デフォルト表紙
市場調査レポート
商品コード
1059571

ウエハバックグラインドテープの世界市場の成長機会・産業予測 (2021-2030年):タイプ (UV硬化型・非UV硬化型)・ウエハサイズ (6インチ・8インチ・12インチ・その他) 別

Wafer Backgrinding Tape Market By Type (UV Curable and Non-UV), and Wafer Size (6-Inch, 8-Inch, 12-Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2021-2030

出版日: | 発行: Allied Market Research | ページ情報: 英文 180 Pages | 納期: 2~3営業日

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=135.61円
ウエハバックグラインドテープの世界市場の成長機会・産業予測 (2021-2030年):タイプ (UV硬化型・非UV硬化型)・ウエハサイズ (6インチ・8インチ・12インチ・その他) 別
出版日: 2021年12月21日
発行: Allied Market Research
ページ情報: 英文 180 Pages
納期: 2~3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界のウエハバックグラインドテープの市場は、ウエハ製造ニーズの高まり、研削加工時のウエハ表面保護への関心の高まり、半導体産業の成長などの要因が成長を後押ししています。

また、韓国や中国を中心としたウエハ製造装置や材料への投資の増加も市場拡大の好機となることが予想されています。一方で、非UV硬化型からUV硬化型のバックグラインドテープへの移行が進み、ウエハ製造の総コストが上昇することが、市場成長の妨げになると予想されています。

当レポートでは、世界のウエハバックグラインドテープの市場を調査し、市場の定義と概要、市場影響因子の分析、市場規模の推移・予測、タイプ・ウエハサイズ・地域/主要国など各種区分別の内訳、競合環境、主要企業のプロファイルなどをまとめています。

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 市場概要

  • 市場の定義・範囲
  • 主な調査結果
  • ポーターのファイブフォース分析
  • 市場力学
    • 促進要因
    • 抑制要因
    • 市場機会
  • COVID-19:影響分析

第4章 ウエハバックグラインドテープ市場:タイプ別

  • 概要
  • UV硬化型
  • 非UV硬化型
    • 主要市場動向・成長要因・機会
    • 市場規模・予測:地域別
    • 市場分析:国別

第5章 ウエハバックグラインドテープ市場:ウエハサイズ別

  • 概要
  • 6インチ
  • 8インチ
  • 12インチ
  • その他
    • 主要市場動向・成長要因・機会
    • 市場規模・予測:地域別
    • 市場分析:国別

第6章 ウエハバックグラインドテープ市場:地域別

  • 概要
  • 北米
  • 欧州
  • アジア太平洋
  • ラテンアメリカ・中東・アフリカ
    • 主要市場動向・成長要因・機会
    • 市場規模・予測:タイプ別
    • 市場規模・予測:ウエハサイズ別
    • 市場分析:国別

第7章 競合情勢

  • 主な成功戦略
  • 競合ダッシュボード
  • 競合ヒートマップ

第8章 企業プロファイル

  • AI TECHNOLOGY, INC.
  • AMC CO., LTD
  • DENKA COMPANY LIMITED
  • FURUKAWA ELECTRIC CO., LTD.
  • FORCE-ONE APPLIED MATERIALS
  • LINTEC OF AMERICA, INC(LINTEC CORPORATION)
  • MITSUI CHEMICALS, INC.
  • NITTO DENKO CORPORATION
  • PANTECH TAPE CO., LTD.
  • MINITRON ELEKTRONIK GmbH
図表

LIST OF TABLES

  • TABLE 01.GLOBAL WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 02.WAFER BACKGRINDING TAPE MARKET REVENUE FOR UV CURABLE, BY REGION 2020-2030 ($MILLION)
  • TABLE 03.WAFER BACKGRINDING TAPE MARKET REVENUE FOR NON-UV, BY REGION 2020-2030 ($MILLION)
  • TABLE 04.GLOBAL WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030($MILLION)
  • TABLE 05.6-INCH WAFER BACKGRINDING TAPE MARKET REVENUE, BY REGION 2020-2030 ($MILLION)
  • TABLE 06.8-INCH WAFER BACKGRINDING TAPE MARKET REVENUE, BY REGION 2020-2030 ($MILLION)
  • TABLE 07.12-INCH WAFER BACKGRINDING TAPE MARKET REVENUE, BY REGION 2020-2030 ($MILLION)
  • TABLE 08.WAFER BACKGRINDING TAPE MARKET REVENUE FOR OTHERS, BY REGION 2020-2030 ($MILLION)
  • TABLE 09.WAFER BACKGRINDING TAPE MARKET REVENUE, BY REGION 2020-2030 ($MILLION)
  • TABLE 10.NORTH AMERICAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 11.NORTH AMERICAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 12.U. S. WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 13.U. S. WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 14.CANADA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 15.CANADA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 16.MEXICO WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 17.MEXICO WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 18.EUROPEAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 19.EUROPEAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 20.UK WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 21.UK WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 22.GERMANY WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 23.GERMANY WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 24.FRANCE WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 25.FRANCE WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 26.RUSSIA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 27.RUSSIA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 28.REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 29.REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 30.ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 31.ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 32.CHINA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 33.CHINA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 34.JAPAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 35.JAPAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 36.TAIWAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 37.TAIWAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 38.SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 39.SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 40.REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 41.REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 42.LAMEA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 43.LAMEA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 44.LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 45.LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 46.MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2020-2030 ($MILLION)
  • TABLE 47.MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2020-2030 ($MILLION)
  • TABLE 48.AI TECHNOLOGY, INC.: COMPANY SNAPSHOT
  • TABLE 49.AI TECHNOLOGY, INC.: PRODUCT PORTFOLIO
  • TABLE 50.AMC CO., LTD: COMPANY SNAPSHOT
  • TABLE 51.AMC CO., LTD: PRODUCT PORTFOLIO
  • TABLE 52.DENKA COMPANY LIMITED: COMPANY SNAPSHOT
  • TABLE 53.DENKA COMPANY LIMITED: OPERATING SEGMENTS
  • TABLE 54.DENKA COMPANY LIMITED: PRODUCT PORTFOLIO
  • TABLE 55.DENKA COMPANY LIMITED: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 56.FURUKAWA ELECTRIC CO., LTD.: COMPANY SNAPSHOT
  • TABLE 57.FURUKAWA ELECTRIC CO., LTD.: OPERATING SEGMENTS
  • TABLE 58.FURUKAWA ELECTRIC CO., LTD.: PRODUCT PORTFOLIO
  • TABLE 59.FURUKAWA ELECTRIC CO., LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 60.FORCE-ONE APPLIED MATERIALS: COMPANY SNAPSHOT
  • TABLE 61.FORCE-ONE APPLIED MATERIALS: PRODUCT PORTFOLIO
  • TABLE 62.LINTEC OF AMERICA, INC: COMPANY SNAPSHOT
  • TABLE 63.LINTEC OF AMERICA, INC: OPERATING SEGMENTS
  • TABLE 64.LINTEC OF AMERICA, INC: PRODUCT PORTFOLIO
  • TABLE 65.LINTEC OF AMERICA, INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 66.MITSUI CHEMICALS, INC.: COMPANY SNAPSHOT
  • TABLE 67.MITSUI CHEMICALS, INC.: OPERATING SEGMENTS
  • TABLE 68.MITSUI CHEMICALS, INC.: PRODUCT PORTFOLIO
  • TABLE 69.MITSUI CHEMICALS, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 70.NITTO DENKO CORPORATION: COMPANY SNAPSHOT
  • TABLE 71.NITTO DENKO CORPORATION: OPERATING SEGMENTS
  • TABLE 72.NITTO DENKO CORPORATION: PRODUCT PORTFOLIO
  • TABLE 73.NITTO DENKO CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 74.PANTECH TAPE CO., LTD.: COMPANY SNAPSHOT
  • TABLE 75.PANTECH TAPE CO., LTD.: PRODUCT PORTFOLIO
  • TABLE 76.MINITRON ELEKTRONIK GMBH: COMPANY SNAPSHOT
  • TABLE 77.MINITRON ELEKTRONIK GMBH: PRODUCT PORTFOLIO

LIST OF FIGURES

  • FIGURE 01.KEY MARKET SEGMENTS
  • FIGURE 02.EXECUTIVE SUMMARY, BY SEGMENTATION
  • FIGURE 03.EXECUTIVE SUMMARY, BY REGION
  • FIGURE 04.TOP IMPACTING FACTORS
  • FIGURE 05.TOP INVESTMENT POCKETS
  • FIGURE 06.LOW BARGAINING POWER OF SUPPLIERS
  • FIGURE 07.MODERATE THREAT OF NEW ENTRANTS
  • FIGURE 08.LOW THREAT OF SUBSTITUTES
  • FIGURE 09.MODERATE INTENSITY OF RIVALRY
  • FIGURE 10.MODERATE BARGAINING POWER OF BUYERS
  • FIGURE 11.GLOBAL WAFER BACKGRINDING TAPE MARKET SHARE, BY TYPE, 2020-2030 (%)
  • FIGURE 12.COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR UV CURABLE, BY COUNTRY, 2020 & 2030 (%)
  • FIGURE 13.COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR NON-UV, BY COUNTRY, 2020 & 2030 (%)
  • FIGURE 14.GLOBAL WAFER BACKGRINDING TAPE MARKET SHARE, BY WAFER SIZE, 2020-2030 (%)
  • FIGURE 15.COMPARATIVE SHARE ANALYSIS OF 6-INCH WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2020 & 2030 (%)
  • FIGURE 16.COMPARATIVE SHARE ANALYSIS OF 8-INCH WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2020 & 2030 (%)
  • FIGURE 17.COMPARATIVE SHARE ANALYSIS OF 12-INCH WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2020 & 2030 (%)
  • FIGURE 18.COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
  • FIGURE 19.WAFER BACKGRINDING TAPE MARKET, BY REGION, 2020-2030 (%)
  • FIGURE 20.COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2020-2030 (%)
  • FIGURE 21.U.S. WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 22.CANADA WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 23.MEXICO WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 24.COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2020-2030 (%)
  • FIGURE 25.UK WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 26.GERMANY WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 27.FRANCE WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 28.RUSSIA WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 29.REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 30.COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2020-2030 (%)
  • FIGURE 31.CHINA WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 32.JAPAN WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 33.TAIWAN WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 34.SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 35.REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 36.COMPARATIVE SHARE ANALYSIS OF WAFER BACKGRINDING TAPE MARKET, BY COUNTRY, 2020-2030 (%)
  • FIGURE 37.LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 38.MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, 2020-2030 ($MILLION)
  • FIGURE 39.MARKET PLAYER POSITIONING, 2020
  • FIGURE 40.TOP WINNING STRATEGIES, BY YEAR, 2017-2021*
  • FIGURE 41.TOP WINNING STRATEGIES, BY DEVELOPMENT, 2017-2021*
  • FIGURE 42.TOP WINNING STRATEGIES, BY COMPANY, 2017-2021*
  • FIGURE 43.COMPETITIVE DASHBOARD
  • FIGURE 44.COMPETITIVE HEATMAP OF KEY PLAYERS
  • FIGURE 45.DENKA COMPANY LIMITED: REVENUE, 2018-2020 ($BILLION)
  • FIGURE 46.DENKA COMPANY LIMITED: REVENUE SHARE BY SEGMENT, 2018 (%)
  • FIGURE 47.FURUKAWA ELECTRIC CO., LTD.: REVENUE, 2018-2020 ($MILLION)
  • FIGURE 48.FURUKAWA ELECTRIC CO., LTD.: REVENUE SHARE BY SEGMENT, 2020 (%)
  • FIGURE 49.FURUKAWA ELECTRIC CO., LTD.: REVENUE SHARE BY REGION, 2020 (%)
  • FIGURE 50.LINTEC: REVENUE, 2018-2020 ($MILLION)
  • FIGURE 51.LINTEC: REVENUE SHARE BY SEGMENT, 2020 (%)
  • FIGURE 52.MITSUI CHEMICALS, INC.: REVENUE, 2018-2020 ($MILLION)
  • FIGURE 53.MITSUI CHEMICALS, INC.: REVENUE SHARE BY SEGMENT, 2020 (%)
  • FIGURE 54.MITSUI CHEMICALS, INC.: REVENUE SHARE BY REGION, 2020 (%)
  • FIGURE 55.NITTO DENKO CORPORATION: REVENUE, 2018-2020 ($MILLION)
  • FIGURE 56.NITTO DENKO CORPORATION: REVENUE SHARE BY SEGMENT, 2020 (%)
目次
Product Code: SE_195394 / A05029

Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits. It is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly. It is also referred to as wafer thinning. Most package types in the semiconductor industry today would require a wafer thickness ranging from 8 mils to 20 mils.

Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.

On March 14, 2017, Furukawa Electric Co., launched "Plasma Masked Backgrind Tape" for laser grooving and plasma dicing. The tape is expected to improve the quality of chips and wafers.

The factors such as rise in need for wafer fabrication, increase in focus toward wafer surface protection during grinding process, and growth in the semiconductor industry boost the growth of the wafer backgrinding tapes market globally. However, increase in shift from non-UV to UV curable backgrinding tapes that increase the overall cost of wafer manufacturing is expected to hamper the market growth.

Furthermore, increase in investment in wafer fabrication equipment and materials, especially in Korea and China, is expected to offer lucrative opportunities for market expansion.

The wafer backgrinding tapes market is segmented on the basis of type, wafer size, and region. By type, the market is bifurcated into UV curable and Non-UV. By wafer size, the market is divided into 6-inch, 8-inch, 12-inch, and others. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

Wafer Backgrinding Tape Market Key Segments

By Type

  • UV Curable
  • Non-UV

By Wafer Size

  • 6-Inch
  • 8-Inch
  • 12-Inch
  • Others

By Region

  • North America
  • U.S.
  • Canada
  • Mexico
  • Europe
  • UK
  • Germany
  • France
  • Russia
  • Rest of Europe
  • Asia-Pacific
  • China
  • Japan
  • Taiwan
  • South Korea
  • Rest of Asia-Pacific
  • LAMEA
  • Latin America
  • Middle East & Africa
  • Key Market Players
  • AI Technology Inc.
  • AMC Co. Ltd.
  • Denka Company Limited
  • Furukawa Electric Co. Ltd.
  • Force-One Applied Materials
  • Lintec of America Inc. (Lintec Corporation)
  • Mitsui Chemicals Inc.
  • Nitto Denko Corporation
  • Pantech Tape Co. Ltd.
  • Minitron Elektronik GmbH

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

  • 1.1.Report description
  • 1.2.Key benefits for stakeholders
  • 1.3.Key market segments
  • 1.4.Research methodology
    • 1.4.1.Primary research
    • 1.4.2.Secondary research
    • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

  • 2.1.CXO perspective

CHAPTER 3:MARKET OVERVIEW

  • 3.1.Market definition and scope
  • 3.2.Key findings
    • 3.2.1.Top impacting factors
    • 3.2.2.Top investment pockets
  • 3.3.Porter's five forces analysis
  • 3.5.Market dynamics
    • 3.5.1.Drivers
      • 3.5.1.1.Increase in demand for ultra-thin wafers
      • 3.5.1.2.Rise in need for wafer fabrication
      • 3.5.1.3.Increase in focus toward wafer surface protection during grinding process
      • 3.5.1.4.Growth in the semiconductor industry
    • 3.5.2.Restraint
      • 3.5.2.1.Increase in cost of wafer manufacturing
    • 3.5.3.Opportunity
      • 3.5.3.1.Increase in investment in wafer fabrication equipment and materials
  • 3.6.COVID-19 impact analysis
    • 3.6.1.COVID-19 Outbreak
    • 3.6.2.Impact on market size
    • 3.6.3.End user trends, preferences, and budget impact
    • 3.6.4.Key player strategies to tackle negative impact
      • 3.6.4.1.Limiting cuts to R&D expense:
      • 3.6.4.2.Shifting toward agile supply chain model
    • 3.6.5.Opportunity window

CHAPTER 4:WAFER BACKGRINDING TAPE MARKET, BY TYPE

  • 4.1.Overview
  • 4.2.UV Curable
    • 4.2.1.Key market trends, growth factors, and opportunities
    • 4.2.2.Market size and forecast, by region
    • 4.2.3.Market analysis, by country
  • 4.3.Non-UV
    • 4.3.1.Key market trends, growth factors, and opportunities
    • 4.3.2.Market size and forecast, by region
    • 4.3.3.Market analysis, by country

CHAPTER 5:WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE

  • 5.1.Overview
  • 5.2.6-Inch
    • 5.2.1.Key market trends, growth factors, and opportunities
    • 5.2.2.Market size and forecast, by region
    • 5.2.3.Market analysis, by country
  • 5.3.8-Inch
    • 5.3.1.Key market trends, growth factors, and opportunities
    • 5.3.2.Market size and forecast, by region
    • 5.3.3.Market analysis, by country
  • 5.4.12-Inch
    • 5.4.1.Key market trends, growth factors, and opportunities
    • 5.4.2.Market size and forecast, by region
    • 5.4.3.Market analysis, by country
  • 5.5.Others
    • 5.5.1.Key market trends, growth factors, and opportunities
    • 5.5.2.Market size and forecast, by region
    • 5.5.3.Market analysis, by country

CHAPTER 6:WAFER BACKGRINDING TAPE MARKET, BY REGION

  • 6.1.Overview
  • 6.2.North America
    • 6.2.1.Key market trends, growth factors, and opportunities
    • 6.2.2.Market size and forecast, by type
    • 6.2.3.Market size and forecast, by wafer size
    • 6.2.4.Market analysis, by country
      • 6.2.4.1.U.S.
      • 6.2.4.1.1.Market size and forecast, by type
      • 6.2.4.1.2.Market size and forecast, by wafer size
      • 6.2.4.2.Canada
      • 6.2.4.2.1.Market size and forecast, by type
      • 6.2.4.2.2.Market size and forecast, by wafer size
      • 6.2.4.3.Mexico
      • 6.2.4.3.1.Market size and forecast, by type
      • 6.2.4.3.2.Market size and forecast, by wafer size
  • 6.3.Europe
    • 6.3.1.Key market trends, growth factors, and opportunities
    • 6.3.2.Market size and forecast, by type
    • 6.3.3.Market size and forecast, by wafer size
    • 6.3.4.Market analysis, by country
      • 6.3.4.1.UK
      • 6.3.4.1.1.Market size and forecast, by type
      • 6.3.4.1.2.Market size and forecast, by wafer size
      • 6.3.4.2.Germany
      • 6.3.4.2.1.Market size and forecast, by type
      • 6.3.4.2.2.Market size and forecast, by wafer size
      • 6.3.4.3.France
      • 6.3.4.3.1.Market size and forecast, by type
      • 6.3.4.3.2.Market size and forecast, by wafer size
      • 6.3.4.4.Russia
      • 6.3.4.4.1.Market size and forecast, by type
      • 6.3.4.4.2.Market size and forecast, by wafer size
      • 6.3.4.5.Rest of Europe
      • 6.3.4.5.1.Market size and forecast, by type
      • 6.3.4.5.2.Market size and forecast, by wafer size
  • 6.4.Asia-Pacific
    • 6.4.1.Key market trends, growth factors, and opportunities
    • 6.4.2.Market size and forecast, by type
    • 6.4.3.Market size and forecast, by wafer size
    • 6.4.4.Market analysis, by country
      • 6.4.4.1.China
      • 6.4.4.1.1.Market size and forecast, by type
      • 6.4.4.1.2.Market size and forecast, by wafer size
      • 6.4.4.2.Japan
      • 6.4.4.2.1.Market size and forecast, by type
      • 6.4.4.2.2.Market size and forecast, by wafer size
      • 6.4.4.3.Taiwan
      • 6.4.4.3.1.Market size and forecast, by type
      • 6.4.4.3.2.Market size and forecast, by wafer size
      • 6.4.4.4.South Korea
      • 6.4.4.4.1.Market size and forecast, by type
      • 6.4.4.4.2.Market size and forecast, by wafer size
      • 6.4.4.5.Rest of Asia-Pacific
      • 6.4.4.5.1.Market size and forecast, by type
      • 6.4.4.5.2.Market size and forecast, by wafer size
  • 6.5.LAMEA
    • 6.5.1.Key market trends, growth factors, and opportunities
    • 6.5.2.Market size and forecast, by type
    • 6.5.3.Market size and forecast, by wafer size
    • 6.5.4.Market analysis, by country
      • 6.5.4.1.Latin America
      • 6.5.4.1.1.Market size and forecast, by type
      • 6.5.4.1.2.Market size and forecast, by wafer size
      • 6.5.4.2.Middle East & Africa
      • 6.5.4.2.1.Market size and forecast, by type
      • 6.5.4.2.2.Market size and forecast, by wafer size

CHAPTER 7:COMPETITIVE LANDSCAPE

  • 7.1.Introduction
    • 7.1.1.Market player positioning, 2020
  • 7.2.Top Winning Strategies
  • 7.3.Competitive dashboard
  • 7.4.Competitive heatmap

CHAPTER 8:COMPANY PROFILES

  • 8.1.AI TECHNOLOGY, INC.
    • 8.1.1.Company overview
    • 8.1.2.Company snapshot
    • 8.1.3.Product portfolio
  • 8.2.AMC CO., LTD
    • 8.2.1.Company overview
    • 8.2.2.Company snapshot
    • 8.2.3.Product portfolio
  • 8.3.DENKA COMPANY LIMITED
    • 8.3.1.Company overview
    • 8.3.2.Company snapshot
    • 8.3.3.Operating business segments
    • 8.3.4.Product portfolio
    • 8.3.5.Business performance
    • 8.3.6.Key strategic moves and developments
  • 8.4.FURUKAWA ELECTRIC CO., LTD.
    • 8.4.1.Company overview
    • 8.4.2.Company snapshot
    • 8.4.3.Operating business segments
    • 8.4.4.Product portfolio
    • 8.4.5.Business performance
    • 8.4.6.Key strategic moves and developments
  • 8.5.FORCE-ONE APPLIED MATERIALS
    • 8.5.1.Company overview
    • 8.5.2.Company snapshot
    • 8.5.3.Product portfolio
  • 8.6.LINTEC OF AMERICA, INC (LINTEC CORPORATION)
    • 8.6.1.Company overview
    • 8.6.2.Company snapshot
    • 8.6.3.Operating business segments
    • 8.6.4.Product portfolio
    • 8.6.5.Business performance
    • 8.6.6.Key strategic moves and developments
  • 8.7.MITSUI CHEMICALS, INC.
    • 8.7.1.Company overview
    • 8.7.2.Company snapshot
    • 8.7.3.Operating business segments
    • 8.7.4.Product portfolio
    • 8.7.5.Business performance
    • 8.7.6.Key strategic moves and developments
  • 8.8.NITTO DENKO CORPORATION
    • 8.8.1.Company overview
    • 8.8.2.Company snapshot
    • 8.8.3.Operating business segments
    • 8.8.4.Product portfolio
    • 8.8.5.Business performance
    • 8.8.6.Key strategic moves and developments
  • 8.9.PANTECH TAPE CO., LTD.
    • 8.9.1.Company overview
    • 8.9.2.Company snapshot
    • 8.9.3.Product portfolio
  • 8.10.MINITRON ELEKTRONIK GmbH
    • 8.10.1.Company overview
    • 8.10.2.Company snapshot
    • 8.10.3.Product portfolio