当商品の販売は、2011年07月19日を持ちまして終了しました。
Abstract
Shrinking Dimensions and Increasing Complexity of Electronic Devices Call
for Highly Integrated Passive Components
Electronic devices are simultaneously getting smaller and more complex. In
keeping with this trend, passive component manufacturers that produce discrete
devices need to deliver highly integrated components. The demand is for devices
that are efficient, economic, and space-saving. High-end packages, such as ball
grid arrays (BGA), multi-chip modules (MCM), staked dies, and chip scale
packages (CSP) are widely used for their smaller footprints and high
functionality.
This Frost & Sullivan research analyzes the market for electronic
components including resistors, capacitors, inductors, and transformers and
packages, such as BGAs, CSPs, and MCMs. It also studies evolving technological
trends and major challenges faced by the world electronic components and
packaging industry and offers strategic recommendations to overcome them and
improve market share.
Integrated Passives for Saving Space and Enhancing System Performance
"Passives are evolving from simple gadgets to complex, integrated
networks and arrays containing a number of elements which improve system
performance," says the analyst. Combinations of these integrated passive
devices (IPD) go beyond the basic resistors, capacitors, inductors, and diodes
to multiple passive and active components. These IPDs incorporate multiple
functions into one module, and find wide use in the automotive industry,
cell-phones, USB upstream ports, two-way pagers, Internet devices, and PDAs.
As the electronic industry tries to include more functions into single
suites, the thrust is on attaining optimum levels of efficiency with
different-value resistors, high-value capacitors, and high-Q inductors. Not all
manufacturing technologies are suitable for all electronic modules. The optimal
solution would be to offer a combination of technologies, comprising of
thin-film, ceramic, and integrated modules. These combinational blocks reduce
the size of the device while maintaining specifications and deliver superior
performance.
Economic Revival and Growth of Communication Industry in Asia Foretells
Growth of Electronic Components Market
With advanced manufacturing processes churning out highly sophisticated
equipment in large numbers, there is intense competition. The industry also
suffers from lack of investments in new projects and delay in adoption of new
products and packages. However, as sales volumes improve with the economy, the
impact of these restraints is likely to diminish.
Though the economic downturn signified slowed growth in the communications
industry globally, it sees burgeoning growth in India and China where telephone
density is low. "The growth of communications including both voice and data
transmission is driving revenues of electronic components, such as capacitors,
resistors, and inductors and the packaging industry," notes the analyst.
Electronic components are also used in communications devices, such as cell
phones, fax machines, and other methods of data transfer where the flow of
electric current needs to be influenced, further improving revenues.
Table of Contents
- EXECUTIVE SUMMARY
- Overview
- Introduction
- Revenue Forecasts
- Conclusion
- TOTAL WORLD LEAN MANUFACTURING MARKETS
- Overview
- Introduction
- Total Revenue Forecasts
- Drivers
- Restraints
- Emerging Electronic Component Technologies
- Emerging Advanced Packaging Technologies
- TOTAL ELECTRONIC COMPONENTS MARKET
- Total Components Market
- Market Overview and Definitions
- Technology Trends for Resistors
- Technology Trends for Capacitors
- Technology Trends for Inductors
- Technology Trends for Transformers
- End-user Analysis - 1
- End-user Analysis - 2
- Strategies for Lean Manufacturing
- TOTAL ELECTRONIC PACKAGES MARKET
- Total Electronic Packages Market
- Market Overview and Definitions
- Technology Trends for Ball Grid Arrays
- Technology Trends for Chip Scale Packages
- Technology Trends for Multi Chip Modules
- End-user Analysis - 1
- End-user Analysis - 2
- Strategies for Lean Manufacturing
