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China Top Tier Company "A" Polysilicon, Ingot / Wafer Cost Analysis Report

発行 SNE Research
出版日 ページ情報 英文 160 Pages
中国大手メーカー「A」社のポリシリコンインゴット/ウエハーコスト分析 China Top Tier Company "A" Polysilicon, Ingot / Wafer Cost Analysis Report
出版日: 2012年01月05日 ページ情報: 英文 160 Pages



第1章 大手企業「A」社のポリシリコン

  • ポリシリコン製造工程の概要
  • 各プラントの四半期ごとのポリシリコン生産能力と生産量(2009〜2015年、予測値を含む)
  • 四半期ごとのポリシリコンコスト分析(2009〜2015年、予測値を含む)
    • 四半期ごとの原材料コストと消費量(2009〜2015年、予測値を含む)
      • 電力消費量とコスト分析(2009〜2015年、予測値を含む)
      • スリムロッドの平均販売価格とコスト分析(2009〜2015年、予測値を含む)
    • ポリシリコン製造コストの構造(2009〜2015年、予測値を含む)
    • ポリシリコンの利益率と平均販売価格(2009〜2015年、予測値を含む)
  • 研究開発に関するトピックとコストと削減計画(2009〜2015年、予測値を含む)
  • 各プラントの資本的支出(2009〜2015年、予測値を含む)
  • 事業運営費と売上純利益率(2009〜2015年、予測値を含む)
  • 結論

第2章 大手企業「A」社のインゴット/ウエハー(156mm多結晶、156mm準単結晶)

  • 単結晶インゴット/ウエハーと多結晶インゴット/ウエハーの製造工程の概要
  • 各プラントの四半期ごとのインゴット/ウエハー生産能力と生産量(2009〜2015年、予測値を含む)
  • インゴットとウエハーのコスト分析(2009〜2015年、予測値を含む)
    • インゴットのコスト構造(2009〜2015年、予測値を含む)
      • 多結晶インゴットの製造コスト構造(2009〜2015年、予測値を含む)
      • 単結晶インゴットの製造コスト構造(2009〜2015年、予測値を含む)
      • 原材料のコストとインゴット製造工程での消費量(2009〜2015年、予測値を含む)
    • ウエハーのコスト分析(2009〜2015年、予測値を含む)
      • 多結晶および単結晶ウエハー切断工程のコスト構造(2009〜2015年、予測値を含む)
      • 原材料コストとウエハー製造工程での消費量(2009〜2015年、予測値を含む)
      • 多結晶ウエハーの製造コスト構造(2009〜2015年、予測値を含む)
      • 単結晶ウエハーの製造コスト構造(2009〜2015年、予測値を含む)
      • 多結晶および単結晶ウエハーの利益率と平均販売価格(2009〜2015年、予測値を含む)
  • 新技術の応用とコスト削減計画(2009〜2015年、予測値を含む)
  • 各プラントの資本的支出
  • 事業運営費と売上純利益率(2009〜2015年、予測値を含む)
  • 結論

第3章 索引




Chinese top-tier solar companies cost competitiveness.

  • Compared to year 2009 Chinese top tier manufacturing cost decreased by 50%.
  • Compared to year 2010 Wafer manufacturing cost decreased by 1/3.
  • Cell/Module which requires large amount of component material has the lowest manufacturing cost reduction level.

The report contains world's most cost competitive Chinese Top Tier companies (A: Polysilicon-Ingot-Wafer, B: Cell-Module) quarterly cost analysis from 2009 to 2011 and quarterly cost forecast from 2012 to 2015. In addition, the report holds in-depth analysis and forecast on strategies for cutting costs, depreciation, operating profit and CapEx, Opex quarterly information.

  • Raw material Cost Analysis (2010~2015F)
  • Process Cost and Average Selling Price (2010~2015F)
  • CapEx & OpEx (2010~2015F)
  • Profit Margin & Net Profit Margin (2010~2015F)
  • R&D Topics (2011~2015F)
  • Capacity & Production by quarter (2010~2015F)\

Company "A"s current production cost is 41.2% compared to Q1 in 2009. Company "A" where production of polysilicon and ingot/wafer is vertically integrated is a company in China which is the largest global producer of solar cell and a top cost competitive country. Among the main ingredient there was a 30% reduction on TCS gas section. This may be due to the fact that from Q4 in 2010 100% in house system was taken place. In addition by improving the equipment performance and yield ratio 13.4% cost reduction was obtained.


"A" companies ingot and wafer manufacturing cost level compared to Q1 in 2009 is currently 50.8% and 34.8% respectively. Quartz Crucible, Argon gas, electricity cost in order significantly contributed to cost reduction.


For wafer, saw wire and abrasive led to cost saving by 15% respectively. With the introduction of diamond wire saw more then 16% of the cost saving is planned for year 2012.


China's leading cost competitive company "B" achieved on average of 35% of cost reduction. Among cell production cost, paste achieved 20% reduction. The gradual decrease in paste consumption and the change in market price of paste are analyzed as two reasons.


Module which requires largest amount of subsidiary materials shows uniform cost reduction in various fields. The cost reduction level shown below appears to be from the reason of price decline in component material.


The Top Tier companies in China, led to cost savings of an average of 50 percent compared to three years ago. Domestic and foreign solar companies need to identify China's production cost level and redefine business strategy.

Table of Contents

1. TOP Tier "A" Polysilicon

  • 1.1. Polysilicon Manufacturing Process Overview
  • 1.2. Polysilicon Capacity & Production by Plant, by Quarter (2009~2015F)
  • 1.3. Polysilicon Cost Analysis by Quarter (2009~2015F)
    • 1.3.1. Raw Material Cost and Consumption by Quarter (2009~2015F)
      • Power Consumption (kWh/kg) and Cost (USD/kg) analysis (2009~2015F)
      • Slim Rod Average Selling Price and Cost analysis (2009~2015F)0
    • 1.3.2. Polysilicon Production Cost Structure (2009~2015F)
    • 1.3.3. Polysilicon Profit Margin and Average Selling Price (2009~2015F)0
  • 1.4. R&D Topics and Cost Reduction Plan (2011~2015F)
  • 1.5. CapEx by Plant (2009~2015F)
  • 1.6 OPEX and Net Profit Margin (2009~2015F)
  • 1.7. Conclusion

2. TOP TIER "A" Ingot/Wafer (156Multi, 156 Quasi-Mono)

  • 2.1. Mono Ingot/Wafer and Multi Ingot/Wafer Manufacturing Process Overview
  • 2.2. Ingot/Wafer Capacity & Production by Plant, by Quarter (2010~2015F)
  • 2.3. Ingot and Wafer Cost Analysis (2010~2015F)
    • 2.3.1. Ingot Cost Structure (2010~2015F)
      • Multi Crystalline Ingot Production Cost Structure (2010~2015F)
      • Mono Crystalline Ingot Production Cost Structure (2011~2015F)
      • Raw Material Cost and Consumption of Ingot Process (2010~2015F)
    • 2.3.2. Wafer Cost Analysis (2010~2015F)
      • Multi and Mono Crystalline Wafer Cutting Process Cost Structure (2010~2015F) Raw Material Cost and Consumption of Wafer Process (2010~2015F)
      • Multi Crystalline Wafer Production Cost Structure (2010~2015F)
      • Mono Crystalline Wafer Production Cost Structure (2011~2015F)
      • Multi and Mono Wafer Profit Margin and Average Selling Price (2010~2015F)
  • 2.4. New Technology Application and Cost Reduction Plan (2011~2015F)
  • 2.5. CapEx by Plant (2010~2015F)
  • 2.6. OPEX and Net Profit Margin (2010~2015F)
  • 2.7. Conclusion


  • 3.1 Figure
  • 3.2 Table
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