Product Code: A01667
Title:
GaN Power Device Market by Device (GaN Power Discrete Devices, GaN Power ICs, and GaN Power Modules) and Application (Consumer Electronics, IT & Telecommunication, Automotive, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2020-2027.
Power semiconductor devices are incorporated in electronic circuits to regulate the energy transfer of the system. These devices are mostly in the form of a switch, for example, switched mode power supply (SMPS) is a type of power semiconductor device. Power devices that are made of Gallium Nitride (GaN)-a semiconductor material-are called GaN power devices. GaN power device reduces the overall energy loss of the system. Unlike the conventional transistors that requires larger chip space to decrease on-resistance, GaN devices are compact in size and hence provide high speed switching and size contraction of the overall system.
The factors that drive the market growth include decline in prices, better performance as compared to SiC devices, rise in demand for GaN devices for wireless charging, increase in installation of GaN devices in electric vehicle, and growth in requirement of GaN devices in commercial RF applications. However, lack of availability of GaN material and preference of silicon carbide (SiC) in high-voltage semiconductor applications restrain the market growth Moreover, government initiatives in HVDC and smart grid and requirement of GaN power devices in electric and hybrid vehicle provides new opportunities for the players operating in the market are anticipated to provide numerous opportunities for market growth during the forecast period.
Increase in demand for GaN in radio frequency equipment; rise in adoption in the telecommunication industry; and surge in demand for AC fast charger, LiDAR, and wireless power due to its advantages over silicon power devices.
The global GaN power devices market is segmented based on device, application, and region. Based on device, the market is categorized into GaN power discrete devices, GaN power ICs, and GaN power module. By application, the market is classified into consumer electronics, IT & telecommunication, automotive, aerospace & defense, and others. Geographically, it is analyzed across North America (the U.S., Mexico, and Canada), Europe (the UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).
The key players in the GaN power device market that are analyzed in the report are Efficient Power Conversion Corporation (EPC), GaN Systems, On Semiconductors, Panasonic Corporation, VisIC, Texas Instruments Inc., Toshiba Corporation, Fujitsu Limited, Infineon Technologies AG, and Taiwan Semiconductor Manufacturing Company. The key players adopt various key strategies for market growth such as product launch, product development, collaboration, partnership, and various other.
KEY MARKET SEGMENTS
By Device
- GaN Power Discrete Devices
- GaN Power ICs
- GaN Power Module
By Application
- Consumer Electronics
- IT & Telecommunication
- Automotive
- Aerospace & Defense
- Others
-
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- Taiwan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
- Key Market Players
- Efficient Power Conversion Corporation (EPC)
- Fujitsu Limited
- GaN Systems
- On Semiconductors
- Panasonic Corporation
- VisIC
- Texas Instruments Inc.
- Toshiba Corporation,
- Fujitsu Limited
- Infineon Technologies AG
- Taiwan Semiconductor Manufacturing Company
TABLE OF CONTENTS
CHAPTER 1:INTRODUCTION
- 1.1.Report description
- 1.2.Key benefits for stakeholders
- 1.3.Key market segments
- 1.4.Research methodology
- 1.4.1.Primary research
- 1.4.2.Secondary research
- 1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
- 2.1.Key findings
- 2.1.1.Top impacting factors
- 2.1.2.Top investment pockets
- 2.2.CXO perspective
CHAPTER 3:MARKET OVERVIEW
- 3.1.Market definition and scope
- 3.2.Key forces shaping GaN power device market
- 3.3.Market dynamICs
- 3.3.1.Drivers
- 3.3.1.1.Decrease in prices of GaN devices
- 3.3.1.2.Rise in demand for GaN devices for wireless charging
- 3.3.1.3.Increase in adoption of GaN devices in electric vehicle
- 3.3.1.4.Increase in requirement of GaN devices for commercial RF applications
- 3.3.2.Restraint
- 3.3.2.1.Lack of availability of GaN material
- 3.3.3.Opportunities
- 3.3.3.1.Government initiatives in HVDC and smart grid
CHAPTER 4:GAN POWER DEVICE MARKET, BY DEVICE
- 4.1.Overview
- 4.2.GaN power discrete devices
- 4.2.1.Key market trends, growth factors, and opportunities
- 4.2.2.Market size and forecast, by region
- 4.2.3.Market analysis, by country
- 4.3.GaN power ICs
- 4.3.1.Key market trends, growth factors, and opportunities
- 4.3.2.Market size and forecast, by region
- 4.3.3.Market analysis, by country
- 4.4.GaN power module
- 4.4.1.Key market trends, growth factors, and opportunities
- 4.4.2.Market size and forecast, by region
- 4.4.3.Market analysis, by country
CHAPTER 5:GAN POWER DEVICE MARKET, BY INDUSTRIAL VERTICAL
- 5.1.Overview
- 5.2.Consumer electronICs
- 5.2.1.Key market trends, growth factors, and opportunities
- 5.2.2.Market size and forecast, by region
- 5.2.3.Market analysis, by country
- 5.3.IT & telecommunication
- 5.3.1.Key market trends, growth factors, and opportunities
- 5.3.2.Market size and forecast, by region
- 5.3.3.Market analysis, by country
- 5.4.Automotive
- 5.4.1.Key market trends, growth factors, and opportunities
- 5.4.2.Market size and forecast, by region
- 5.4.3.Market analysis, by country
- 5.5.Aerospace & defense
- 5.5.1.Key market trends, growth factors, and opportunities
- 5.5.2.Market size and forecast, by region
- 5.5.3.Market analysis, by country
- 5.6.Other
- 5.6.1.Key market trends, growth factors, and opportunities
- 5.6.2.Market size and forecast, by region
- 5.6.3.Market analysis, by country
CHAPTER 6:GAN POWER DEVICE MARKET, BY REGION
- 6.1.Overview
- 6.2.North America
- 6.2.1.Key market trends, growth factors, and opportunities
- 6.2.2.Market size and forecast, by device
- 6.2.3.Market size and forecast, by industry vertical
- 6.2.4.Market analysis, by region
- 6.2.4.1.U.S.
- 6.2.4.1.1.Market size and forecast, by device
- 6.2.4.1.2.Market size and forecast, by industry vertical
- 6.2.4.2.Canada
- 6.2.4.2.1.Market size and forecast, by device
- 6.2.4.2.2.Market size and forecast, by industry vertical
- 6.2.4.3.Mexico
- 6.2.4.3.1.Market size and forecast, by device
- 6.2.4.3.2.Market size and forecast, by industry vertical
- 6.3.Europe
- 6.3.1.Key market trends, growth factors, and opportunities
- 6.3.2.Market size and forecast, by device
- 6.3.3.Market size and forecast, by industry vertical
- 6.3.4.Market analysis, by region
- 6.3.4.1.UK
- 6.3.4.1.1.Market size and forecast, by device
- 6.3.4.1.2.Market size and forecast, by industry vertical
- 6.3.4.2.Germany
- 6.3.4.2.1.Market size and forecast, by device
- 6.3.4.2.2.Market size and forecast, by industry vertical
- 6.3.4.3.France
- 6.3.4.3.1.Market size and forecast, by device
- 6.3.4.3.2.Market size and forecast, by industry vertical
- 6.3.4.4.Rest of Europe
- 6.3.4.4.1.Market size and forecast, by device
- 6.3.4.4.2.Market size and forecast, by industry vertical
- 6.4.Asia-Pacific
- 6.4.1.Key market trends, growth factors, and opportunities
- 6.4.2.Market size and forecast, by device
- 6.4.3.Market size and forecast, by industry vertical
- 6.4.4.Market analysis, by region
- 6.4.4.1.China
- 6.4.4.1.1.Market size and forecast, by device
- 6.4.4.1.2.Market size and forecast, by industry vertical
- 6.4.4.2.Japan
- 6.4.4.2.1.Market size and forecast, by device
- 6.4.4.2.2.Market size and forecast, by industry vertical
- 6.4.4.3.Taiwan
- 6.4.4.3.1.Market size and forecast, by device
- 6.4.4.3.2.Market size and forecast, by industry vertical
- 6.4.4.4.South Korea
- 6.4.4.4.1.Market size and forecast, by device
- 6.4.4.4.2.Market size and forecast, by industry vertical
- 6.4.4.5.Rest of Asia-Pacific
- 6.4.4.5.1.Market size and forecast, by device
- 6.4.4.5.2.Market size and forecast, by industry vertical
- 6.5.LAMEA
- 6.5.1.Key market trends, growth factors, and opportunities
- 6.5.2.Market size and forecast, by device
- 6.5.3.Market size and forecast, by industry vertical
- 6.5.4.Market analysis, by region
- 6.5.4.1.Latin America
- 6.5.4.1.1.Market size and forecast, by device
- 6.5.4.1.2.Market size and forecast, by industry vertical
- 6.5.4.2.Middle East
- 6.5.4.2.1.Market size and forecast, by device
- 6.5.4.2.2.Market size and forecast, by application
- 6.5.4.3.Africa
- 6.5.4.3.1.Market size and forecast, by type
- 6.5.4.3.2.Market size and forecast, by application
CHAPTER 7:COMPETITIVE LANDSCAPE
- 7.1.Introduction
- 7.2.Top winning strategies
- 7.2.1.Top winning strategies, by year
- 7.2.2.Top winning strategies, by development
- 7.2.3.Top winning strategies, by company
CHAPTER 8:COMPANY PROFILES
- 8.1.Efficient Power Conversion Corporation Inc.
- 8.1.1.Company overview
- 8.1.2.Key Executives
- 8.1.3.Company snapshot
- 8.1.4.Product portfolio
- 8.1.5.Key strategic moves and developments
- 8.2.FUJITSU limited
- 8.2.1.Company overview
- 8.2.2.Key Executives
- 8.2.3.Company snapshot
- 8.2.4.Product portfolio
- 8.2.5.Business performance
- 8.2.6.Key strategic moves and developments
- 8.3.GaN Systems Inc.
- 8.3.1.Company overview
- 8.3.2.Company snapshot
- 8.3.3.Product portfolio
- 8.3.4.Key strategic moves and developments
- 8.4.Infineon Technologies AG
- 8.4.1.Company overview
- 8.4.2.Company snapshot
- 8.4.3.Operating business segments
- 8.4.4.Product portfolio
- 8.4.5.Business performance
- 8.4.6.Key strategic moves and developments
- 8.5.ON SEMICONDUCTOR CORPORATION
- 8.5.1.Company overview
- 8.5.2.Company snapshot
- 8.5.3.Product portfolio
- 8.5.4.Business performance
- 8.5.5.Key strategic moves and developments
- 8.6.PANASONIC CORPORATION
- 8.6.1.Company overview
- 8.6.2.Company snapshot
- 8.6.3.Operating business segments
- 8.6.4.Product portfolio
- 8.6.5.R&D Expenditure
- 8.6.6.Business performance
- 8.7.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 8.7.1.Company overview
- 8.7.2.Company snapshot
- 8.7.3.Product portfolio
- 8.7.4.Business performance
- 8.7.5.Key strategic moves and developments
- 8.8.TEXAS INSTRUMENTS INC.
- 8.8.1.Company overview
- 8.8.2.Company snapshot
- 8.8.3.Operating business segments
- 8.8.4.Product portfolio
- 8.8.5.Business performance
- 8.8.6.Key strategic moves and developments
- 8.9.Toshiba Corporation
- 8.9.1.Company overview
- 8.9.2.Key Executives
- 8.9.3.Company snapshot
- 8.9.4.Business Segment
- 8.9.5.Product portfolio
- 8.9.6.Business performance
- 8.10.VISIC TECHNOLOGIES LTD
- 8.10.1.Company overview
- 8.10.2.Company snapshot
- 8.10.3.Product portfolio
- 8.10.4.Key strategic moves and developments