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Texas Instruments DLPのリバースコスティングとリバースエンジニアリングプロセス分析

Texas Instruments DLPョ-MEMS DMD: Reverse Costing Analysis

発行 System Plus Consulting
出版日 2009年04月 商品コード 90773
ページ情報 英文  
価格
US$ 2,340 換算 ¥ 188,533 (税抜) PDF by E-mail (Single User License)
US$ 2,930 換算 ¥ 236,070 (税抜) PDF by E-mail ( Site License)
US$ 3,510 換算 ¥ 282,800 (税抜) PDF by E-mail (Corporate License)


原文目次

Abstract

Yole Developpement is pleased to distribute System Plus Consulting reverse costing report of the MEMS Digital Micro-mirror Device (DMD) for pico-projectors supplied by Texas Instruments. Based on a complete reverse engineering process the report provides an estimation of the production cost as well as the selling price of the circuit.

This Texas Instruments DLPR component is used in pico-projectors systems which can be integrated in phones or in pocket projectors. It uses a specific MEMS technology process using around 187K micro-mirrors with a 7x7μm area to perform a picture. Micro-mirrors are controlled by a CMOS integrated circuit and SRAM memory. The device uses a wafer level packaging technology and a ceramic substrate.

This report provides complete teardown of the MEMS with :

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Table of Contents

Executive Summary p2

Reverse Costing methodology p6

Physical Analysis p7

  • Physical Analysis Methodology
  • Digital Micromirror Device
  • Package
  • Optical Apertures
  • Ceramic substrate
  • Micromirrors - Pictures
  • ASIC Process Characteristics
  • Functional Blocks Areas
  • Synthesis Part 1

Manufacturing Process p20

  • Front End Process Flow
  • Back End Process Flow
  • Wafer Fabrication Unit
  • Synthesis Part 2

Manufacturing Cost p26

  • Wafer Cost Data
  • Main Steps of Economic Analysis
  • ASIC Wafer Cost
  • Front End MEMS Wafer Costs
    • Breakdown per Process Steps
    • Breakdown per Equipment
    • Breakdown per Consumables
  • Probe Test Cost
  • Windows and Walls Costs
  • Back End Wafer Cost
    • Breakdown per Process Steps
    • Breakdown per Equipment
    • Breakdown per Consumables
  • Total Wafer Cost
  • DMD Silicon Cost
  • Packaging Cost
  • Final Test Cost
  • Component Manufacturing Cost
  • Synthesis part 3

Average Selling Price p53

  • Definitions of Prices
  • Manufacturing Price
  • ASP Evolution by Quantity Order

Conclusion p56

Glossary p57

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