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市場調査レポート
モバイル端末における半導体の世界市場：2009年
The Worldwide Market for Semiconductors in Mobile Handsets 2009
| 発行 |
IMS Research |
| 出版日 |
2009年03月 |
商品コード |
83348 |
| ページ情報 |
英文 156 PAGES (including 76 tables) |
| 価格 |
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Abstract
Description
This report analyzes the link between the market for handsets and the market
for semiconductor components in handsets. By linking the consumption of
handsets with feature, technology, integration and design trends this report
presents valuable data for anyone in the supply chain of handset manufacturing.
The study provides the following:
- Detailed shipment analysis for handsets and IC components by air-interface
and feature tier.
- Quantitative and qualitative tables of 21 handset features and discussions
of performance expectations and requirements from a design focus.
- Market size estimates for handsets and components in 2007 and 2008 with
growth forecasts to 2013.
- RF design trends, including quantitative analysis of analog & digital
integration and multi-mode & multi-band forecasts, through 2013.
- Digital design trends, including quantitative analysis of RF integration,
microprocessing and logic component trends, and feature and technology
influences.
- BOM estimates for each air-interface.
- Discussion of technology trends for displays, storage, interfaces and
processor performance and their potential disruptive influence in the next 5
years.
The study forecasts handsets, the following handset components and categories through 2013:
- RF discretes including switches, filters, transceivers (XCVR), power amps.
(PA) and low-noise amps (LNA).
- Integrated RF modules including switch/filter, XCVR & filter, PA/switch,
XCVR/switch/filter, PA/switch/filter and PA-FEMs, RF CMOS integrated baseband
solutions.
- Processors including DSPs; 4/8-bit, 16-bit, 32-bit Microprocessors; and
4/8-bit, 16-bit, 32-bit Microcontrollers
- Logic including classic and core-based ASICs, ASSPs and PLDs.
- RF Connectivity components such as digital transceivers, DACs and ADCs.
- Interconnect design trends.
- Breakout categories by 15 major air-interfaces in GSM, CDMA, UMTS,
TD-SCDMA, WiMAX and LTE families.
- Breakout categories by ultra-low cost (ULC), basic feature, advanced
feature and smartphone tiers.
- Handset subscribership and shipments worldwide and shipments by Americas,
Asia, Europe and MEA regions.
Table of Contents
Executive Summary
Chapter 1 Introduction, Scope and Methodology
- 1.0 Introduction
- 1.1 Scope
- 1.1.1 Report Content
- 1.1.2 Report Objective
- 1.1.3 Quantitative Analysis
- 1.1.4 Qualitative Analyses
- 1.2 Methodology
- 1.2.1 Information Sources
- 1.2.2 Forecasting Methodology
- 1.2.3 Exchange Rates
Chapter 2 Handset Shipments & Features
- 2.0 Handset Shipments and Features
- 2.1 Handset Shipments
- 2.2 Handset Features
- 2.2.1 Handset Tier Classification
- 2.2.2 Feature Market Size
- 2.3 General Handset Design Trends
Chapter 3 RF Design Trends
- 3.0 RF Design Trends
- 3.1 RF Multi-mode and Multi-band Trends
- 3.2 RF Integration Trends
Chapter 4 RF Component Trends
- 4.0 RF Component Trends
- 4.1 TDMA RF Component Trends
- 4.2 CDMA RF Component Trends
- 4.3 UMTS RF Component Trends
- 4.4 Other Emerging Air-Interface Component Trends
- 4.5 RF Component Trends by Tier
Chapter 5 Digital Component Trends
- 5.0 Digital Component Trends
- 5.1 Embedded Processing Components
- 5.2 Embedded Processing Components by Air-Interface
- 5.3 Embedded Processing Components
- 5.4 Interface Technologies
Appendix A Cellular Technology Overview
- A.0 Cellular Technology Overview
- A.1 Second Generation (2G)
- A.1.1 GSM, GRPS, EDGE
- A.1.2 cdmaOne, 1xRTT
- A.2 Third Generation (3G)
- A.2.1 W-CDMA, HSDPA and HSUPA
- A.2.2 cdma2000 and EV-DO
- A.2.3 TD-SCDMA
- A.2.4 WiMAX (3G) and WiBro
- A.3 Future Generations
- A.3.1 Long Term Evolution (LTE)
- A.3.2 Ultra Mobile Broadband (UMB)
- A.3.3 WiMAX (m)
Appendix B List of Tables & Figures
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