市場調査レポート

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1179566

半導体組立・検査受託市場：プロセス別、パッケージタイプ別、アプリケーション別：世界の機会分析および産業予測、2021-2031年

Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031

出版日: 2022年09月01日 | 発行: Allied Market Research

| ページ情報: 英文 225 Pages | 納期: 2～3営業日

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全表示
概要
図表
目次

概要

サンプル依頼リストに入れる

世界の半導体組立・検査受託市場は、2021年に345億5350万米ドル、2031年には603億3450万米ドルに達し、2022年から2031年までのCAGRは6.32%を記録すると予測されています。

OSAT（Outsourced Semiconductor Assembly and Test）は、ICパッケージングとテストサービスを提供する企業の数です。IDMやファウンドリは、ICパッケージング生産の一定割合をOSATに委託し、自社でパッケージング作業を行うことが多いです。OSATは主に、消費財、通信、コンピューター、モノのインターネット（IoT）、カーエレクトロニクス、ウェアラブルデバイスなどの新興市場など、さまざまな市場の半導体企業向けに先進的なパッケージングとテストソリューションを提供することに重点を置いています。

世界の半導体組立・検査受託市場は、家電製品の需要増加や都市化の進展が主な要因となっています。また、スマートフォンの普及が市場の成長を大きく後押ししています。しかし、OSATサービスに関連する高コストが、予測期間中の市場成長の妨げになる可能性があります。一方、チップ市場の成長はOSAT企業にとって大きなビジネスチャンスとなることが予想されます。

アセンブリセグメントは、2021年に最大の収益貢献者であり、2022年から2031年にかけてCAGR 6.46%で成長すると予測されます。これは、半導体製造業界における効果的なサプライチェーン管理のニーズが高まっていることに起因しています。パッケージタイプ別では、ボールグリッドアレイセグメントが2020年の収益貢献度トップで、2022年から2031年までのCAGRは5.63%で成長すると予測されています。半導体産業における技術の進歩は、より薄く、より軽いエレクトロニクス製品の需要の急増につながっています。

このような背景から、ボールグリッドアレイタイプのパッケージは、小型化という利点を持つことから、主にこのタイプの成長を牽引しています。半導体組立・検査受託市場の動向を地域別に見ると、北米、欧州、アジア太平洋、ラムエリアの4地域で分析が行われています。分析によると、2021年に北米が最大の収益に貢献したことが確認されました。これは、工業化の進展、自動車産業や通信産業の急速な発展に起因するものです。

概要
- 市場規模・予測
ソーイング
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別分析
ソーティング
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
テスティング
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
アセンブリ
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別

第5章半導体組立・検査受託市場：パッケージングタイプ別

概要
- 市場規模・予測
ボールグリッドアレイ
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
チップスケールパッケージ
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
マルチパッケージ
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
スタックド・ダイ
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
クアッド、デュアル
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別

第6章半導体組立・検査受託市場：用途別

概要
- 市場規模・予測
自動車分野
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
民生用電子機器
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
産業用機器
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
通信分野
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
航空宇宙・防衛
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
医療・ヘルスケア
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別
物流・輸送
- 主な市場動向、成長要因、機会
- 市場規模・予測：地域別
- 市場分析：国別

第7章半導体組立・検査受託市場：地域別

概要
- 市場規模・予測
北米
- 主な動向と機会
- 北米市場規模推移・予測：プロセス別
- 北米市場規模・予測：包装タイプ別
- 北米市場規模・予測：アプリケーション別
- 北米市場規模・予測：国別
  - 米国
  - カナダ
  - メキシコ
欧州
- 主な動向と機会
- 欧州の市場規模・予測：プロセス別
- 欧州市場規模・予測：包装タイプ別
- 欧州市場規模・予測：アプリケーション別
- 欧州市場規模・予測：国別
  - 英国
  - ドイツ
  - フランス
  - イタリア
  - ロシア
  - スウェーデン
  - オランダ
  - その他の欧州地域
アジア太平洋地域
- 主な動向と機会
- アジア太平洋地域の市場規模・予測：プロセス別
- アジア太平洋地域の市場規模・予測：包装タイプ別
- アジア太平洋地域の市場規模・予測：アプリケーション別
- アジア太平洋地域の市場規模・予測：国別
  - 中国
  - インド
  - 日本
  - 韓国
  - その他の欧州地域
LAMEA
- 主な動向と機会
- LAMEAの市場規模・予測：プロセス別
- LAMEAの市場規模・予測：包装タイプ別
- LAMEAの市場規模・予測：アプリケーション別
- LAMEAの市場規模・予測：国別
  - ラテンアメリカ
  - 中東
  - アフリカ

第8章企業情勢

イントロダクション
主要成功戦略
主要10社の製品マッピング
競合ダッシュボード
競合のヒートマップ
主な発展

第9章企業プロファイル

ADVANCED SILICON S.A.
ALPHACORE INC.
AMKOR TECHNOLOGY, INC
DEVICE ENGINEERING INC.
HIDENSITY GROUP（HMT MICROELECTRONIC AG）
PRESTO ENGINEERING GROUP
Sencio BV
SHORTLINK GROUP
SIFIVE, INC.（OPENFIVE）
LUMINAR TECHNOLOGIES, INC.（BLACK FOREST ENGINEERING）

図表

LIST OF TABLES

TABLE 1. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SAWING, BY REGION, 2021-2031 ($MILLION)
TABLE 3. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SAWING, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 4. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SORTING, BY REGION, 2021-2031 ($MILLION)
TABLE 5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SORTING, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TESTING, BY REGION, 2021-2031 ($MILLION)
TABLE 7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TESTING, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR ASSEMBLY, BY REGION, 2021-2031 ($MILLION)
TABLE 9. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR ASSEMBLY, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR BALL GRID ARRAY, BY REGION, 2021-2031 ($MILLION)
TABLE 12. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR BALL GRID ARRAY, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 13. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CHIP SCALE PACKAGE, BY REGION, 2021-2031 ($MILLION)
TABLE 14. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CHIP SCALE PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 15. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MULTI-PACKAGE, BY REGION, 2021-2031 ($MILLION)
TABLE 16. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MULTI-PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 17. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR STACKED DIE, BY REGION, 2021-2031 ($MILLION)
TABLE 18. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR STACKED DIE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 19. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR QUAD AND DUAL, BY REGION, 2021-2031 ($MILLION)
TABLE 20. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR QUAD AND DUAL, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 21. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 22. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AUTOMOTIVE, BY REGION, 2021-2031 ($MILLION)
TABLE 23. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AUTOMOTIVE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 24. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CONSUMER ELECTRONICS, BY REGION, 2021-2031 ($MILLION)
TABLE 25. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 26. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR INDUSTRIAL, BY REGION, 2021-2031 ($MILLION)
TABLE 27. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR INDUSTRIAL, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 28. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TELECOMMUNICATION, BY REGION, 2021-2031 ($MILLION)
TABLE 29. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 30. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AEROSPACE AND DEFENSE, BY REGION, 2021-2031 ($MILLION)
TABLE 31. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AEROSPACE AND DEFENSE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 32. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MEDICAL AND HEALTHCARE, BY REGION, 2021-2031 ($MILLION)
TABLE 33. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MEDICAL AND HEALTHCARE, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 34. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR LOGISTICS AND TRANSPORTATION, BY REGION, 2021-2031 ($MILLION)
TABLE 35. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR LOGISTICS AND TRANSPORTATION, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 36. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION, 2021-2031 ($MILLION)
TABLE 37. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 38. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 39. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 40. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 41. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 42. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 43. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 44. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 45. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 46. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 47. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 48. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 49. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 50. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 51. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 52. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 53. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 54. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 55. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 56. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 57. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 58. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 59. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 60. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 61. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 62. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 63. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 64. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 65. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 66. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 67. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 68. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 69. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 70. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 71. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 72. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 73. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 74. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 75. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 76. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 77. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 78. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 79. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 80. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 81. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 82. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 83. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 84. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 85. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 86. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 87. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 88. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 89. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 90. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 91. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 92. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 93. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 94. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 95. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 96. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 97. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 98. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 99. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 100. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
TABLE 101. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 102. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 103. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 104. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 105. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 106. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 107. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
TABLE 108. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
TABLE 109. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
TABLE 110.ADVANCED SILICON S.A.: COMPANY SNAPSHOT
TABLE 111.ADVANCED SILICON S.A.: OPERATING SEGMENTS
TABLE 112.ADVANCED SILICON S.A.: PRODUCT PORTFOLIO
TABLE 113.ADVANCED SILICON S.A.: NET SALES,
TABLE 114.ADVANCED SILICON S.A.: KEY STRATERGIES
TABLE 115.ALPHACORE INC.: COMPANY SNAPSHOT
TABLE 116.ALPHACORE INC.: OPERATING SEGMENTS
TABLE 117.ALPHACORE INC.: PRODUCT PORTFOLIO
TABLE 118.ALPHACORE INC.: NET SALES,
TABLE 119.ALPHACORE INC.: KEY STRATERGIES
TABLE 120.AMKOR TECHNOLOGY, INC: COMPANY SNAPSHOT
TABLE 121.AMKOR TECHNOLOGY, INC: OPERATING SEGMENTS
TABLE 122.AMKOR TECHNOLOGY, INC: PRODUCT PORTFOLIO
TABLE 123.AMKOR TECHNOLOGY, INC: NET SALES,
TABLE 124.AMKOR TECHNOLOGY, INC: KEY STRATERGIES
TABLE 125.DEVICE ENGINEERING INC.: COMPANY SNAPSHOT
TABLE 126.DEVICE ENGINEERING INC.: OPERATING SEGMENTS
TABLE 127.DEVICE ENGINEERING INC.: PRODUCT PORTFOLIO
TABLE 128.DEVICE ENGINEERING INC.: NET SALES,
TABLE 129.DEVICE ENGINEERING INC.: KEY STRATERGIES
TABLE 130.HIDENSITY GROUP (HMT MICROELECTRONIC AG): COMPANY SNAPSHOT
TABLE 131.HIDENSITY GROUP (HMT MICROELECTRONIC AG): OPERATING SEGMENTS
TABLE 132.HIDENSITY GROUP (HMT MICROELECTRONIC AG): PRODUCT PORTFOLIO
TABLE 133.HIDENSITY GROUP (HMT MICROELECTRONIC AG): NET SALES,
TABLE 134.HIDENSITY GROUP (HMT MICROELECTRONIC AG): KEY STRATERGIES
TABLE 135.PRESTO ENGINEERING GROUP: COMPANY SNAPSHOT
TABLE 136.PRESTO ENGINEERING GROUP: OPERATING SEGMENTS
TABLE 137.PRESTO ENGINEERING GROUP: PRODUCT PORTFOLIO
TABLE 138.PRESTO ENGINEERING GROUP: NET SALES,
TABLE 139.PRESTO ENGINEERING GROUP: KEY STRATERGIES
TABLE 140.SENCIO BV: COMPANY SNAPSHOT
TABLE 141.SENCIO BV: OPERATING SEGMENTS
TABLE 142.SENCIO BV: PRODUCT PORTFOLIO
TABLE 143.SENCIO BV: NET SALES,
TABLE 144.SENCIO BV: KEY STRATERGIES
TABLE 145.SHORTLINK GROUP: COMPANY SNAPSHOT
TABLE 146.SHORTLINK GROUP: OPERATING SEGMENTS
TABLE 147.SHORTLINK GROUP: PRODUCT PORTFOLIO
TABLE 148.SHORTLINK GROUP: NET SALES,
TABLE 149.SHORTLINK GROUP: KEY STRATERGIES
TABLE 150.SIFIVE, INC. (OPENFIVE): COMPANY SNAPSHOT
TABLE 151.SIFIVE, INC. (OPENFIVE): OPERATING SEGMENTS
TABLE 152.SIFIVE, INC. (OPENFIVE): PRODUCT PORTFOLIO
TABLE 153.SIFIVE, INC. (OPENFIVE): NET SALES,
TABLE 154.SIFIVE, INC. (OPENFIVE): KEY STRATERGIES
TABLE 155.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): COMPANY SNAPSHOT
TABLE 156.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): OPERATING SEGMENTS
TABLE 157.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): PRODUCT PORTFOLIO
TABLE 158.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): NET SALES,
TABLE 159.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): KEY STRATERGIES

LIST OF FIGURES

FIGURE 1.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET SEGMENTATION
FIGURE 2.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031
FIGURE 3.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031
FIGURE 4. TOP INVESTMENT POCKETS, BY REGION
FIGURE 5.PORTER FIVE-1
FIGURE 6.PORTER FIVE-2
FIGURE 7.PORTER FIVE-3
FIGURE 8.PORTER FIVE-4
FIGURE 9.PORTER FIVE-5
FIGURE 10.TOP PLAYER POSITIONING
FIGURE 11.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES
FIGURE 12.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY PROCESS,2021(%)
FIGURE 13.COMPARATIVE SHARE ANALYSIS OF SAWING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 14.COMPARATIVE SHARE ANALYSIS OF SORTING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 15.COMPARATIVE SHARE ANALYSIS OF TESTING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 16.COMPARATIVE SHARE ANALYSIS OF ASSEMBLY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 17.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY PACKAGING TYPE,2021(%)
FIGURE 18.COMPARATIVE SHARE ANALYSIS OF BALL GRID ARRAY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 19.COMPARATIVE SHARE ANALYSIS OF CHIP SCALE PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 20.COMPARATIVE SHARE ANALYSIS OF MULTI-PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 21.COMPARATIVE SHARE ANALYSIS OF STACKED DIE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 22.COMPARATIVE SHARE ANALYSIS OF QUAD AND DUAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 23.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY APPLICATION,2021(%)
FIGURE 24.COMPARATIVE SHARE ANALYSIS OF AUTOMOTIVE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 25.COMPARATIVE SHARE ANALYSIS OF CONSUMER ELECTRONICS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 26.COMPARATIVE SHARE ANALYSIS OF INDUSTRIAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 27.COMPARATIVE SHARE ANALYSIS OF TELECOMMUNICATION OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 28.COMPARATIVE SHARE ANALYSIS OF AEROSPACE AND DEFENSE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 29.COMPARATIVE SHARE ANALYSIS OF MEDICAL AND HEALTHCARE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 30.COMPARATIVE SHARE ANALYSIS OF LOGISTICS AND TRANSPORTATION OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
FIGURE 31.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET BY REGION,2021
FIGURE 32.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 33.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 34.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 35.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 36.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 37.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 38.ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 39.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 40.SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 41.NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 42.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 43.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 44.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 45.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 46.SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 47.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 48.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 49.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 50.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
FIGURE 51. TOP WINNING STRATEGIES, BY YEAR
FIGURE 52. TOP WINNING STRATEGIES, BY DEVELOPMENT
FIGURE 53. TOP WINNING STRATEGIES, BY COMPANY
FIGURE 54.PRODUCT MAPPING OF TOP 10 PLAYERS
FIGURE 55.COMPETITIVE DASHBOARD
FIGURE 56.COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS
FIGURE 57.ADVANCED SILICON S.A..: NET SALES ,($MILLION)
FIGURE 58.ALPHACORE INC..: NET SALES ,($MILLION)
FIGURE 59.AMKOR TECHNOLOGY, INC.: NET SALES ,($MILLION)
FIGURE 60.DEVICE ENGINEERING INC..: NET SALES ,($MILLION)
FIGURE 61.HIDENSITY GROUP (HMT MICROELECTRONIC AG).: NET SALES ,($MILLION)
FIGURE 62.PRESTO ENGINEERING GROUP.: NET SALES ,($MILLION)
FIGURE 63.SENCIO BV.: NET SALES ,($MILLION)
FIGURE 64.SHORTLINK GROUP.: NET SALES ,($MILLION)
FIGURE 65.SIFIVE, INC. (OPENFIVE).: NET SALES ,($MILLION)
FIGURE 66.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING).: NET SALES ,($MILLION)

Product Code: A08874

The global outsourced semiconductor assembly and test market was valued at $34,553.5 million in 2021, and is projected to reach $60,334.5 million by 2031, registering a CAGR of 6.32% from 2022 to 2031. Outsourced semiconductor assembly and test (OSAT) are the number of companies that offers third-party IC-packaging as well as test services. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations. OSAT mainly emphasizes on providing advanced packaging as well as test solutions for semiconductor companies in various markets such as consumer goods, communications, and computing along with emerging markets such as Internet of Things (IoT), automotive electronics, and wearable devices.

The global outsourced semiconductor assembly and test market is mainly driven by increase in demand for consumer electronics and surge in degree of urbanization. In addition, increase in adoption of smartphones significantly fuels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the other hand, growth in the chip market is anticipated to provide a huge opportunity for OSAT companies.

The assembly segment was the largest revenue contributor in 2021, and is expected to grow at a CAGR of 6.46% from 2022 to 2031. This is attributed to rise in need for effective supply chain management in the semiconductor manufacturing industry. By packaging type, the ball grid array segment was the leading largest contributor of revenue in 2020 and is expected to grow at a CAGR of 5.63% from 2022 to 2031. Technological advancements in the semiconductor industry has led to surge in demand for thinner and lighter electronics products.

This factor primarily drives growth of the ball grid array type of packaging, owing to several miniaturization advantages that it offers. By region, the outsourced semiconductor assembly and test market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. The analysis identified that North America contributed for the maximum revenue in 2021. This is attributed to increase in industrialization as well as rapid development in automotive and telecommunication industries.

The key players profiled in the report include Advanced Silicon S.A., Alphacore Inc., Amkor Technology, Inc., Device Engineering Inc., HiDensity Group (HMT microelectronic AG), Luminar Technologies, Inc. (Black Forest Engineering), Presto Engineering Group, Sencio BV, ShortLink group, and SiFive, Inc. (OpenFive). Market players have adopted various strategies such as product launch, expansion, collaboration, partnership, and acquisition to strengthen their foothold in the outsourced semiconductor assembly and test industry.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the outsourced semiconductor assembly and testing market analysis from 2021 to 2031 to identify the prevailing outsourced semiconductor assembly and testing market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the outsourced semiconductor assembly and testing market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global outsourced semiconductor assembly and testing market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Process

Sawing
Sorting
Testing
Assembly

By Packaging Type

Ball grid array
Chip scale package
Multi-package
Stacked die
Quad and dual

By Application

Automotive
Consumer electronics
Industrial
Telecommunication
Aerospace and defense
Medical and healthcare
Logistics and transportation

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Italy
- Russia
- Sweden
- Netherlands
- Rest Of Europe
Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest Of Europe
LAMEA
- Latin America
- Middle East
- Africa
Key Market Players
- ADVANCED SILICON S.A.
- ALPHACORE INC.
- AMKOR TECHNOLOGY, INC.
- DEVICE ENGINEERING INC.
- HIDENSITY GROUP (HMT MICROELECTRONIC AG)
- PRESTO ENGINEERING GROUP
- Sencio BV
- SHORTLINK GROUP
- SIFIVE, INC. (OPENFIVE)
- LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key market segments
1.3.Key benefits to the stakeholders
1.4.Research Methodology
- 1.4.1.Secondary research
- 1.4.2.Primary research
- 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings of the study
2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key findings
- 3.2.1.Top investment pockets
3.3.Porter's five forces analysis
3.4.Top player positioning
3.5.Market dynamics
- 3.5.1.Drivers
- 3.5.2.Restraints
- 3.5.3.Opportunities
3.6.COVID-19 Impact Analysis on the market

CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS

4.1 Overview
- 4.1.1 Market size and forecast
4.2 Sawing
- 4.2.1 Key market trends, growth factors and opportunities
- 4.2.2 Market size and forecast, by region
- 4.2.3 Market analysis by country
4.3 Sorting
- 4.3.1 Key market trends, growth factors and opportunities
- 4.3.2 Market size and forecast, by region
- 4.3.3 Market analysis by country
4.4 Testing
- 4.4.1 Key market trends, growth factors and opportunities
- 4.4.2 Market size and forecast, by region
- 4.4.3 Market analysis by country
4.5 Assembly
- 4.5.1 Key market trends, growth factors and opportunities
- 4.5.2 Market size and forecast, by region
- 4.5.3 Market analysis by country

CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE

5.1 Overview
- 5.1.1 Market size and forecast
5.2 Ball grid array
- 5.2.1 Key market trends, growth factors and opportunities
- 5.2.2 Market size and forecast, by region
- 5.2.3 Market analysis by country
5.3 Chip scale package
- 5.3.1 Key market trends, growth factors and opportunities
- 5.3.2 Market size and forecast, by region
- 5.3.3 Market analysis by country
5.4 Multi-package
- 5.4.1 Key market trends, growth factors and opportunities
- 5.4.2 Market size and forecast, by region
- 5.4.3 Market analysis by country
5.5 Stacked die
- 5.5.1 Key market trends, growth factors and opportunities
- 5.5.2 Market size and forecast, by region
- 5.5.3 Market analysis by country
5.6 Quad and dual
- 5.6.1 Key market trends, growth factors and opportunities
- 5.6.2 Market size and forecast, by region
- 5.6.3 Market analysis by country

CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION

6.1 Overview
- 6.1.1 Market size and forecast
6.2 Automotive
- 6.2.1 Key market trends, growth factors and opportunities
- 6.2.2 Market size and forecast, by region
- 6.2.3 Market analysis by country
6.3 Consumer electronics
- 6.3.1 Key market trends, growth factors and opportunities
- 6.3.2 Market size and forecast, by region
- 6.3.3 Market analysis by country
6.4 Industrial
- 6.4.1 Key market trends, growth factors and opportunities
- 6.4.2 Market size and forecast, by region
- 6.4.3 Market analysis by country
6.5 Telecommunication
- 6.5.1 Key market trends, growth factors and opportunities
- 6.5.2 Market size and forecast, by region
- 6.5.3 Market analysis by country
6.6 Aerospace and defense
- 6.6.1 Key market trends, growth factors and opportunities
- 6.6.2 Market size and forecast, by region
- 6.6.3 Market analysis by country
6.7 Medical and healthcare
- 6.7.1 Key market trends, growth factors and opportunities
- 6.7.2 Market size and forecast, by region
- 6.7.3 Market analysis by country
6.8 Logistics and transportation
- 6.8.1 Key market trends, growth factors and opportunities
- 6.8.2 Market size and forecast, by region
- 6.8.3 Market analysis by country

CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION

7.1 Overview
- 7.1.1 Market size and forecast
7.2 North America
- 7.2.1 Key trends and opportunities
- 7.2.2 North America Market size and forecast, by Process
- 7.2.3 North America Market size and forecast, by Packaging Type
- 7.2.4 North America Market size and forecast, by Application
- 7.2.5 North America Market size and forecast, by country
  - 7.2.5.1 U.S.
  - 7.2.5.1.1 Market size and forecast, by Process
  - 7.2.5.1.2 Market size and forecast, by Packaging Type
  - 7.2.5.1.3 Market size and forecast, by Application
  - 7.2.5.2 Canada
  - 7.2.5.2.1 Market size and forecast, by Process
  - 7.2.5.2.2 Market size and forecast, by Packaging Type
  - 7.2.5.2.3 Market size and forecast, by Application
  - 7.2.5.3 Mexico
  - 7.2.5.3.1 Market size and forecast, by Process
  - 7.2.5.3.2 Market size and forecast, by Packaging Type
  - 7.2.5.3.3 Market size and forecast, by Application
7.3 Europe
- 7.3.1 Key trends and opportunities
- 7.3.2 Europe Market size and forecast, by Process
- 7.3.3 Europe Market size and forecast, by Packaging Type
- 7.3.4 Europe Market size and forecast, by Application
- 7.3.5 Europe Market size and forecast, by country
  - 7.3.5.1 UK
  - 7.3.5.1.1 Market size and forecast, by Process
  - 7.3.5.1.2 Market size and forecast, by Packaging Type
  - 7.3.5.1.3 Market size and forecast, by Application
  - 7.3.5.2 Germany
  - 7.3.5.2.1 Market size and forecast, by Process
  - 7.3.5.2.2 Market size and forecast, by Packaging Type
  - 7.3.5.2.3 Market size and forecast, by Application
  - 7.3.5.3 France
  - 7.3.5.3.1 Market size and forecast, by Process
  - 7.3.5.3.2 Market size and forecast, by Packaging Type
  - 7.3.5.3.3 Market size and forecast, by Application
  - 7.3.5.4 Italy
  - 7.3.5.4.1 Market size and forecast, by Process
  - 7.3.5.4.2 Market size and forecast, by Packaging Type
  - 7.3.5.4.3 Market size and forecast, by Application
  - 7.3.5.5 Russia
  - 7.3.5.5.1 Market size and forecast, by Process
  - 7.3.5.5.2 Market size and forecast, by Packaging Type
  - 7.3.5.5.3 Market size and forecast, by Application
  - 7.3.5.6 Sweden
  - 7.3.5.6.1 Market size and forecast, by Process
  - 7.3.5.6.2 Market size and forecast, by Packaging Type
  - 7.3.5.6.3 Market size and forecast, by Application
  - 7.3.5.7 Netherlands
  - 7.3.5.7.1 Market size and forecast, by Process
  - 7.3.5.7.2 Market size and forecast, by Packaging Type
  - 7.3.5.7.3 Market size and forecast, by Application
  - 7.3.5.8 Rest of Europe
  - 7.3.5.8.1 Market size and forecast, by Process
  - 7.3.5.8.2 Market size and forecast, by Packaging Type
  - 7.3.5.8.3 Market size and forecast, by Application
7.4 Asia-Pacific
- 7.4.1 Key trends and opportunities
- 7.4.2 Asia-Pacific Market size and forecast, by Process
- 7.4.3 Asia-Pacific Market size and forecast, by Packaging Type
- 7.4.4 Asia-Pacific Market size and forecast, by Application
- 7.4.5 Asia-Pacific Market size and forecast, by country
  - 7.4.5.1 China
  - 7.4.5.1.1 Market size and forecast, by Process
  - 7.4.5.1.2 Market size and forecast, by Packaging Type
  - 7.4.5.1.3 Market size and forecast, by Application
  - 7.4.5.2 India
  - 7.4.5.2.1 Market size and forecast, by Process
  - 7.4.5.2.2 Market size and forecast, by Packaging Type
  - 7.4.5.2.3 Market size and forecast, by Application
  - 7.4.5.3 Japan
  - 7.4.5.3.1 Market size and forecast, by Process
  - 7.4.5.3.2 Market size and forecast, by Packaging Type
  - 7.4.5.3.3 Market size and forecast, by Application
  - 7.4.5.4 South Korea
  - 7.4.5.4.1 Market size and forecast, by Process
  - 7.4.5.4.2 Market size and forecast, by Packaging Type
  - 7.4.5.4.3 Market size and forecast, by Application
  - 7.4.5.5 Rest of Europe
  - 7.4.5.5.1 Market size and forecast, by Process
  - 7.4.5.5.2 Market size and forecast, by Packaging Type
  - 7.4.5.5.3 Market size and forecast, by Application
7.5 LAMEA
- 7.5.1 Key trends and opportunities
- 7.5.2 LAMEA Market size and forecast, by Process
- 7.5.3 LAMEA Market size and forecast, by Packaging Type
- 7.5.4 LAMEA Market size and forecast, by Application
- 7.5.5 LAMEA Market size and forecast, by country
  - 7.5.5.1 Latin America
  - 7.5.5.1.1 Market size and forecast, by Process
  - 7.5.5.1.2 Market size and forecast, by Packaging Type
  - 7.5.5.1.3 Market size and forecast, by Application
  - 7.5.5.2 Middle East
  - 7.5.5.2.1 Market size and forecast, by Process
  - 7.5.5.2.2 Market size and forecast, by Packaging Type
  - 7.5.5.2.3 Market size and forecast, by Application
  - 7.5.5.3 Africa
  - 7.5.5.3.1 Market size and forecast, by Process
  - 7.5.5.3.2 Market size and forecast, by Packaging Type
  - 7.5.5.3.3 Market size and forecast, by Application

CHAPTER 8: COMPANY LANDSCAPE

8.1. Introduction
8.2. Top winning strategies
8.3. Product Mapping of Top 10 Player
8.4. Competitive Dashboard
8.5. Competitive Heatmap
8.6. Key developments

CHAPTER 9: COMPANY PROFILES

9.1 ADVANCED SILICON S.A.
- 9.1.1 Company overview
- 9.1.2 Company snapshot
- 9.1.3 Operating business segments
- 9.1.4 Product portfolio
- 9.1.5 Business performance
- 9.1.6 Key strategic moves and developments
9.2 ALPHACORE INC.
- 9.2.1 Company overview
- 9.2.2 Company snapshot
- 9.2.3 Operating business segments
- 9.2.4 Product portfolio
- 9.2.5 Business performance
- 9.2.6 Key strategic moves and developments
9.3 AMKOR TECHNOLOGY, INC
- 9.3.1 Company overview
- 9.3.2 Company snapshot
- 9.3.3 Operating business segments
- 9.3.4 Product portfolio
- 9.3.5 Business performance
- 9.3.6 Key strategic moves and developments
9.4 DEVICE ENGINEERING INC.
- 9.4.1 Company overview
- 9.4.2 Company snapshot
- 9.4.3 Operating business segments
- 9.4.4 Product portfolio
- 9.4.5 Business performance
- 9.4.6 Key strategic moves and developments
9.5 HIDENSITY GROUP (HMT MICROELECTRONIC AG)
- 9.5.1 Company overview
- 9.5.2 Company snapshot
- 9.5.3 Operating business segments
- 9.5.4 Product portfolio
- 9.5.5 Business performance
- 9.5.6 Key strategic moves and developments
9.6 PRESTO ENGINEERING GROUP
- 9.6.1 Company overview
- 9.6.2 Company snapshot
- 9.6.3 Operating business segments
- 9.6.4 Product portfolio
- 9.6.5 Business performance
- 9.6.6 Key strategic moves and developments
9.7 Sencio BV
- 9.7.1 Company overview
- 9.7.2 Company snapshot
- 9.7.3 Operating business segments
- 9.7.4 Product portfolio
- 9.7.5 Business performance
- 9.7.6 Key strategic moves and developments
9.8 SHORTLINK GROUP
- 9.8.1 Company overview
- 9.8.2 Company snapshot
- 9.8.3 Operating business segments
- 9.8.4 Product portfolio
- 9.8.5 Business performance
- 9.8.6 Key strategic moves and developments
9.9 SIFIVE, INC. (OPENFIVE)
- 9.9.1 Company overview
- 9.9.2 Company snapshot
- 9.9.3 Operating business segments
- 9.9.4 Product portfolio
- 9.9.5 Business performance
- 9.9.6 Key strategic moves and developments
9.10 LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)
- 9.10.1 Company overview
- 9.10.2 Company snapshot
- 9.10.3 Operating business segments
- 9.10.4 Product portfolio
- 9.10.5 Business performance
- 9.10.6 Key strategic moves and developments

半導体組立・検査受託市場：プロセス別、パッケージタイプ別、アプリケーション別：世界の機会分析および産業予測、2021-2031年

Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031

目次

第1章イントロダクション

第2章エグゼクティブサマリー

第3章市場の概要

第4章半導体組立・検査受託市場：工程別

第5章半導体組立・検査受託市場：パッケージングタイプ別

第6章半導体組立・検査受託市場：用途別

第7章半導体組立・検査受託市場：地域別

第8章企業情勢

第9章企業プロファイル

LIST OF TABLES

LIST OF FIGURES

Key Market Segments

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

CHAPTER 2:EXECUTIVE SUMMARY

CHAPTER 3:MARKET OVERVIEW

CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS

CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE

CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION

CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION

CHAPTER 8: COMPANY LANDSCAPE

CHAPTER 9: COMPANY PROFILES

半導体組立・検査受託市場：プロセス別、パッケージタイプ別、アプリケーション別：世界の機会分析および産業予測、2021-2031年

Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 市場の概要

第4章 半導体組立・検査受託市場： 工程別

第5章 半導体組立・検査受託市場：パッケージングタイプ別

第6章 半導体組立・検査受託市場：用途別

第7章 半導体組立・検査受託市場：地域別

第8章 企業情勢

第9章 企業プロファイル

LIST OF TABLES

LIST OF FIGURES

Key Market Segments

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

CHAPTER 2:EXECUTIVE SUMMARY

CHAPTER 3:MARKET OVERVIEW

CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS

CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE

CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION

CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION

CHAPTER 8: COMPANY LANDSCAPE

CHAPTER 9: COMPANY PROFILES

第1章イントロダクション

第2章エグゼクティブサマリー

第3章市場の概要

第4章半導体組立・検査受託市場：工程別

第5章半導体組立・検査受託市場：パッケージングタイプ別

第6章半導体組立・検査受託市場：用途別

第7章半導体組立・検査受託市場：地域別

第8章企業情勢

第9章企業プロファイル