ICプロセスにおけるクラスターツール：技術および市場の分析と予測

Cluster Tools In IC Processing: Technology and Market Forecasts

発行	The Information Network
出版日	2011年01月	商品コード	4963
ページ情報	英文
価格	US$ 2,495 換算 ¥ 200,772 (税抜) PDF by E-mail US$ 2,595 換算 ¥ 208,819 (税抜) PDF by E-mail & Hard Copy

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原文目次

Abstract

Modular, multichamber, integrated process systems -- cluster tools -- have achieved worldwide recognition, and have become widely accepted worldwide as a key concept for VLSI manufacturing.

The rationale behind the cluster concept is to:

Reduce cycle times
Reduce wafer handling by operators
Reduced particulate contamination
Reduced molecular contamination
Ability to initiate difficult processes

The perceived advantages of cluster tools comes at a time when the semiconductor industry has been is a sustained growth period, when rising costs has increased the cost of a 35,000 sq. ft. fab to $3 billion.

However, despite the claims for the advantages of cluster tools, quantitative data have been largely unproven. Open architectures, which will open the flood gates for standardization in the equipment industry, have not been established sufficiently to prove their value. As a result, closed architecture systems will continue to be sold throughout the timeframe of this study, even though they may not necessarily provide the lowest cost or best technology for a specific process. The attainment of a high reliability factor has prevented any successful implementation of automation in an IC facility. The advent of powerful, inexpensive microcomputers with high-speed data acquisition and processing capabilities has enabled manufacturers to build equipment with sufficient intelligence to monitor a variety of parameters. Advances in the field of remote sensing and control components has also enabled these functions to be measured with greater accuracy. A host or mode computer can provide better wafer process control and tracking as well as accurate diagnostic information should a problem occur.

Future cluster tools will implement much more sophisticated monitoring to assure process functionality and provide a means of detecting and correcting problems. To assure proper process completion and sequence, diagnostic tools are being incorporated inside process modules for real-time communication feedback. These tools will require highly developed internal system diagnostic capability; highly integrated equipment will require intensive sensing technology.

This report addresses these technical issues, presenting an analysis of the industry, the key players, and the driving forces directing the cluster tool concept. Markets are analyzed and are segmented by flexible and non-flexible cluster tools.

Chapter 1 Introduction

Chapter 2 Executive Summary

2.1 Summary of Technical Issues
2.2 Summary of Market Forecast

Chapter 3 Interface Standards

3.1 SEMI/MESC
- SECS I and SECS II
3.3 High-Speed Secs Message Services (HSMS) Standard
3.4 GEM
3.5 Standards Directions

Chapter 4 The Cluster Concept

4.1 Definitions
4.2 Device Technology and Integrated Processing
4.3 Main Functional Units
- 4.3.1 Central Handling Platform
- 4.3.2 Cassette Stations
- 4.3.3 Extension Modules
- 4.3.4 Single Process Modules
- 4.3.5 Batch Modules
- 4.3.6 Multiple Process Modules
4.4 Cluster Tool Communications
- 4.4.1 Cluster Tool Controller
- 4.4.2 Transport Module Controller
- 4.4.3 Process Module Controller
- 4.4.4 Control Software
- 4.4.5 Human Interface Software
- 4.4.6 Networking Software
4.5 Vacuum System Design

Chapter 5 Commercial Cluster Tools

5.1 Cluster Tools and Suppliers
- AIO
- Alcatel
- Anelva
- Apex
- Applied Materials
- ASM
- ASML
- Aviza Technology
- BLE Laboratory Equipment
- Brooks Automation
- Convac-APT
- Couger Labs
- DaiNippon Screen
- Ebara
- FSI International
- Genmark
- Genus
- Ginitech
- Hitachi
- IPS
- Jipelec
- Jusung Engineering
- Kanematsu Semiconductor
- Kokusai
- Kornic
- Lam Research
- Mattson Technology
- Modern Industries
- Modular Process Technology
- Novellus Systems
- Oxford Instruments Plasma Technology
- Primaxx
- Rorze
- Samsung Electronics
- SC Fluids
- Semitool
- Sentech
- Surface Technology Systems
- Suss MicroTec AG
- Tegal
- Tek-Vac
- Thermo Electron Corp.
- Tokyo Electron
- Trikon Technologies
- Ulvac
- Unaxis
- Vactronics Lab Equipment
- Veeco
5.2 Process Modules and Suppliers
- AXIC
- Nanaometrics
- Nicolet
- Nova Measuring Instruments
- Pfeiffer Vacuum
- XMR

Chapter 6 Cluster Tool Process Trends

6.1 Introduction
6.2 Deposition - Plasma Etch
6.3 Deposition - Rapid Thermal Processing
6.4 Lithography - Resist Processing
6.5 Diagnostics - Process
6.6 CMP Polish - Clean

Chapter 7 Cluster Tool Issues

7.1 Introduction
7.2 Equipment Reliability
7.3 Equipment Maintainability
7.4 Challenges
7.5 Opportunities

Chapter 8 Economic and Human Resource Issues

8.1 Introduction
8.2 Economic Justification
- 8.2.1 Background
- 8.2.2 Cost Justification
- 8.2.3 Reserves
- 8.2.4 Personnel Costs
- 8.2.5 Other ROI Considerations
8.3 Human Resources Impact
- 8.3.1 Background
- 8.3.2 Direct Labor
- 8.3.3 Equipment Support
- 8.3.4 Process Engineering
- 8.3.5 Operations Staff

Chapter 9 Market Forecast

9.1 Introduction
9.2 Market Forecast Assumptions
9.3 Market Forecast
- 9.3.1 Total Available Equipment Market
- 9.3.2 Flexible Cluster Tool Market
- 9.3.3 Non-Flexible Cluster Tool Market
- 9.3.4 Total Cluster Tool Market