世界のファブ予測（ファブキャパシティレポート）

World Fab Forecast - Detailed Quarterly Forecast for the Frontend Semiconductor Fabs

発行	SEMI
出版日	2012年02月	商品コード	67606
ページ情報	英文
価格	US$ 2,500 換算 ¥ 201,175 (税抜) Excel Database by E-mail (Single Copy)

原文目次

Abstract

The SEMI World Fab Forecast provides high level summaries, charts, and graphs; in-depth analyses of capital expenditure, capacity, technology and products, down to the detail of each fab; and forecasts for the next 18 months.

The database includes over 1,000 records of front-end fabs and foundries such as TSMC, UMC, Chartered Semiconductor, SMIC, Samsung, Intel, AMD, Toshiba, Micron Hynix, Powerchip, Texas Instruments, Renesas, Inotera, Elpida, STMicro, Fujitsu, NEC Electronics, ProMOS, Nanya, Matsushita, NXP, Winbond, IBM Micro, Sharp, Freescale, Infineon, Spansion, Magna Chip, X-Fab, and more.....

Benefits

These tools are invaluable for understanding the trends of the fabs, and learning more about capex for construction projects, fab equipping, technology level, and products.

With the World Fab Forecast report, you can conduct more efficient market research, identify target customers, and analyze quarterly fab trends more easily.

Highlights (World Fab Forecast - February 2011 edition)

Equipment spending (new and used tools) for 2011 is expected to increase by 28% to about $42.5B. Excluding Discrete fabs, spending will be about $39.5B.
A glimpse into 2012 predicts equipment spending to decrease by about 4% to $40.8B.
Equipment spending share by segment is led by Memory with 36% share (down from 43% in 2010) and Foundry with 33% share (up from 29% in 2010).
In 2011, 45 facilities are expected to begin operation: 23 are for LED fabs, seven for Foundries, three each for Memories, Logic, and Analog.
Worldwide installed capacity (without Discretes) is expected to increase about 9% in 2011 to 15.4M wafers per month (in 200mm equivalents) and increase by another 7% in 2012.
Most capacity increase in 2011 is for Foundries with 16% growth in 2011 and 11% in 2012, which builds out a worldwide Foundry capacity share from 25% in 2010 to 29% in 2012.
Top three companies adding the most installed capacity in 2011 are Hynix, TSMC, and Globalfoundries. The same three lead for capacity additions in 2012 but not in the same order.

Methodology

World Fab Forecast is compiled from publicly available information, including capital spending plans, announced fab plans and ream schedules. SEMI verifies this information by making up to 50 inquiries a week and periodic visits to semiconductor companies.

Summary
Graphs and Tables
- Construction Spending by Quarter by Region (in US$ Million)
- Equipment Spending by Quarter by Region (in US$ Million)
- Capacity by Quarter by Region (in 200 mm equivalent)
- Capacity by Product Type 2 by Quarter (in 200 mm equivalent)
- Capacity by Geometry by Quarter (in 200 mm equivalent)
- Fabs with Construction Spending by Region by Quarter (count of fabs)
- Fabs with Equipment Spending by Region by Quarter (count of fabs)
- Capacity for all 200 mm Fabs by Quarter by Region (in 200 mm equivalent)
- 200 mm Volume Fabs by Region by Quarter (count of fabs)
- Capacity for All 300 mm Fabs by Quarter by Region (in 200 mm equivalent)
- 300 mm Volume Fabs by Region by Quarter (count of fabs)
- Equip Spending for all 300mm Fabs by Quarter by Region (in US$ Million)
Company Detail
- Company Name
- Ownership (parent companies)
- Joint Venture Partners
- City
- State/Province
- Country
- Country/Region
- Region
- Origin
- Address
- Zip
- Phone
- Fax
- Website
- Fab Name
- FabType
- Probability
- Status
- Project Type
- Start Year
- Close Year
- Close Date
- Product Type
- Product Type (2)
- Products
- Technology
- Discrete Yes/No
- Current Geometry
- Current Wafer size
- Full Capacity
- Cleanroom Class
- Cleanroom Sq Ft
- Facility Size
- Begin Work
- Construction Start
- Project Stop Date
- Project Restart
- Install_Equip (date)
- First Silicon (date)
- Production (date)
- Total Cost (M$)
- Construction Cost (M$)
- Equip Cost (M$)
- Wafer Capacity (next 6 quarters and previous 6 quarters)
- Equiv 200 mm Wafer Capacity ((next 6 quarters and previous 6 quarters)
- Wafer size (next 6 quarters and previous 6 quarters)
- Geometry (next 6 quarters and previous 6 quarters)
- Geometry Group (next 6 quarters and previous 6 quarters)
- Construction Spending (next 6 quarters and previous 6 quarters)
- Equipment Spending (next 6 quarters and previous 6 quarters)
- Equipment Comment
- Fab Comment
- Change Made
- New Record
- Change Comment
- Fab History
Spending by Region
Spending by Company
Cap by Country/Region
Cap SICAS Alignment
Capacity by Company
Cap by Foundries
Cap by Wafer size in 2008, 2007, 2006
Cap by Product Type 2008, 2007, 2006
Cap by Geometry 2008, 2007, 2006
Definitions, Other Reports