サーマルインターフェースマテリアル最新動向

Advances in Thermal Interface Materials

発行	Technical Insights, Inc.
出版日	2007年12月	商品コード	58621
ページ情報	英文
価格	US$ 6,000 換算 ¥ 482,820 (税抜) Web Access (Regional License) US$ 6,500 換算 ¥ 523,055 (税抜) Hard Copy & Web Access (Regional License)

This research service talks about technology developments in the field of thermal interface materials.

Scope and Methodology
- Scope
- Methodology
- Thermal Interface Materials Webwatch Directory
Overview
- Overview
- Global Technology Highlights (North America; Europe)

Thermal Interface Materials Overview
- The Ideal Interface
- Types of Thermal Interface Materials
- Temperature and Electronic Device Failure
- Thermal Management Performance Simulation
Thermal Interface Materials Market Trends and Drivers
- Miniaturization Trends Follow Moore' s Law
- Trendsetting LED Illumination Technology
- Leading Indicator Market Drivers

Thermal Interface Material Options
- Types of Thermal Interface Materials
- TIM Advantages and Disadvantages
Gap Filler Thermal Interface Materials
- Gap Fillers Defined
- Sheet or Putty Gap Filler
- Ultrasoft Gap Filler Materials
Thermally Conductive Adhesives
- TIM Adhesives
- Loctite Bead-on-Bead Thermally Conductive Adhesive
- High-Thermal Conductivity Adhesive
Thermally Conductive Grease
- Thermal Grease Performance
- Dow Corning' s New Thermally Conductive Grease
Electrically Insulative TIM
- Electrical Properties of TIM
- Electrically Nonconductive Thermal Pastes
- Laird Technologies Thermally Conductive Insulating Material
Phase Change Materials
- Phase Change Thermal Interface Materials
- Screen Printable Phase Change Material
High-Performance Thermal Interface Materials
- Carbon and Graphite Advances TIM Development
- Carbon Nanotube Array Thermal Interface

Application Challenges
- Thermal Interface Materials Meet a Range of Application Challenges
- Next Generation TIMs to Meet the Challenges of Next Generation Applications
TIM in Microprocessor and Computer Related Applications
- Intel' s Santa Rosa Platform; Merom CPU uses PSH-TIM
- Desktop and Server Processor Thermal Solutions
Thermal Interface Applications in Aerospace
- Novel PC-TIM on Hubble Repair Mission
- NASA' s Space Shuttle Infrared Camera uses Gap Filler (TIM)
LED Thermal Interface Applications
- LEDs and Heat Build-up Protection
- LEDs for Automotive Headlights
Other Thermal Interface Applications
- Metallic TIMs for Power and RF Semiconductors
- Stock-Shaped TIM for Transistors

Advances in Thermal Interface Materials
- Academic Research Advances in Thermal Interface Materials
- Thermal Interface Materials Business Dynamics
Advances in Development of Next Generation Thermal Interface Materials
- Next Generation TIM Consortium
- CTRC Cooperative Research Center
Advances in Thermal Interface Material Strategies
- Dow Corning Electronics' Move into Fabricated TIM
- Thermal Management a Top Priority at Henkel Loctite
Advances in Thermal Interface Application Strategies
- Chomerics' Cross Market TIM Application Development Focus
- Universal Science Sees Strong Growth in LED Thermal Management

Key Patents Listing
- Advances in Thermal Interface Materials Related Patents-United States
- Advances in Thermal Interface Materials Related Patents-European and World
Advances in Thermal Interface Materials Glossary and Additional Plastics Resources
- Advances in Thermal Interface Materials Glossary
- Additional Plastics Resources