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ホームネットワーキングにおけるシステムICの競合分析:2008年版

A Competitive Analysis of System ICs in Home Networking - 2008 Edition

発行 IMS Research
出版日 2008年05月 商品コード 72266
ページ情報 英文 201 PAGES (including 68 tables)
価格
US$ 7,500 換算 ¥ 603,525 (税抜) PDF by E-mail (Single User License)
US$ 9,000 換算 ¥ 724,230 (税抜) PDF by E-mail (Site License)
US$ 11,300 換算 ¥ 909,311 (税抜) PDF by E-mail (Divisional License)


原文目次

Abstract

Description

The home networking environment is in one of its largest evolutionary phases. There are significant market drivers creating demand that the typical home network is currently unable to supply. Some Access and LAN technologies are at a pace to keep up with this demand; some are not. The success of IC and SoC solutions will hinge on being aware of this changing environment.

This is a technologies and semiconductor focused study of the trends driving, and the technologies enabling, this changing network landscape through 2012. This report qualitatively and quantitatively presents equipment and ICs categorized by the following technologies:

  • Access equipment
    • xDSL (ADSL(2)+, SDSL, VDSL(2))
    • Broadband Cable Access
    • Satellite, 2-Way
    • Fibre-to-the-Premises (FTTP)
    • Broadband Powerline Access
    • Wi-MAX (802.16d & e)
  • LAN equipment
    • Dedicated Wiring (Ethernet)
    • Broadband Phoneline
    • Broadband Powerline
    • Broadband Coaxial Cable
    • Wi-Fi (802.11g & n)

The equipment types quantified by Revenues, Units and ASPs are Data Modems, Data Gateways, Integrated Set-top Boxes, Integrated Access Devices, Routers/Bridges, Adapters/NICS, Hubs and other LAN devices. Each technology discussion includes an overview, a market analysis, forecast assumptions and a standards assessment.

The focus penetrates deeper from equipment to ICs, where these technology categories are again used to present the competitive analysis of system ICs in home networking.

The ICs quantified by Revenues, Units and ASPs are:

  • Microprocessors (4/8, 16, 32/64-bit MPUs)
  • Microcontrollers (4/8, 16, 32/64-bit MCUs)
  • DSP/DSC
  • ASICs (Classic and 32-bit MPU Core-based)
  • ASSPs (Classic and 32-bit MPU Core-based)
  • FPGAs (Classic and 32-bit MPU Core-based)
  • Memory (Volatile and Non-Volatile)
  • Interconnect standards (as a % of inclusion)

This report also includes a list of over 100 OEM/ODMs, SoC solutions providers and microprocessing component vendors in home networking with a key to which technologies they are currently supporting.

Table of Contents

Executive Summary

Chapter 1: Introduction, Scope and Methodology

  • 1.0 Introduction
  • 1.1 Scope
  • 1.2 Methodology
  • 1.3 Exchange Rates
  • 1.4 Definitions

Chapter 2: The Global Customer Premises Equipment Market

  • 2.0 Introduction
  • 2.1 The Global CPE Summary
  • 2.2 xDSL Access
  • 2.3 Broadband Cable Access
  • 2.4 Broadband Satellite (2-Way) Access
  • 2.5 Fibre-to-the-Premises Access
  • 2.6 Broadband Powerline Access
  • 2.7 Broadband Wireless Access
  • 2.8 Broadband Dedicated Wiring LAN
  • 2.9 Broadband Phoneline LAN
  • 2.10 Broadband Powerline LAN
  • 2.11 Broadband Coaxial LAN
  • 2.12 Broadband Wireless LAN

Chapter 3: System ICs in Home Networking

  • 3.0 Introduction
  • 3.1 The Market for System ICs in Home Networking
  • 3.2 Access Devices
    • 3.2.1 Overview of Access Devices
    • 3.2.2 Worldwide Shipments for ICs in xDSL Access Devices
    • 3.2.3 Worldwide Shipments for ICs in Cable Access Devices
    • 3.2.4 Worldwide Shipments for ICs in Satellite (2-way) Access Devices
    • 3.2.5 Worldwide Shipments for ICs in FTTP Devices
    • 3.2.6 Worldwide Shipments for ICs in Broadband Powerline Devices
    • 3.2.7 Worldwide Shipments for ICs in MAN Devices
  • 3.3 LAN Devices
    • 3.3.1 Overview of LAN Device
    • 3.3.2 Worldwide Shipments for Dedicated Wire ICs in LAN Devices
    • 3.3.3 Worldwide Shipments for Broadband Phoneline ICs in LAN Devices
    • 3.3.4 Worldwide Shipments for Broadband Powerline ICs in LAN Devices
    • 3.3.5 Worldwide Shipments for Coaxial Cable ICs in LAN Devices
    • 3.3.6 Worldwide Shipments for Wi-Fi ICs in LAN Devices

Appendix 1: List of Tables

Appendix 2: List of OEM/ODMs, SoC Solution Providers and Microprocessing Component Suppliers

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