デフォルト表紙
市場調査レポート
商品コード
992238

ミックスドシグナルIC市場:タイプ別、最終用途別:世界の機会分析および業界予測(2020年~2027年)

Mixed Signal IC Market by Type and End Use : Global Opportunity Analysis and Industry Forecast, 2020-2027

出版日: | 発行: Allied Market Research | ページ情報: 英文 228 Pages | 納期: 2~3営業日

価格
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本日の銀行送金レート: 1USD=128.03円
ミックスドシグナルIC市場:タイプ別、最終用途別:世界の機会分析および業界予測(2020年~2027年)
出版日: 2021年01月29日
発行: Allied Market Research
ページ情報: 英文 228 Pages
納期: 2~3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界のミックスドシグナルICの市場規模は2019年に941億米ドルとなりました。

同市場は、2020年から2027年にかけて6.6%のCAGRで拡大し、2027年までに1,498億米ドルに達すると予測されています。ミックスドシグナルICは、同じチップセット上のアナログ回路とデジタル回路から成る集積回路です。このICは主に、FM無線信号、光波、音声などのアナログ信号をデジタルデバイスが処理するためのデジタル信号に変換するために使用されます。

同市場は、成長要因、抑制要因、および機会の影響に従って分析されます。ミックスドシグナルICの需要は、5G技術の採用や低消費電力デバイスの需要の高まりなど、さまざまな要因により、予測期間中に急速に増加すると予想されます。ただし、ミックスドシグナルICの設計は複雑であるため、市場の成長が制限されます。逆に、自動車および軍事・防衛におけるミックスドシグナルICの用途拡大が、ミックスドシグナルIC市場に豊富な機会を提供すると予測されています。

当レポートでは、ミックスドシグナルIC市場について調査し、市場の概要とともに、タイプ別、最終用途別、地域別の動向、および市場に参入する企業のプロファイルなどを提供しています。

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 市場概要

  • 市場の定義と範囲
  • COVID-19影響分析
  • 主な調査結果
    • 影響を与える主な要因
    • 主な投資ポケット
  • ポーターのファイブフォース分析
  • 市場力学
    • 促進要因
      • 5Gテクノロジーの採用の増加
      • 低消費電力デバイスの必要性の高まり
    • 抑制要因
      • ミックスドシグナルICの複雑な統合プロセス
    • 市場機会
      • 自動車産業における用途拡大
  • COVID-19の影響
    • 市場規模への影響
    • エンドユーザーの動向、好み、および予算への影響

第4章 世界のミックスドシグナルIC市場:タイプ別

  • 概要
  • ミックスドシグナルSOC
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別
  • マイクロコントローラー
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別
  • データコンバーター
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別

第5章 世界のミックスドシグナルIC市場:最終用途別

  • 概要
  • 家電
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別
  • 医療とヘルスケア
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別
  • 電気通信
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別
  • 自動車
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別
  • 軍事および防衛
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:地域別
    • 市場分析:国別

第6章 ミックスドシグナルIC市場:地域別

  • 概要
  • 北米
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:タイプ別
    • 市場規模と予測:最終用途別
    • 市場分析:国別
      • 米国
      • カナダ
      • メキシコ
  • 欧州
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:タイプ別
    • 市場規模と予測:最終用途別
    • 市場分析:国別
      • ドイツ
      • 英国
      • フランス
      • その他
  • アジア太平洋
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:タイプ別
    • 市場規模と予測:最終用途別
    • 市場分析:国別
      • 中国
      • 日本
      • インド
      • 韓国
      • その他
  • LAMEA
    • 主要な市場動向、成長要因、および機会
    • 市場規模と予測:タイプ別
    • 市場規模と予測:最終用途別
    • 市場分析:国別
      • ラテンアメリカ
      • 中東
      • アフリカ

第7章 競合情勢

  • イントロダクション
    • マーケットプレーヤーのポジショニング、2019年
  • 主な成功戦略
  • トップ10プレーヤーの製品マッピング
  • 競争力ダッシュボード
  • 競争力ヒートマップ

第8章 企業プロファイル

  • ANALOG DEVICES
  • BROADCOM INC
  • CYPRESS SEMICONDUCTOR CORPORATION
  • DIALOG SEMICONDUCTOR
  • ENSILICA LTD
  • NXP SEMICONDUCTOR
  • RENESAS ELECTRONICS CORPORATION
  • STMICROELECTRONICS N.V.
  • TELEPHONICS CORPORATION
  • TEXAS INSTRUMENTS INCORPORATED
図表

LIST OF TABLES

  • TABLE 01.GLOBAL MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 02.MIXED SIGNAL IC MARKET FOR MIXED SIGNAL SOC, BY REGION, 2019-2027 ($MILLION)
  • TABLE 03.MIXED SIGNAL IC FOR MICROCONTROLLER, BY REGION, 2019-2027 ($MILLION)
  • TABLE 04.MIXED SIGNAL IC MARKET FOR DATA CONVERTER, BY REGION, 2019-2027 ($MILLION)
  • TABLE 05.GLOBAL MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 06.MIXED SIGNAL IC MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2019-2027 ($MILLION)
  • TABLE 07.MIXED SIGNAL IC MARKET FOR MEDICAL & HEALTHCARE, BY REGION, 2019-2027 ($MILLION)
  • TABLE 08.MIXED SIGNAL IC MARKET FOR TELECOMMUNICATION, BY REGION, 2019-2027 ($MILLION)
  • TABLE 09.MIXED SIGNAL IC MARKET FOR AUTOMOTIVE, BY REGION, 2019-2027 ($MILLION)
  • TABLE 10.MIXED SIGNAL IC MARKET FOR MILITARY & DEFENSE, BY REGION, 2019-2027 ($MILLION)
  • TABLE 11.MIXED SIGNAL IC MARKET REVENUE, BY REGION, 2019-2027 ($MILLION)
  • TABLE 12.NORTH AMERICA MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 13.NORTH AMERICA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 14.U.S. MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 15.U.S. MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 16.CANADA MIXED SIGNAL IC MARKET, BY PROCESSOR, 2019-2027 ($MILLION)
  • TABLE 17.CANADA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 18.MEXICO MIXED SIGNAL IC MARKET, BY PROCESSOR, 2019-2027 ($MILLION)
  • TABLE 19.MEXICO MIXED SIGNAL IC MARKET, BY FORM FACTOR, 2019-2027 ($MILLION)
  • TABLE 20.EUROPE MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 21.EUROPE MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 22.GERMANY MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 23.GERMANY MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 24.UK MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 25.UK MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 26.FRANCE MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 27.FRANCE MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 28.REST OF EUROPE MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 29.REST OF EUROPE MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 30.ASIA PACIFIC MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 31.ASIA PACIFIC MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 32.CHINA MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 33.CHINA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 34.JAPAN MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 35.JAPAN MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 36.INDIA MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 37.INDIA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 38.SOUTH KOREA MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 39.SOUTH KOREA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 40.REST OF ASIA-PACIFIC MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 41.REST OF ASIA-PACIFIC MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 42.LAMEA MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 43.LAMEA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 44.LATIN AMERICA MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 45.LATIN AMERICA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 46.MIDDLE EAST MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 47.MIDDLE EAST MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 48.AFRICA MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
  • TABLE 49.AFRICA MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
  • TABLE 50.ANALOG DEVICES:KEY EXECUTIVES
  • TABLE 51.ANALOG DEVICES: COMPANY SNAPSHOT
  • TABLE 52.ANALOG DEVICES: PRODUCT PORTFOLIO
  • TABLE 53.ANALOG DEVICES: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 54.BROADCOM INC:KEY EXECUTIVES
  • TABLE 55.BROADCOM INC: COMPANY SNAPSHOT
  • TABLE 56.BROADCOM INC: PRODUCT PORTFOLIO
  • TABLE 57.BROADCOM INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 58.CYPRESS SEMICONDUCTOR CORPORATION: KEY EXECUTIVES
  • TABLE 59.CYPRESS SEMICONDUCTOR CORPORATION: COMPANY SNAPSHOT
  • TABLE 60.CYPRESS SEMICONDUCTOR CORPORATION: PRODUCT PORTFOLIO
  • TABLE 61.DIALOG SEMICONDUCTOR: KEY EXECUTIVES
  • TABLE 62.DIALOG SEMICONDUCTOR: COMPANY SNAPSHOT
  • TABLE 63.DIALOG SEMICONDUCTOR: PRODUCT PORTFOLIO
  • TABLE 64.ENSILICA LTD: KEY EXECUTIVES
  • TABLE 65.ENSILICA LTD: COMPANY SNAPSHOT
  • TABLE 66.ENSILICA LIMITED.: PRODUCT PORTFOLIO
  • TABLE 67.COMPANY SNAPSHOT
  • TABLE 68.NXP: PRODUCT PORTFOLIO
  • TABLE 69.RENESAS ELECTRONICS CORPORATION: COMPANY SNAPSHOT
  • TABLE 70.RENESAS ELECTRONICS CORPORATION: OPERATING SEGMENTS
  • TABLE 71.RENESAS ELECTRONICS CORPORATION: PRODUCT PORTFOLIO
  • TABLE 72.STMICROELECTRONICS: COMPANY SNAPSHOT
  • TABLE 73.STMICROELECTRONICS: OPERATING SEGMENTS
  • TABLE 74.STMICROELECTRONICS: PRODUCT PORTFOLIO
  • TABLE 75.TELEPHONICS CORPORATION: COMPANY SNAPSHOT
  • TABLE 76.TELEPHONICS CORPORATION: PRODUCT PORTFOLIO
  • TABLE 77.COMPANY SNAPSHOT
  • TABLE 78.TI: OPERATING SEGMENTS
  • TABLE 79.TI: PRODUCT PORTFOLIO

LIST OF FIGURES

  • FIGURE 01.KEY MARKET SEGMENTS
  • FIGURE 02.GLOBAL MIXED SIGNAL IC MARKET SNAPSHOT, BY SEGMENTATION
  • FIGURE 03.MIXED SIGNAL IC MARKET SNAPSHOT, BY REGION
  • FIGURE 04.TOP IMPACTING FACTORS
  • FIGURE 05.HIGH BARGAINING POWER OF SUPPLIERS
  • FIGURE 06.MODERATE THREAT OF NEW ENTRANTS
  • FIGURE 07.MODERATE THREAT OF SUBSTITUTES
  • FIGURE 08.MODERATE-TO-HIGH INTENSITY OF RIVALRY
  • FIGURE 09.MODERATE-TO-HIGH BARGAINING POWER OF BUYERS
  • FIGURE 10.GLOBAL MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027
  • FIGURE 11.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MIXED SIGNAL SOC, BY COUNTRY, 2019 & 2027(%)
  • FIGURE 12.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MICROCONTROLLER, BY COUNTRY, 2019 & 2027(%)
  • FIGURE 13.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET DATA CONVERTER, BY COUNTRY, 2019 & 2027(%)
  • FIGURE 14.GLOBAL MIXED SIGNAL IC MARKET, BY END USE, 2019-2027
  • FIGURE 15.COMPARATIVE SHARE ANALYSIS MIXED SIGNAL IC MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2019 & 2027 (%)
  • FIGURE 16.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MEDICAL & HEALTHCARE, BY COUNTRY, 2019 & 2027 (%)
  • FIGURE 17.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2019 & 2027 (%)
  • FIGURE 18.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR AUTOMOTIVE, BY COUNTRY, 2019 & 2027(%)
  • FIGURE 19.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MILITARY & DEFENSE, BY COUNTRY, 2019 & 2027(%)
  • FIGURE 20.MIXED SIGNAL IC MARKET, BY REGION, 2019-2027 (%)
  • FIGURE 21.COMPARATIVE SHARE ANALYSIS OF NORTH AMERICA MIXED SIGNAL IC MARKET, BY COUNTRY, 2019-2027 (%)
  • FIGURE 22.U.S. MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 23.CANADA MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 24.MEXICO MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 25.COMPARATIVE SHARE ANALYSIS OF EUROPE MIXED SIGNAL IC MARKET, BY COUNTRY, 2019-2027 (%)
  • FIGURE 26.GERMANY MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 27.UK MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 28.FRANCE MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 29.REST OF EUROPE MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 30.COMPARATIVE SHARE ANALYSIS OF ASIA PACIFIC MIXED SIGNAL IC MARKET, BY COUNTRY, 2019-2027 (%)
  • FIGURE 31.CHINA MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 32.JAPAN MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 33.INDIA MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 34.SOUTH KOREA MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 35.REST OF ASIA PACIFIC MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 36.COMPARATIVE SHARE ANALYSIS OF LAMEA MIXED SIGNAL IC MARKET, BY COUNTRY, 2019-2027 (%)
  • FIGURE 37.LATIN AMERICA MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 38.MIDDLE EAST MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 39.AFRICA MIXED SIGNAL IC MARKET, 2019-2027 ($MILLION)
  • FIGURE 40.MARKET PLAYER POSITIONING, 2019
  • FIGURE 41.TOP WINNING STRATEGIES, BY YEAR, 2015-2020*
  • FIGURE 42.TOP WINNING STRATEGIES, BY DEVELOPMENT, 2015-2020*
  • FIGURE 43.TOP WINNING STRATEGIES, BY COMPANY, 2017-2020*
  • FIGURE 44.PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 45.COMPETITIVE DASHBOARD
  • FIGURE 46.COMPETITIVE HEATMAP OF KEY PLAYERS
  • FIGURE 47.ANALOG DEVICES: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 48.ANALOG DEVICES: NET SALES, 2017-2019 ($MILLION)
  • FIGURE 49.ANALOG DEVICES: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 50.BROADCOM INC: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 51.BROADCOM INC: NET SALES, 2018-2020 ($MILLION)
  • FIGURE 52.BROADCOM INC: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 53.CYPRESS SEMICONDUCTOR CORPORATION: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 54.CYPRESS SEMICONDUCTOR CORPORATION: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 55.CYPRESS SEMICONDUCTOR CORPORATION: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 56.CYPRESS SEMICONDUCTOR CORPORATION: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 57.DIALOG SEMICONDUCTOR: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 58.DIALOG SEMICONDUCTOR: REVENUE, 2017-2019 ($MILLION)
  • FIGURE 59.DIALOG SEMICONDUCTOR: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 60.DIALOG SEMICONDUCTOR: REVENUE SHARE BY REGION, 2019 (%)
  • FIGURE 61.NXP: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 62.NXP: NET SALES, 2016-2018 ($MILLION)
  • FIGURE 63.NXP: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 64.NXP: REVENUE SHARE, BY REGION, 2019 (%)
  • FIGURE 65.RENESAS ELECTRONICS CORPORATION: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 66.RENESAS ELECTRONICS CORPORATION: NET SALES, 2017-2019 ($MILLION)
  • FIGURE 67.RENESAS ELECTRONICS CORPORATION: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 68.RENESAS ELECTRONICS CORPORATION: REVENUE SHARE, BY REGION, 2019 (%)
  • FIGURE 69.STMICROELECTRONICS: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 70.STMICROELECTRONICS: NET SALES, 2017-2019 ($MILLION)
  • FIGURE 71.STMICROELECTRONICS: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 72.STMICROELECTRONICS: REVENUE SHARE, BY REGION, 2019 (%)
  • FIGURE 73.TI: R&D EXPENDITURE, 2017-2019 ($MILLION)
  • FIGURE 74.TI: NET SALES, 2017-2019 ($MILLION)
  • FIGURE 75.TI: REVENUE SHARE BY SEGMENT, 2019 (%)
  • FIGURE 76.TI: REVENUE SHARE BY REGION, 2019 (%)
目次
Product Code: A05430

Title:
Mixed Signal IC Market by Type (Mixed Signal SoC, Microcontroller, and Data Converter) and End Use (Consumer Electronics, Medical & Healthcare, Telecommunication, Automotive, and Military & Defense): Global Opportunity Analysis and Industry Forecast, 2020-2027.

The global mixed signal IC market was valued at $94.10 billion in 2019, and is projected to reach $149.80 billion by 2027, registering a CAGR of 6.6% from 2020 to 2027. Mixed signal IC is an integrated circuit, which consists of both analog circuit and digital circuit on the same chipset. These ICs are majorly used to convert analog signal such as FM radio signals, light waves, or sound into digital signals for digital devices to process them.

The market is analyzed in accordance with the impacts of the drivers, restraints, and opportunities. The demand for mixed signal ICs s expected to increase rapidly during the forecast period, owing to various factors such as adoption of 5G technology and high demand for low power consumption devices. However, the complexity of designing the mixed signal IC restricts the growth of the market. Conversely, the increase in application of mixed signal ICs in automotive and military & defense is projected to offer remunerative opportunities to the mixed signal IC market.

The global mixed signal IC market size is analyzed on the basis of type, end-use industry, and region. Depending on type, the market is categorized into mixed signal SoC, microcontroller, and data converter IC. By end-use industry, it is fragmented into consumer electronics, medical & healthcare, telecommunication, automotive, and military & defense. Region wise, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with its prominent countries.

The key market leaders in the mixed signal IC market profiled in the report include Analog Devices, Broadcom Inc., Cypress Semiconductor Corporation, Dialog Semiconductor, Ensilica Ltd., NXP Semiconductor, Renesas Electronics Corporation, STMicroelectronics, Telephonics Corporation, and Texas Instrument. Market players have adopted various strategies such as product development, business expansion, joint venture, collaboration, investment, and acquisition to strengthen their foothold in the mixed signal IC market.

Key market segments

By Type

  • Mixed Signal SoC
  • Microcontroller
  • Data Converter

By End Use

  • Consumer Electronics
  • Medical & Healthcare
  • Telecommunication
  • Automotive
  • Military & Defense

By Region

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Rest of Europe
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Rest of Asia-Pacific
  • LAMEA
  • Latin America
  • Middle East
  • Africa
  • Key Market Players
  • Analog Devices
  • Broadcom Inc.
  • Cypress Semiconductor Corporation
  • Dialog Semiconductor
  • Ensilica Ltd.
  • NXP Semiconductor
  • Renesas Electronics Corporation
  • STMicroelectronics
  • Telephonics Corporation
  • Texas Instrument

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

  • 1.1.REPORT DESCRIPTION
  • 1.2.KEY BENEFITS FOR STAKEHOLDERS
  • 1.3.KEY MARKET SEGMENTS
  • 1.4.RESEARCH METHODOLOGY
    • 1.4.1.Primary research
    • 1.4.2.Secondary research
    • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

  • 2.1.KEY FINDINGS OF THE STUDY
  • 2.2.CXO PERSPECTIVE44

CHAPTER 3:MARKET OVERVIEW

  • 3.1.MARKET DEFINITION AND SCOPE
  • 3.2.COVID-19 IMPACT ANALYSIS
  • 3.3.KEY FINDINGS
    • 3.3.1.Top impacting factors
    • 3.3.2.Top investment pockets
  • 3.4.PORTER'S FIVE FORCES ANALYSIS
  • 3.5.MARKET DYNAMICS
    • 3.5.1.Drivers
      • 3.5.1.1.Increasing adoption of 5G Technology
      • 3.5.1.2.Rise in need for low power consumption devices
    • 3.5.2.Restraint
      • 3.5.2.1.Complex integration process of Mixed Signal IC
    • 3.5.3.Opportunities
      • 3.5.3.1.Increasing applications in Automotive Industry
  • 3.6.COVID IMPACT
    • 3.6.1.Impact on market size
    • 3.6.2.End user trends, preferences, and budget impact

CHAPTER 4:GLOBAL MIXED SIGNAL IC MARKET, BY TYPE

  • 4.1.OVERVIEW
  • 4.2.MIXED SIGNAL SOC
    • 4.2.1.Key market trends, growth factors, and opportunities
    • 4.2.2.Market size and forecast, by region
    • 4.2.3.Market analysis, by country
  • 4.3.MICROCONTROLLER
    • 4.3.1.Key market trends, growth factors, and opportunities
    • 4.3.2.Market size and forecast, by region
    • 4.3.3.Market analysis, by country
  • 4.4.DATA CONVERTER
    • 4.4.1.Key market trends, growth factors, and opportunities
    • 4.4.2.Market size and forecast, by region
    • 4.4.3.Market analysis, by country

CHAPTER 5:GLOBAL MIXED SIGNAL IC MARKET, BY END USE

  • 5.1.OVERVIEW
  • 5.2.CONSUMER ELECTRONICS
    • 5.2.1.Key market trends, growth factors, and opportunities
    • 5.2.2.Market size and forecast, by region
    • 5.2.3.Market analysis, by country
  • 5.3.MEDICAL & HEALTHCARE
    • 5.3.1.Key market trends, growth factors, and opportunities
    • 5.3.2.Market size and forecast, by region
    • 5.3.3.Market analysis, by country
  • 5.4.TELECOMMUNICATION
    • 5.4.1.Key market trends, growth factors, and opportunities
    • 5.4.2.Market size and forecast, by region
    • 5.4.3.Market analysis, by country
  • 5.5.AUTOMOTIVE
    • 5.5.1.Key market trends, growth factors, and opportunities
    • 5.5.2.Market size and forecast, by region
    • 5.5.3.Market analysis, by country
  • 5.6.MILITARY & DEFENSE
    • 5.6.1.Key market trends, growth factors, and opportunities
    • 5.6.2.Market size and forecast, by region
    • 5.6.3.Market analysis, by country

CHAPTER 6:MIXED SIGNAL IC MARKET, BY REGION

  • 6.1.OVERVIEW
  • 6.2.NORTH AMERICA
    • 6.2.1.Key market trends, growth factors, and opportunities
    • 6.2.2.Market size and forecast, by type
    • 6.2.3.Market size and forecast, by end use
    • 6.2.4.Market analysis, by country
      • 6.2.4.1.U.S.
      • 6.2.4.1.1.Market size and forecast, by processor
      • 6.2.4.1.2.Market size and forecast, by form factor
      • 6.2.4.2.Canada
      • 6.2.4.2.1.Market size and forecast, by processor
      • 6.2.4.2.2.Market size and forecast, by form factor
      • 6.2.4.3.Mexico
      • 6.2.4.3.1.Market size and forecast, by processor
      • 6.2.4.3.2.Market size and forecast, by form factor
  • 6.3.EUROPE
    • 6.3.1.Key market trends, growth factors, and opportunities
    • 6.3.2.Market size and forecast, by type
    • 6.3.3.Market size and forecast, by end use
    • 6.3.4.Market analysis, by country
      • 6.3.4.1.Germany
      • 6.3.4.1.1.Market size and forecast, by type
      • 6.3.4.1.2.Market size and forecast, by end use
      • 6.3.4.2.UK
      • 6.3.4.2.1.Market size and forecast, by type
      • 6.3.4.2.2.Market size and forecast, by end use
      • 6.3.4.3.France
      • 6.3.4.3.1.Market size and forecast, by type
      • 6.3.4.3.2.Market size and forecast, by end use
      • 6.3.4.4.Rest of Europe
      • 6.3.4.4.1.Market size and forecast, by type
      • 6.3.4.4.2.Market size and forecast, by end use
  • 6.4.ASIA-PACIFIC
    • 6.4.1.Key market trends, growth factors, and opportunities
    • 6.4.2.Market size and forecast, by type
    • 6.4.3.Market size and forecast, by end use
    • 6.4.4.Market analysis, by country
      • 6.4.4.1.China
      • 6.4.4.1.1.Market size and forecast, by type
      • 6.4.4.1.2.Market size and forecast, by end use
      • 6.4.4.2.Japan
      • 6.4.4.2.1.Market size and forecast, by type
      • 6.4.4.2.2.Market size and forecast, by end use
      • 6.4.4.3.India
      • 6.4.4.3.1.Market size and forecast, by type
      • 6.4.4.3.2.Market size and forecast, by end use
      • 6.4.4.4.South Korea
      • 6.4.4.4.1.Market size and forecast, by type
      • 6.4.4.4.2.Market size and forecast, by end use
      • 6.4.4.5.Rest of Asia-Pacific
      • 6.4.4.5.1.Market size and forecast, by type
      • 6.4.4.5.2.Market size and forecast, by end use
  • 6.5.LAMEA
    • 6.5.1.Key market trends, growth factors, and opportunities
    • 6.5.2.Market size and forecast, by type
    • 6.5.3.Market size and forecast, by end use
    • 6.5.5.Market analysis, by country
      • 6.5.5.1.Latin America
      • 6.5.5.1.1.Market size and forecast, by type
      • 6.5.5.1.2.Market size and forecast, by end use
      • 6.5.5.2.Middle East
      • 6.5.5.2.1.Market size and forecast, by type
      • 6.5.5.2.2.Market size and forecast, by end use
      • 6.5.5.3.Africa
      • 6.5.5.3.1.Market size and forecast, by type
      • 6.5.5.3.2.Market size and forecast, by end use

CHAPTER 7:COMPETITIVE LANDSCAPE

  • 7.1.INTRODUCTION
    • 7.1.1.Market player positioning, 2019
  • 7.2.TOP WINNING STRATEGIES
  • 7.3.PRODUCT MAPPING OF TOP 10 PLAYERS
  • 7.4.COMPETITIVE DASHBOARD
  • 7.5.COMPETITIVE HEATMAP

CHAPTER 8:COMPANY PROFILES

  • 8.1.ANALOG DEVICES
    • 8.1.1.Company overview
    • 8.1.2.Key Executives
    • 8.1.3.Company snapshot
    • 8.1.4.Product portfolio
    • 8.1.5.R&D Expenditure
    • 8.1.6.Business performance
    • 8.1.7.Key strategic moves and developments
  • 8.2.BROADCOM INC
    • 8.2.1.Company overview
    • 8.2.2.Key Executives
    • 8.2.3.Company snapshot
    • 8.2.4.Product portfolio
    • 8.2.5.R&D Expenditure
    • 8.2.6.Business performance
    • 8.2.7.Key strategic moves and developments
  • 8.3.CYPRESS SEMICONDUCTOR CORPORATION
    • 8.3.1.Company overview
    • 8.3.2.Key Executive
    • 8.3.3.Company snapshot
    • 8.3.4.Product portfolio
    • 8.3.5.Key strategic moves and developments
    • 8.3.6.R&D Expenditure
    • 8.3.7.Business performance
  • 8.4.DIALOG SEMICONDUCTOR
    • 8.4.1.Company overview
    • 8.4.2.Key Executive
    • 8.4.3.Company snapshot
    • 8.4.4.Product portfolio
    • 8.4.5.Key strategic moves and developments
    • 8.4.6.R&D Expenditure
    • 8.4.7.Business performance
  • 8.5.ENSILICA LTD
    • 8.5.1.Company overview
    • 8.5.2.Key Executive
    • 8.5.3.Company snapshot
    • 8.5.4.Product portfolio
  • 8.6.NXP SEMICONDUCTOR
    • 8.6.1.Company overview
    • 8.6.2.Company snapshot
    • 8.6.3.Product portfolio
    • 8.6.4.R&D Expenditure
    • 8.6.5.Business performance
    • 8.6.6.Key strategic moves and developments
  • 8.7.RENESAS ELECTRONICS CORPORATION
    • 8.7.1.Company overview
    • 8.7.2.Company snapshot
    • 8.7.3.Operating business segments
    • 8.7.4.Product portfolio
    • 8.7.5.R&D Expenditure
    • 8.7.6.Business performance
    • 8.7.7.Key strategic moves and developments
  • 8.8.STMICROELECTRONICS N.V.
    • 8.8.1.Company overview
    • 8.8.2.Company snapshot
    • 8.8.3.Operating business segments
    • 8.8.4.Product portfolio
    • 8.8.5.R&D Expenditure
    • 8.8.6.Business performance
    • 8.8.7.Key strategic moves and developments
  • 8.9.TELEPHONICS CORPORATION
    • 8.9.1.Company overview
    • 8.9.2.Company snapshot
    • 8.9.3.Product portfolio
  • 8.10.TEXAS INSTRUMENTS INCORPORATED
    • 8.10.1.Company overview
    • 8.10.2.Company snapshot
    • 8.10.3.Operating business segments
    • 8.10.4.Product portfolio
    • 8.10.5.R&D expenditure
    • 8.10.6.Business performance