Flirのマイクロボロメーター技術は微細加工構造の酸化バナジウム材料を基礎としており、各ピクセルは読み出し回路の上部2μmに活性膜を保持しています。マイクロボロメーターは、サーモグラフィや工業検査、建設、再生可能エネルギー、国境警備、沿岸警備、自動車関連などさまざまな用途に適しています。
当レポートは、FLIR i7カメラに内蔵されている25マイクロメーターピクセル赤外線センサー（マイクロボロメータ）「FLIR
ISC0601B」についてティアダウン分析し、細部の写真、材料の分析、製造プロセスフロー、詳細な経済分析、製造コストの内訳、販売価格推計などをまとめ、概略以下の構成でお届けいたします。
Abstract
Physical Analysis of the Device
Step by Step Reconstruction of the Process Flow
Cost of Manufacturing and Estimation of Selling Price
System Plus Consulting is proud to publish a reverse costing report on the
micro-bolometer ISC0601B, 320x240 pixels supplied by FLIR.
Flir micro-bolometer technology is based on a vanadium oxide material, with
micro-machined structures. Each pixel contains active membranes suspended at
2μm above the readout circuit.
This micro-bolometer is suitable for various applications including
thermography, industrial inspection, Building & Renewable Energy, Border
Security and coastal surveillance, automotive, etc.
This report provides complete teardown of the Flir ISC0601B sensor with:
- Detailed photos
- Material analysis
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
The micro-bolometer is part of the FLIR i7 thermal imaging camera. A reverse
costing report on the i7 camera is available separately.
ABOUT SYSTEM PLUS CONSULTING
System Plus Consulting is specialized in the cost analysis of electronics from
semiconductor devices to electronic systems. Around this main line System Plus
Consulting developed a complete range of services and costing tools to provide
in-depth production cost studies and estimation of the objective selling price
of the product.
Table of Contents
Glossary
1. Overview/Introduction
- Glossary
- Executive Summary
- Reverse Costing Methodology
2. Company Profile
- ULIS Profile
- On Semiconductor
3. Physical Analysis
- Synthesis of the Physical Analysis
- IR Camera
- Package
- Package X-ray
- Package front side
- Package gear side
- Read Out IC
- ROIC Functions
- ROIC technology
- Micro-Biometer
- Reflector
- Structure of Pixel
- Microbridge
- Contact structure
- Compensation Pixels
- Principle Operation
- Physical data summary
4. Manufacturing Process Flow
- Global Overview
- ROIC Process Flow
- Description of the ROIC Wafer Fabrication Unit
- Micro-bolometer Process Flow
- Description of the Micro-Bolometer Wafer Fabrication Unit
- Packaging
5. Cost analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Die per wafer & Probe Test
- ROIC Wafer Front-End Cost
6. 200mm Micro-Bolometer Cost analysis
- Micro-Bolometer Wafer Cost
- Micro-Bolometer Step Cost
- Micro-Bolometer Equipment Cost
- Micro-Bolometer Consumable Cost
- Back-End 1: Packing, Final test
- Component cost (FE + BE 0+ BE 1)
- Yields Synthesis
Conclusion
