当商品の販売は、2011年07月19日を持ちまして終了しました。
Abstract
Reliability and Packaging Issues Challenge RF MEMS Technology
Recent years have seen tremendous advances in microelectromechanical system (MEMS) technology, to the extent that it is now being applied even in radio frequency (RF). These revolutionary RF MEMS devices are attracting great attention but are unlikely to achieve mass market adoption until certain core issues are resolved. Some of the major reliability issues include temperature drift, life, degradation dielectric (breakdown, leakage), and stiction. The packaging in MEMS also presents strong challenges, since freestanding mechanical structures must be protected and stay uncontaminated during both the manufacturing process as well as the lifetime of the component. Moreover, the layout and materials used in the packaging of RF MEMS devices are critical since they greatly affect product performance. For the moment, military, space, and instrumentation applications remain the pioneering enablers of RF MEMS technology.
This Technical Insights research service provides a detailed analysis of emerging RF MEMS technologies and their major potential applications. It discusses important technology developments and trends worldwide in the RF MEMS domain, and provides a breakdown of critical ongoing research by region.
Communications Grow Ever More Sophisticated with RF MEMS
Despite its many challenges, RF MEMS potential to revolutionize communications is immense. Components based on this technology deliver superior RF performance and tunability over a much broader range of operating frequencies. For instance, an RF MEMS switch concurrently provides greatly improved insertion loss, isolation, and linearity. RF MEMS devices can potentially be used as microswitches to build impedance networks in front of power amplifiers and to decrease the number of components in multistandard mobile phones. They can also be used as MEMS inductors and tunable capacitors for integrated voltage-controlled oscillators (VCOs) in global positioning systems (GPSs).
"Interest in MEMS technology for RF and wireless applications is rapidly rising primarily because of its flexibility," notes the analyst of this research service. "This can be exploited to overcome the limitations associated with integrated RF devices, enabling circuits to attain new levels of performance not otherwise achievable."
Ubiquitous Wireless Connectivity May Well Become a Reality
"RF MEMS enables superior passive devices, such as switches, switchable varactors, inductors, transmission lines, and resonators," says the analyst. "This makes it ideal to enable a plethora of wireless appliances operating in the home/ground, mobile, and space spheres such as handsets, base stations, and satellites." RF MEMS characteristic properties of low power consumption and reconfigurability suggest that ubiquitous wireless connectivity is no longer a distant possibility.
With wireless systems constantly in need of lower weight, volume, cost, and increased functionality, efforts are underway to realize a single-chip RF circuit. Integrating MEMS devices directly on the RF chip can allow numerous discrete components to be replaced, offering better performance and reliability as well as lower cost. Over time, this integration can lead to the replacement of all passive RF chips with on-chip devices, enabling considerable benefits such as smaller form factors for cell phones and added functionalities including Internet connectivity.
1. Table of Contents
2. Executive Summary
- Executive Summary
- Executive Summary
- Challenges and Outlook
- Scope and Methodology
- Scope
- Methodology
3. RF MEMS: Revolution is in the Air in Communications
- Technology and Potential Analysis: A Warm-Up
- RF MEMS: A Birds Eye View
- MEMS Applicability to RF and System Solutions
- Packaging in RF MEMS Devices
- Design Challenges Exist For RF MEMS
- Application Potential Analysis
- Application Potential of RF MEMS
- Wireless and Mobile Phones in RF MEMS Development
- Pertinent Points for Wireless RF MEMS
- RF MEMS Switch Applications in Communications
- Other Application Markets for RF MEMS
- Industry and Funding Activity in RF MEMS
- RF MEMS Industry Activity
- Specific Funding and Industry Developments
4. Technology Accelerators and Challenges
- Adoption Accelerators and Restraints
- Adoption Accelerators
- Technology Roadblocks
- Challenges
- Technical Challenges
- Commercial Challenges
5. The Innovation Frontier: RF MEMS Developments in North America
- Research in Universities
- MEMS Microrelay for RF Applications
- RF MEMS Tunable Filter
- RF MEMS Switches Based on FPC Technology
- Biological and Chemical Agent Detection
- Low-Loss RF MEMS Filtering
- RF MEMS Resonator Modelling
- RF MEMS Packaging Innovation
- Research in Company Laboratories
- Low-Loss RF MEMS Filters
- RF MEMS Switches for Cellphone Applications
- Hermetic Silicon Packaging Scheme for RF MEMS Switches
- Motorola Sensor Improves Tire Safety
- Microfabrica Introduces RF MEMS Production Platform
6. The Innovation Frontier: RF MEMS Developments in Asia and Europe
- Research in Universities
- CMOS-Compatible RF MEMS Switch
- Material Properties in RF MEMS Device Integration
- A New Method to Measure Dynamics And Power Handling Of RF MEMS Devices
- RF MEMS Switches in Wireless Communication Products
- Micromechanical Resonators for RF MEMS
- Silicon Nitride in RF MEMS Devices
- Research in Company Laboratories
- Opportunities For SOI In MEMS Applications
- PZT Shunt for RF MEMS Switches
- X-Band Capacitive Switch for RF MEMS Applications
- An Inexpensive Membrane RF MEMS Switch
7. Patents and Contact Details
- Patent Details
- North American Patents
- Asian and European Patents
- Published Applications and Research Contact Details
- Published Patent Applications (worldwide)
- Research Contacts
