Product Code: SE_2110970 / A10605
The global envelope tracking chips market size was valued at $1.57 billion in 2019, and is projected to reach $3.15 billion by 2027, growing at a CAGR of 9.6% from 2020 to 2027. Envelope Tracking is a power supply technique that is used to adjust the converter voltage in order to improve the efficiency of a power amplifier, which is used in wireless systems. In envelope tracking technique RF signal's amplitude envelope is tracked and the bias voltage was adjusted according to the results in amplitude, this helps in operating power amplifier with maximum efficiency at any instantaneous power level. The recent cellular communications such as W-CDMA, HSPA+, and LTE, operates its signal waveforms with more extreme "peaks" and "valleys", unlike GSM, which maintains continuous waveform throughout the operation. Recent cellular technologies experience continuous deflection in waveforms, so, here the requirement of envelope tracking technique was required in order to bring out maximum efficiency.
The global envelope tracking chips market is anticipated to witness significant growth over the forecast period. Factors such as better signal coverage, reduced heat dissipation, and increased battery life drive the growth of envelope tracking chips market. However, requirement of high bandwidth and complex architecture for designing ET module is a major restraint to the global envelope tracking chips industry. In addition, increase in adoption of advance technologies in the field of telecom sector is expected to create opportunities for envelope tracking chips industry.
The global envelope tracking chips market is segmented into technology, application, end user, and region. By technology, the market is segmented into cellular communications, wireless communications, and satellite communications. Based on application, the market is classified into smart phones, wearable devices, and others. Depending on end user, the market is segregated into consumer electronics, space and aviation, automotive, telecommunications, and others.
Region wise, the envelope tracking chips market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). The key players operating in the market include as Analog Devices, Inc., Efficient Power Conversion Corporation, Maxim Integrated, MediaTek, Qorvo, Qualcomm, Inc., R2 Semiconductor, Inc., Samsung, Skyworks Solutions, Inc., and Texas Instruments.
Key Market Segments
By Technology
- Cellular Communications
- Wireless Communications
- Satellite Communications
By Application
- Smart Phones
- Wearable Devices
- Others
By End User
- Consumer Electronics
- Space and Aviation
- Automotive
- Telecommunications
- Others
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
- Key Players
- Analog Devices, Inc.
- Efficient Power Conversion Corporation
- Maxim Integrated
- MediaTek
- Qorvo
- Qualcomm, Inc.
- R2 Semiconductor, Inc.
- SAMSUNG
- Skyworks Solutions, Inc.
- Texas Instruments
TABLE OF CONTENTS
CHAPTER 1:INTRODUCTION
- 1.1.Report description
- 1.2.Key benefits for stakeholders
- 1.3.Key market segments
- 1.4.Research methodology
- 1.4.1.Primary research
- 1.4.2.Secondary research
- 1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
- 2.1.Key findings
- 2.1.1.Top impacting factors
- 2.1.2.Top investment pockets
- 2.2.CXO perspective
CHAPTER 3:MARKET OVERVIEW
- 3.1.Market definition and scope
- 3.2.Porter's five forces analysis
- 3.3.Patent analysis
- 3.3.1.Envelope tracking chips patent analysis, by region (2012-2020)
- 3.3.2.Envelope tracking chips patent analysis, by applicant
- 3.4.Market dynamics
- 3.4.1.Drivers
- 3.4.1.1.Growing product adoption in the consumer electronics segment
- 3.4.1.2.Rising product demand from the automotive sector
- 3.4.1.3.Rising growth of wireless platform
- 3.4.2.Restraint
- 3.4.2.1.High cost of envelope tracking chips
- 3.4.3.Opportunities
- 3.4.3.1.High investments in power management technologies
- 3.5.COVID-19 impact analysis
- 3.5.1.COVID-19 outbreak
- 3.5.2.Impact on market size
- 3.5.3.End user trends, preferences, and budget impact
- 3.5.4.Parent industry impact
- 3.5.5.Key player strategies to tackle negative impact
- 3.5.5.1.Limiting cuts to R&D expense
- 3.5.5.2.Focusing on next-generation products
- 3.5.5.3.Shifting toward agile supply chain model
- 3.5.6.Opportunity window
CHAPTER 4:ENVELOPE TRACKING CHIPS MARKET, BY TECHNOLOGY
- 4.1.Overview
- 4.2.Cellular communications
- 4.2.1.Key market trends, growth factors, and opportunities
- 4.2.2.Market size and forecast, by region
- 4.2.3.Market analysis, by country
- 4.3.Wireless communications
- 4.3.1.Key market trends, growth factors, and opportunities
- 4.3.2.Market size and forecast, by region
- 4.3.3.Market analysis, by country
- 4.4.Satellite communications
- 4.4.1.Key market trends, growth factors, and opportunities
- 4.4.2.Market size and forecast, by region
- 4.4.3.Market analysis, by country
CHAPTER 5:ENVELOPE TRACKING CHIPS MARKET, BY APPLICATION
- 5.1.Overview
- 5.2.Smart phones
- 5.2.1.Key market trends, growth factors, and opportunities
- 5.2.2.Market size and forecast, by region
- 5.2.3.Market analysis, by country
- 5.3.Wearable devices
- 5.3.1.Key market trends, growth factors, and opportunities
- 5.3.2.Market size and forecast, by region
- 5.3.3.Market analysis, by country
- 5.4.Others
- 5.4.1.Key market trends, growth factors, and opportunities
- 5.4.2.Market size and forecast, by region
- 5.4.3.Market analysis, by country
CHAPTER 6:ENVELOPE TRACKING CHIPS MARKET, BY END USER
- 6.1.Overview
- 6.2.Consumer electronics
- 6.2.1.Key market trends, growth factors, and opportunities
- 6.2.2.Market size and forecast, by region
- 6.2.3.Market analysis, by country
- 6.3.Space & aviation
- 6.3.1.Key market trends, growth factors, and opportunities
- 6.3.2.Market size and forecast, by region
- 6.3.3.Market analysis, by country
- 6.4.Automotive
- 6.4.1.Key market trends, growth factors, and opportunities
- 6.4.2.Market size and forecast, by region
- 6.4.3.Market analysis, by country
- 6.5.Telecommunications
- 6.5.1.Key market trends, growth factors, and opportunities
- 6.5.2.Market size and forecast, by region
- 6.5.3.Market analysis, by country
- 6.6.Others
- 6.6.1.Key market trends, growth factors, and opportunities
- 6.6.2.Market size and forecast, by region
- 6.6.3.Market analysis, by country
CHAPTER 7:ENVELOPE TRACKING CHIPS MARKET, BY REGION
- 7.1.Overview
- 7.2.North America
- 7.2.1.Key market trends, growth factors, and opportunities
- 7.2.2.Market size and forecast, by technology
- 7.2.3.Market size and forecast, by application
- 7.2.4.Market size and forecast, by end user
- 7.2.5.Market analysis, by country
- 7.2.5.1.U.S.
- 7.2.5.1.1.Market size and forecast, by technology
- 7.2.5.1.2.Market size and forecast, by application
- 7.2.5.1.3.Market size and forecast, by end user
- 7.2.5.2.Canada
- 7.2.5.2.1.Market size and forecast, by technology
- 7.2.5.2.2.Market size and forecast, by application
- 7.2.5.2.3.Market size and forecast, by end user
- 7.2.5.3.Mexico
- 7.2.5.3.1.Market size and forecast, by technology
- 7.2.5.3.2.Market size and forecast, by application
- 7.2.5.3.3.Market size and forecast, by end user
- 7.3.Europe
- 7.3.1.Key market trends, growth factors, and opportunities
- 7.3.2.Market size and forecast, by technology
- 7.3.3.Market size and forecast, by application
- 7.3.4.Market size and forecast, by end user
- 7.3.5.Market analysis, by country
- 7.3.5.1.UK
- 7.3.5.1.1.Market size and forecast, by technology
- 7.3.5.1.2.Market size and forecast, by application
- 7.3.5.1.3.Market size and forecast, by end user
- 7.3.5.2.Germany
- 7.3.5.2.1.Market size and forecast, by technology
- 7.3.5.2.2.Market size and forecast, by application
- 7.3.5.2.3.Market size and forecast, by end user
- 7.3.5.3.France
- 7.3.5.3.1.Market size and forecast, by technology
- 7.3.5.3.2.Market size and forecast, by application
- 7.3.5.3.3.Market size and forecast, by end user
- 7.3.5.4.Rest of Europe
- 7.3.5.4.1.Market size and forecast, by technology
- 7.3.5.4.2.Market size and forecast, by application
- 7.3.5.4.3.Market size and forecast, by end user
- 7.4.Asia-Pacific
- 7.4.1.Key market trends, growth factors, and opportunities
- 7.4.2.Market size and forecast, by technology
- 7.4.3.Market size and forecast, by application
- 7.4.4.Market size and forecast, by end user
- 7.4.5.Market analysis, by country
- 7.4.5.1.China
- 7.4.5.1.1.Market size and forecast, by technology
- 7.4.5.1.2.Market size and forecast, by application
- 7.4.5.1.3.Market size and forecast, by end user
- 7.4.5.2.Japan
- 7.4.5.2.1.Market size and forecast, by technology
- 7.4.5.2.2.Market size and forecast, by application
- 7.4.5.2.3.Market size and forecast, by end user
- 7.4.5.3.India
- 7.4.5.3.1.Market size and forecast, by technology
- 7.4.5.3.2.Market size and forecast, by application
- 7.4.5.3.3.Market size and forecast, by end user
- 7.4.5.4.South Korea
- 7.4.5.4.1.Market size and forecast, by technology
- 7.4.5.4.2.Market size and forecast, by application
- 7.4.5.4.3.Market size and forecast, by end user
- 7.4.5.5.Rest of Asia-Pacific
- 7.4.5.5.1.Market size and forecast, by technology
- 7.4.5.5.2.Market size and forecast, by application
- 7.4.5.5.3.Market size and forecast, by end user
- 7.5.LAMEA
- 7.5.1.Key market trends, growth factors, and opportunities
- 7.5.2.Market size and forecast, by technology
- 7.5.3.Market size and forecast, by application
- 7.5.4.Market size and forecast, by end user
- 7.5.5.Market analysis, by country
- 7.5.5.1.Latin America
- 7.5.5.1.1.Market size and forecast, by technology
- 7.5.5.1.2.Market size and forecast, by application
- 7.5.5.1.3.Market size and forecast, by end user
- 7.5.5.2.Middle East
- 7.5.5.2.1.Market size and forecast, by technology
- 7.5.5.2.2.Market size and forecast, by application
- 7.5.5.2.3.Market size and forecast, by end user
- 7.5.5.3.Africa
- 7.5.5.3.1.Market size and forecast, by technology
- 7.5.5.3.2.Market size and forecast, by application
- 7.5.5.3.3.Market size and forecast, by end user
CHAPTER 8:COMPETITIVE LANDSCAPE
- 8.1.Introduction
- 8.1.1.Market player positioning, 2019
- 8.2.Product mapping of top 10 players
- 8.3.Competitive dashboard
- 8.4.Competitive heatmap
- 8.5.Key developments
- 8.5.1.New product launches
- 8.5.2.Acquisition
- 8.5.3.Collaboration
CHAPTER 9:COMPANY PROFILES
- 9.1.ANALOG DEVICES, INC.
- 9.1.1.Company overview
- 9.1.2.Key executives
- 9.1.3.Company snapshot
- 9.1.4.Operating business segments
- 9.1.5.Product portfolio
- 9.1.6.R&D expenditure
- 9.1.7.Business performance
- 9.1.8.Key strategic moves and developments
- 9.2.EFFICIENT POWER CONVERSION CORPORATION
- 9.2.1.Company overview
- 9.2.2.Key executives
- 9.2.3.Company snapshot
- 9.2.4.Operating business segments
- 9.2.5.Product portfolio
- 9.2.6.Key strategic moves and developments
- 9.3.MAXIM INTEGRATED PRODUCTS, INC.
- 9.3.1.Company overview
- 9.3.2.Key executives
- 9.3.3.Company snapshot
- 9.3.4.Operating business segments
- 9.3.5.Product portfolio
- 9.3.6.R&D expenditure
- 9.3.7.Business performance
- 9.3.8.Key strategic moves and developments
- 9.4.MEDIATEK, INC.
- 9.4.1.Company overview
- 9.4.2.Key executives
- 9.4.3.Company snapshot
- 9.4.4.Operating business segments
- 9.4.5.Product portfolio
- 9.4.6.R&D expenditure
- 9.4.7.Business performance
- 9.4.8.Key strategic moves and developments
- 9.5.QORVO, INC.
- 9.5.1.Company overview
- 9.5.2.Key executives
- 9.5.3.Company snapshot
- 9.5.4.Operating business segments
- 9.5.5.Product portfolio
- 9.5.6.R&D expenditure
- 9.5.7.Business performance
- 9.5.8.Key strategic moves and developments
- 9.6.QUALCOMM INC.
- 9.6.1.Company overview
- 9.6.2.Key executives
- 9.6.3.Company snapshot
- 9.6.4.Operating business segments
- 9.6.5.Product Portfolio
- 9.6.6.R&D expenditure
- 9.6.7.Business performance
- 9.6.8.Key strategic moves and developments
- 9.7.R2 SEMICONDUCTOR, INC.
- 9.7.1.Company overview
- 9.7.2.Key executives
- 9.7.3.Company snapshot
- 9.7.4.Operating business segments
- 9.7.5.Product portfolio
- 9.8.SAMSUNG
- 9.8.1.Company overview
- 9.8.2.Key executives
- 9.8.3.Company snapshot
- 9.8.4.Operating business segments
- 9.8.5.Product portfolio
- 9.8.6.R&D expenditure
- 9.8.7.Business performance
- 9.8.8.Key strategic moves and developments
- 9.9.SKYWORKS SOLUTIONS, INC.
- 9.9.1.Company overview
- 9.9.2.Key executives
- 9.9.3.Company snapshot
- 9.9.4.Operating business segments
- 9.9.5.Product portfolio
- 9.9.6.R&D expenditure
- 9.9.7.Business performance
- 9.9.8.Key strategic moves and developments
- 9.10.TEXAS INSTRUMENTS INCORPORATED
- 9.10.1.Company overview
- 9.10.2.Key executives
- 9.10.3.Company snapshot
- 9.10.4.Operating business segments
- 9.10.5.Product portfolio
- 9.10.6.R&D expenditure
- 9.10.7.Business performance
- 9.10.8.Key strategic moves and developments