTRONIC DEVICES, THROUGH 2017
  • Table 54 : GLOBAL SALES AND FORECAST FOR MOBILE ELECTRONIC DEVICES, THROUGH 2017
  • Table 55 : GLOBAL sales and forecast for STATIONARY ELECTRONIC, DEVICEs through 2017
  • Table 56 : ESTIMATES OF DIMENSIONS OF ELECTRONIC ENCLOSURES FOR MOBILE DEVICES
  • Table 57 : ESTIMATES OF DIMENSIONS OF ELECTRONIC ENCLOSURES FOR STATIONARY DEVICES
  • Table 58 : AVERAGE WEIGHTS OF MOBILE-DEVICE ENCLOSURES
  • Table 59 : AVERAGE WEIGHTS OF STATIONARY DEVICE ENCLOSURES
  • Table 60 : ENCLOSURE WEIGHTS FOR MOBILE ELECTRONIC DEVICES, THROUGH 2017
  • Table 61 : ENCLOSURE WEIGHTS FOR STATIONARY ELECTRONIC DEVICES, THROUGH 2017
  • Table 62 : GLOBAL CONSUMPTION OF RESINS IN MOBILE ELECTRONIC DEVICE ENCLOSURES, THROUGH 2017
  • Table 63 : GLOBAL CONSUMPTION OF RESINS IN CELLULAR PHONES, THROUGH 2017
  • Table 64 : GLOBAL CONSUMPTION OF RESINS IN SMART PHONES, THROUGH 2017
  • Table 65 : GLOBAL CONSUMPTION OF RESINS IN NOTEBOOKS/NETBOOKS, THROUGH 2017
  • Table 66 : GLOBAL CONSUMPTION OF RESINS FOR TABLETS/I-PADS, THROUGH 2017
  • Table 67 : GLOBAL CONSUMPTION OF RESINS IN COMBINATION DEVICES, THROUGH 2017
  • Table 68 : GLOBAL CONSUMPTION OF RESINS FOR E-READERS, THROUGH 2017
  • Table 69 : GLOBAL CONSUMPTION OF RESINS FOR I-PODS/MP3 PLAYERS, THROUGH 2017
  • Table 70 : GLOBAL CONSUMPTION OF RESINS IN OTHER MOBILE DEVICES, THROUGH 2017
  • Table 71 : GLOBAL CONSUMPTION OF RESINS IN STATIONARY ELECTRONIC ENCLOSURES, THROUGH 2017
  • Table 72 : GLOBAL CONSUMPTION OF RESINS IN ELECTRONIC-DISPLAY ENCLOSURES, THROUGH 2017
  • Table 73 : GLOBAL CONSUMPTION OF RESINS IN DESKTOP-COMPUTER ENCLOSURES, THROUGH 2017
  • Table 74 : GLOBAL CONSUMPTION OF RESINS IN PRINTER ENCLOSURES, THROUGH 2017
  • Table 75 : GLOBAL CONSUMPTION OF RESINS IN FAX-MACHINE ENCLOSURES, THROUGH 2017
  • Table 76 : CONSUMPTION OF RESINS IN SCANNER ENCLOSURES, THROUGH 2017
  • Table 77 : GLOBAL CONSUMPTION OF RESINS FOR ALL-IN-ONE ENCLOSURES, THROUGH 2017
  • Table 78 : GLOBAL CONSUMPTION OF RESINS IN KEYBOARD ENCLOSURES, THROUGH 2017
  • Table 79 : GLOBAL CONSUMPTION OF RESINS IN PHONE ENCLOSURES, THROUGH 2017
  • Table 80 : GLOBAL CONSUMPTION OF RESINS IN OTHER STATIONERY ENCLOSURES, THROUGH 2017
  • Table 81 : APPLYING PLASTICS SCORECARD TO ELECTRONIC ENCLOSURES
  • Table 82 : KEY GLOBAL PRODUCERS OF ELECTRONIC ENCLOSURE RESINS

List of Figures

  • Summary Figure : GLOBAL MARKET FOR RESINS FOR STATIONARY AND MOBILE ENCLOSURES BY TYPE OF ELECTRONIC ENCLOSURE, 2011-2017
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