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市場調査レポート
IPD（Integrated Passive Device）市場：技術・応用・市場・参入企業動向 - 2009年
IPD 2009 - Integrated Passive & Active devices
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Abstract
MARKET TREND
From a commodity technology initially developed to replace bulky discrete
passive components, thin-film Integrated Passive Devices (IPD' s) are now a
growing industry trend driven by RF, High Brightness LEDs, Digital & Mixed
Signal applications.
Yole' s new research study on Thin-film Integrated Passive and Active devices
estimates the total IPD market to grow from more than $600M this year to over
$1B by 2013. Whether it is to reduce space on the application board, to
enhance performance or to reduce cost at the system level, IPD' s are spreading
to most electronic sectors, from low volume to mass market businesses in
aerospace, military, medical, industrial, lighting, communications, and PC
applications.
Over the past few years, IPD' s have become an essential enabler of
System-in-Packages (Sip) realizations. Looking to tomorrow, IPD' s have become
an essential enabler of System-in-Packages (Sip) realizations. Looking to
tomorrow, IPD' s are paving the way to the bright future of the "More than
Moore" heterogeneous integration as they contribute greatly to bridging
technologies. IPD' s enable the assembly of shrinking geometries of CMOS IC' s
and the lagging packaging technologies. IPD' s enable the assembly of
increasingly complete and autonomous systems with the integration of diverse
electronic functions such as sensors, RF transceivers, MEMS, power amplifiers,
power management units and digital processors.
Table of Contents
1. INTRODUCTION, DEFINITIONS & SCORE OF THE REPORT
- Overview of discrete versus integrated passives solutions
- Integrated active and passive, structures definitions (inductor,
capacitor; resistors, diodes, combinations...)
- Comparison between thin film/thick film IPD technologies (including
ceramic LTCC)
2. THIN FILM IPD APPLICATIONS AND MARKET DRIVERS
- IPD categories (ESD/EMI protection IPD, high brightness LED silicon
submount, RF IPD, Digital & Mixed Signal IPD)
- IPD current and future applications
- IPD benefits and market drivers description for each IPD category and
application
3. THIN FILM IPD MARKET STATUS AND 2008-2015 FORECASTS
- IPD market forecasts are provided both in M$, Munits and in wafer eg. with
attached growth rates
- Volume shipments for IPD per applications (cell-phone, mp3 players,
medical, sutomotive...)
- IPD shipments per category (ESD/EMI protection, LED silicon submount, RF
IPDs, Digital & Mixed signal IPDs)
- Specific applicative breakdown and forecasted evolution for each category
- IPD shipments per substrate type (Silicon, Glass, GaAs, SOI...) and
wafer size (4"/6"/8"/12")
- IPD shipments per packaging platform (WLP, Wire bond, Flip-chip,
Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate...)
- IPD player market shares and revenues
- "Top 15" IPD players 2008 revenues
- Overall players market shares based on 2008 IPD revenues
- Specific market share breakdown for ESD/EMI protection IPD applications
- Specific market share breakdown for RF IPD applications
4. THIN FILM IPD TECHNOLOGIES
- IPD components requirements and technology options
- Performance and integration capabilities
- Inductors (multilayer planar inductors, 3D inductors...)
- Capacitors (planar versus trench geometries, SiO2 versus SiN versus
BST versus PXZT capacitors...)
- Others structures (resistors, diodes...)
- IPD Manufacturing challenges and related equipment & material tool-box
- Substrate choice technology comparisons: high resistivity Silicon /
Glass / SOI / GaAs / Plastic laminate
- Dielectric layers options (low k / high k)
- Available photoresists, oxide and other layer solutions, impact of
layer thickness
- Metallic layers formation (A, Copper, Gold...)
- Process options (line width, multiple layer IPDs, lithographic versus
non lithographic patterning, advanced depositions...)
- IPD Design, Simulation and predictability through system level co-design
5. THIN FILM IPD ARCHITECTURES, ASSEMBLY & PACKAGING
- Integration, packaging and assembly platforms options for IPDs
- through silicon Via manufacturing: a necessary step to reach the 3rd
dimension
- Fan-Out Wafer level packaging and embedded die concepts
- Overall IPD Technology roadmap
6. THIN FILM IPD SUPPLY CHAIN & PLAYERS
- Geographical mapping of different players
- Business models analysis for IPD (specialty foundries, Integrated Device
Manufactures, Turnkey packaging providers, module makers, fabless & end
integrators)
- Summary of IPD players capabilities (manufacturing, design/ library,
packaging & assembly...)
- Present and future challenges ahead for successful commercialization of
IPDs
7. CONCLUSIONS & PERSPECTIVES
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