ICs with multiple wireless functionality (combination ICs) are increasingly
seen as a means of enabling end-equipment manufacturers to include additional
functionality within their devices, with reduced cost, silicon size and power
requirements, and without the coexistence issues commonly associated with the
use of multiple standalone wireless ICs. This is the second edition of the
report ‘ICs with Multiple Wireless Functionality - World Market' . This
report includes over 60 tables and figures, with market estimates and
forecasts for 9 key combination ICs from 2008-2013 (including ASPs and
revenues), along with forecasts for the size of eight key markets for
combination ICs.
Combination ICs forecast within this report include:
Bluetooth/FM
Bluetooth/GPS
Bluetooth/FM/GPS
Bluetooth/WLAN
Bluetooth/FM/WLAN
Bluetooth/FM/WLAN/GPS
Bluetooth/WLAN/GPS
Bluetooth/FM/GPS/NFC
Bluetooth/FM/WLAN/NFC
The report also provides forecasts for Bluetooth low energy, Bluetooth high
speed over 802.11 and Bluetooth high speed over UWB in combination ICs.
Forecasts of the key combination ICs (along with the Bluetooth breakdowns) are
provided for the following end-device markets:
Smartphones
Feature Rich Handsets
Basic Feature Handsets
Laptop PCs
Digital Cameras
Personal Navigation Devices
Personal Media Players
Portable Gaming Devices
Fixed Gaming Devices
Add-in Cards & Dongles
Report Statistics
Pages: 150
Tables: 41
Figures: 33
Table of Contents
Chapter 1 - Introduction, Scope and Methodology
Chapter 2 - Technology Review
2.0 Introduction
2.1 Bluetooth Technology
2.1.1 Introduction
2.1.2 Technical Specification
2.1.3 Standards Evolution
2.1.4 Markets served with Classic Bluetooth
2.2 Bluetooth high speed
2.2.1 Introduction
2.2.2 Specification and Standards Evolution
2.2.3 Markets served by Bluetooth hs
2.3 Bluetooth low energy
2.3.1 Introduction
2.3.2 Bluetooth low energy Specification
2.3.3 Standards Evolution
2.3.4 Markets served by Bluetooth LE
2.4 WLAN
2.4.1 Introduction
2.4.2 Specification and Standards Evolution
2.4.3 Markets served with WLAN
2.5 UWB
2.5.1 Introduction
2.5.2 Technical Specification
2.5.3 Standards Evolution
2.5.4 Markets Served with UWB
2.6 GPS
2.6.1 Introduction
2.6.2 Technical Specification
2.6.3 Standards Evolution
2.6.4 Markets served with GPS
2.7 NFC
2.7.1 Introduction
2.7.2 Technical Specification
2.7.3 Standards Evolution
2.7.4 Markets served with NFC
2.8 Combination ICs
2.8.1 Advantages of Combination ICs
2.8.2 Disadvantages of Combination ICs
Chapter 3 - Competitive Environment and Supplier Industry
3.0 Introduction
3.1 Competitive Environment
3.1.1 Introduction
3.1.2 Impact of Current Global Economic Situation
3.1.3 Converged Future - Competitive Environment
3.2 Summary of Technologies Addressed
3.3 Summary of Standards/Industry Body Involvement
3.4 Alereon
3.5 Atheros
3.6 AzureWave Technologies
3.7 Broadcom
3.8 CSR
3.9 GCT Semiconductor
3.10 Infineon
3.11 Intel Corporation
3.12 Laird Technologies
3.13 Marvell
3.14 Qualcomm
3.15 Renesas Technology Corporation
3.16 SiGe Semiconductor, Inc.
3.17 SiRF Technology, Inc.
3.18 ST-Ericsson
3.19 Staccato
3.20 Stonestreet One
3.21 TDK Electronics
3.22 Texas Instruments
3.23 U-Blox
3.24 Wipro
3.25 Wisair
Chapter 4 - Market Forecasts and Analysis
4.0 Introduction
4.1 Combination IC Forecasts
4.1.1 Introduction
4.1.2 Bluetooth Shipment Volumes
4.1.3 Combination IC Shipment Volumes and Revenues
4.2 Combination IC Forecasts by Application
4.2.1 Cellular Handsets
4.2.1.1 Wireless Technologies in Cellular Handsets
4.2.1.2 Key Drivers/Barriers for Combination ICs in Cellular Handsets
4.2.1.3 Market Forecasts and Assumptions
4.2.2 Digital Cameras
4.2.2.1 Wireless Technologies in Digital Cameras
4.2.2.2 Key Drivers/Barriers for Combination ICs in Digital Cameras
4.2.2.3 Market Forecasts and Assumptions
4.2.3 Laptop PCs
4.2.3.1 Wireless Technologies in Laptop PCs
4.2.3.2 Key Drivers/Barriers for Combination ICs in Laptop PCs
4.2.3.3 Market Forecasts and Assumptions
4.2.4 Personal Media Players (PMPs)
4.2.4.1 Wireless Technologies in PMPs
4.2.4.2 Key Drivers/Barriers for Combination ICs in PMPs
4.2.4.3 Market Forecasts and Assumptions
4.2.5 Personal Navigation Devices (PNDs)
4.2.5.1 Wireless Technologies in PNDs
4.2.5.2 Key Drivers/Barriers for Combination ICs in PNDs
4.2.5.3 Market Forecasts and Assumptions
4.2.6 Add-in Cards and Dongles
4.2.6.1 Wireless Technologies in Add-in Cards and Dongles
4.2.6.2 Key Drivers/Barriers for Combination ICs in Add-in Cards
and Dongles
4.2.6.3 Market Forecasts and Assumptions
4.2.7 Gaming Devices
4.2.7.1 Wireless Technology in Gaming
4.2.7.2 Key Drivers/Barriers for Combination ICs in Gaming
