携帯電話端末およびタブレット周辺用チップの動向：2012年

目次

From a cellphone standpoint the biggest market change in 2011 was in “Smartphones”, which have quickly taken over much of what was the less-expensive "feature phone" market segment.

To provide product and market planners with calibration on the market Forward Concepts is offering this extensive (360-page) market study that covers the peripheral integrated circuits that enhance cellphones and cellular-connected tablets. The graph at right illustrates the many chip types covered in the report, which forecasts units, ASPs & revenues for them in detail through 2016.

Cellular Terminal Prepheral Chip Forecast

MEMS devices are growing rapidly and by 2016 will be the largest peripheral segment surpassing touch controllers, image sensors and the combination WLAN (Wi-Fi, BT and FM) chips.

The integration of GPS into the WLAN combo device will have an impact on suppliers beginning in 2012.

The report covers the camera module market and the camera sensor chip and die businesses. In addition, insight into the newer auto-focus mechanisms and the emergence of wafer-level camera modules are covered..

The rise of Smartphones has had a direct bearing on the touch controller market growth and the report covers the growth of both capacitive and resistive touch controllers.

This study explores the dynamics of each of these chip types and profiles the vendors and market shares for each of them.

You are invited to scan the table of contents to get an idea of the full extent of this valuable study and all of the companies and components covered. Our informed views on the global market and trends will be of great benefit in your long-term planning.

We believe that there is no other cellphone peripheral chip market study available that has the breadth or depth of coverage of this one.

AUTHOR

Carter L. Horney, a recognized authority on microprocessor and DSP implementation in telecommunications, is the author of this study. Mr. Horney is an independent consultant and Forward Concepts Associate specializing in semiconductor product strategy and market planning. He was formerly Division Planner for Rockwell International's Digital Communications Division and earlier Strategic Marketing manager for Rockwell's Semiconductor Products Division. Mr. Horney was responsible for the product planning, which led Rockwell (now Conexant Systems) to dominate the worldwide FAX and dial modem chip market. He was appointed a Rockwell Engineering Fellow and received many commendations for outstanding achievement in Computer Architecture, Engineering, Technical Marketing, Product Planning and Customer Relations. Mr. Horney has a B.S. in Mathematics and Physics and an M.S. in Mathematics from Western Illinois University.

EDITOR

Will Strauss, President of Forward Concepts, is an internationally-recognized authority on markets driven by DSP Technology (and wireless is the largest DSP market), and was a significant contributor to this study.

SIZE

345 Pages, 62 Figures, 66 Tables, plus Appendix.

I. EXECUTIVE SUMMARY

• A. Overview
• B. Peripheral Chip Market Drivers
• C. Wireless Peripherals
• D. Image Sensors & Camera Modules
• E. MEMS and Sensors
• F. Touch Controllers

II. CAMERAS & IMAGE PROCESSORS

• A. Overview
  • 1. Camera Technology Developments
    • a) Liquid Lens
    • b) Continuous Auto Focus (CAF)
    • c) Shape Memory Alloy (SMA) Auto Focus
    • d) Wave Front Coding
    • e) Plenoptic Cameras
    • f) Advanced EDOF
    • g) Wafer Level Camera Technology
    • h) Back-Side Illumination (BSI) Sensors
  • 2. Image Sensor Distribution by Resolution
• B. Camera Phone Models By Handset Supplier
• C. Image Sensor Market & Vendor Shares
• D. Camera Image Module and Lens Suppliers
• E. Camera Imaging Market Forecast
• F. Camera Image Sensors Supplier Profiles
  • 1. Aptina (FSI 1.75-2.2μm, VGA, 1.3-, 2-, 3.1, 5MP)
  • 2. Canon (CMOS Full frame to APS-C 21 MP)
  • 3. Galaxycore Microelectronics (VGA to UXGA resolution)
  • 4. Hymax (VGA, 1.3-, 2- and 3-MP)
  • 5. Hynix Semiconductor (FSI 2.25μm, VGA, 1.3- 2-, 3MP)
  • 6. OmniVision (1.4μm BSI, VGA, 1.3MP, 2MP, 3.2MP & 5MP)
  • 7. Pixelplus (VGA CIS)
  • 8. Pixart Imaging (3.6μm VGA)
  • 9. Samsung (1.4μm FSI, VGA, 1.3; 2,3, 5 and 8MP EDOF)
  • 10. SETi (2.25μm FSI, VGA, 1.3 MP and 2MP CIS Chips)
  • 11. Sharp Imaging and Sensors (CMOS 3D Camera Modules)
  • 12. Sony (5, 8, 12, -16MP CMOS 1.1μm2 BSI Image Modules)
  • 13. STMicroelectronics (1.4μ BSI 2, 3, 5MP modules)
  • 14. Toshiba Electronic Components (1.1μm BSI 2, 3, 5, 8,14.6 MP)

III. MOBILE TV

• A. Overview
• B. MTV Technology Market Shares
• C. Mobile TV Market Forecast
• D. Mobile TV Regional Forecasts and Status
  • 1. ATSC-M/H
  • 2. Analog Broadcast TV
  • 3. T-DMB and S-DMB Forecasts (S/T-DMB)
  • 4. CMMB China
  • 5. ISDB-T Japan
  • 6. ISDB-Tb Brazil (SBTVD-T International)
  • 7. ISDB-Tmm Japan
  • 8. DVB-H
  • 9. DVB-H and DVB-T Migration in India
  • 10. Taiwan DVB-H
  • 11. MBMS and Unicast
• E. Mobile TV Chip Suppler Profiles
  • 1. Analog Devices-Integrant (T-DMB, ISDB-T & DMB-TH Tuner)
  • 2. Analog Devices-Integrant (CMMB, TMMB and DTMB Tuner)
  • 3. DiBcom (DVB-H Receiver)
  • 4. Frontier Silicon (DMB-radio, DAB-IP Demodulators)
  • 5. GCT Semiconductor (CMOS T-DMB & S-DMB Receivers)
  • 6. Innofidei (CMMB Complete Receiver
  • 7. Legend Silicon (DMB-TH TDS-OFDM Demodulater)
  • 8. Maxim (ISDB-T1- & 3-segment tuners)
  • 9. MaxLinear (CMOS ISDB-T1/T3 Silicon Tuner)
  • 10. Mirics Semiconductor (SiGe Multimode Silicon Tuner)
  • 11. Newport Media (65nm DVB-H, ISDB-T & CMMB Receivers)
  • 12. Quintic (NTSC/PAL/SECAM Analog TV Receiver)
  • 13. RDA Microelectronics (CMMB TV Receiver)
  • 14. RDA Microelectronics (NTSC/PAL/SECOM Analog TV Receiver)
  • 15. Samsung Electronics (CMMB CMOS Receiver)
  • 16. Siano Mobile Silicon (DVB-T/H, T-DMB, ISDB and CMMB)
  • 17. Silicon Motion Technology (S/T-DMB RF Silicon tuners)
  • 18. Spreadtrum (CMMB Demodulator and Source Decoder
  • 19. Telepath Technologies Co., Ltd. (CMMB Demodulator)

IV. GPS

• A. GLONASS, Galileo and Compass Satellite Status
• B. GNSS Augmentation System
• C. Assisted GPS and Location Awareness Growth
• D. Mobile phone GPS Market and Vendor Shares
• E. Cellphone GPS Forecast
• F. GPS Supplier Profiles
  • 1. Broadcom (65nm GPS/GLONASS, BT V3.0, FM RX/TX )
  • 2. CSR (65 nm GPS, BT and FM RxTx)
  • 3. Intel (GPS Receiver device)
  • 4. MediaTek (65nm GPS/QZSS/SBAS Monolithic Receiver
  • 5. Qualcomm (3G RF transceiver and GNSS support)
  • 6. Silicon Motion (RF transceiver and GPS receiver)
  • 7. ST-Ericsson (45nm A-GPS, BT4.0 and FM Rx/Tx)
  • 8. Texas Instruments (65nm Wi-Fi +GPS+BTv2.1+FM Rx/Tx)
  • 9. u-Blox (GPS receiver)

V. AM, FM STEREO+ RDS/RBDS RADIO Devices

• A. Overview
• B. FM Market Share Leaders
• C. FM Chip Forecast
• D. FM & RDS Company Profiles
  • 1. MediaTek-Airoha Technologies (RDS & RBDS FM)
  • 2. RDA Microelectronics (FM Stereo Receiver)
  • 3. ROHM (FM Stereo Receiver)
  • 4. On Semiconductors (AM/FM Radio Receiver)
  • 5. Silicon Labs (RDS/RBDS FM Stereo TX/RX & AM/FM RX)
  • 6. ST-Ericsson (RDS FM Stereo & AM)

VI. Wi-Fi and Wi-Fi Combinations

• A. Overview
• B. Cellular and Tablet Wi-Fi Market & Vendor Shares
• C. China's WLAN Security Standard (WAPI)
• D. Wi-Fi Direct Certified Standard
• E. MiFi Hotspot
• F. Wi-Fi Five-Year Forecast
• G. Wi-Fi Chip Suppler Profiles
  • 1. Qualcomm (Hybrid 802.11bgn Wi-Fi, BTv2.1 EDR & FM)
  • 2. Broadcom (802.11abgn/Bluetooth 4.0 + HS/FM 802.11n)
  • 3. CSR (65nm CMOS 802.11bgn/BT/FM Rx/Tx)
  • 4. Marvell (55nm 2X2 MIMO 802.11abg+ BTv2.1)
  • 5. MediaTek (2.4GHz 802.11abgn, GNSS, BT3.0HS, FM Rx/Tx)
  • 6. Qualcomm (Wi-Fi + BT SIP)
  • 7. ST-Ericsson (Standalone 802.11 bgn)
  • 8. Texas Instruments (Combo Wi-Fi bgn/Bluetooth/FM & GPS)

VII. BLUETOOTH

• A. Overview
• B. The Bluetooth Standards
  • 1. Bluetooth 2.0 EDR
  • 2. Bluetooth 2.1
  • 3. Bluetooth 3.0
  • 4. Bluetooth Low Energy (BTLE)
• C. Wideband Adaptive Multirate Speech Status (HD VoIP)
• D. Cellphone Bluetooth Market & Vendor Shares
• E. Cellphone Bluetooth Forecast
• F. Cellphone Bluetooth Supplier Profiles
  • 1. MediaTek (Bluetooth +FM RDS/RBDS)
  • 2. Broadcom (65nm Bluetooth 3.0 RDS & FM Rx/Tx)
  • 3. CSR (65 nm CMOS BT 2.1+FM, +GPS and HD voice)
  • 4. CSR (65 nm CMOS BTLE 4.0 Smart)
  • 5. EM Microelectronics (Bluetooth V4.0 BLTE)
  • 6. IC Plus (Bluetooth v1.1 and v 1.2)
  • 7. Intel (130 nm CMOS BT 3.0 + EDR)
  • 8. Marvell (90nm CMOS BT 2.0 EDR Plus FM Rx/Tx )
  • 9. Nordic Semiconductor (Bluetooth v4.0 BLE only)
  • 10. Qualcomm (130nm CMOS BT 3.0 + EDR)
  • 11. Qualcomm (Integrated Baseband Bluetooth Devices)
  • 12. RDA (CMOS BT 2.1+ EDR +FM receiver)
  • 13. ST-Ericsson (65nm CMOS v3.0 +HS, v2.1 EDR & FM Rx/Tx)
  • 14. Texas Instruments (65nm CMOS v2.1+EDR + FM Rx/Tx)
  • 15. Texas Instruments (65nm CMOS Bluetooth 4.0+)

VIII. NEAR FIELD COMMUNICATIONS (NFC)

• A. Overview
• B. Technology Standard Overview
• C. Emerging NFC Operators and Services
  • 1. Avea Turkcell, Turkey Commercial
  • 2. Orange, Bouygues Telecom, SFR, France Pre-Commercial
  • 3. China Telecom, China Unicom, China
  • 4. Telefonica O2, Czech Republic Commercial
  • 5. T-Mobile, Czech Republic
  • 6. Du and Etisalat, UAB
  • 7. FarEasTone Telecommunications
  • 8. Starhub, Singapore
  • 9. SKT and KTF, South Korea
  • 10. Chunghwa Telecom, Taiwan
  • 11. Verizon, AT&T, T-Mobile versus Visa, USA
  • 12. KDDI and Softbank Mobile, Japan
  • 13. Vodafone-MasterCard, Bangalore India
• D. GSMA Single Wireless Protocol Standard
• E. NFC Handset and Cards
• F. NFC Chip Market Share
• G. NFC/FeliCa Chip Forecast
• H. NFC Chip Supplier Profiles
  • 1. Broadcom Corporation
  • 2. CSR
  • 3. Fudan Microelectronics Co., Ltd.
  • 4. Infineon
  • 5. Inside Secure
  • 6. NXP Semiconductor N.V.
  • 7. Qualcomm (NFC)
  • 8. Renesas Electronics (NFC and FeliCA Controller/Security)
  • 9. Samsung Electronics (NFC and Felicia)
  • 10. Sony (FeliCa+NFC)
  • 11. STMicroelectronics
  • 12. Texas Instruments (NFC)

IX. TOUCH CONTROLLERS

• A. Overview
• B. Touch Screen Sensor Technology Overview
  • 1. Haptics Touchscreens
  • 2. Resistive Touch Screens
  • 3. Capacitive Touch Screens
  • 4. Optical Touch Technology
• C. Touch Controller Vendor Market Shares
• D. Touch Screen Controller Forecast
• E. Touch Screen Topology
• F. Touch Screen Panel (TSP) Suppliers
  • 1. Chimei Innolux, Taiwan (AMOLED)
  • 2. Chunghwa Picture Tubes (CPT), Taiwan
  • 3. ELK, South Korea (PET Capacitive Touch sensors)
  • 4. Iljin Display, South Korea (Capacitive Touch panels)
  • 5. GiantPlus Technology, Taiwan
  • 6. RitDisplay, Taiwan
  • 7. S-MAC, South Korea
  • 8. Young Fast Optoelectronics, Taiwan
  • 9. J Touch, Taiwan and China
  • 10. Lite-On Mobile, China
  • 11. Melfas South Korea (DPW Capacitive)
  • 12. Wintek, China
• G. Touch Controller Suppliers
  • 1. Analog Devices (Resistive only)
  • 2. Analog Devices (Controllerless Capacitive converters)
  • 3. AKM (Resistive controller)
  • 4. Atmel (Capacitive-touch controllers)
  • 5. Atmel (MXTS100 Active Stylus)
  • 6. CrucialTec (Optical Trackpads, OTP)
  • 7. Broadcom (Full panel custom Capacitive)
  • 8. Cypress Semiconductor (Capacitance Key and Full TSP)
  • 9. Cypress (Optical Track Pad)
  • 10. ELAN Microelectronics (Capacitive multi-touch Module & chip)
  • 11. Epson (Resistive Touch Panels with Controller)
  • 12. eGalax EETI (Capacitive Controller)
  • 13. FocalTech Systems (Capacitive Touch Controller)
  • 14. Fudan Microelectronics Co., Ltd (4-wire Resistive)
  • 15. IDT (Capacitive Touch with Haptics output and LED)
  • 16. ILI Technology (Complete Capacitive Controller line)
  • 17. Maxim (Resistive or capacitive controllers with Haptics Output)
  • 18. Melfas (32 channel Capacitive Controller and touch modules)
  • 19. Microchip (8-32 Channel Capacitive Sensor Controllers)
  • 20. Pixcir Microelectronics
  • 21. Pixart (Optical Laser trackball)
  • 22. Renesas Electronics (Capacitive Touch Controller)
  • 23. Samsung Electronics (Multitouch Capacitive)
  • 24. Silicon Labs (Multitouch Capacitive Controller
  • 25. Sitronix Technology (Multitouch voltage-driven)
  • 26. STMicroelectronics (Full Screen Capacitive)
  • 27. Synaptics (Cap Arrays and Full Screen Capacitive)
  • 28. Texas Instruments (4-Wire resistive, drivers)
  • 29. Texas Instruments (Custom Capacitive Controller for Apple)
  • 30. Weltrend Semiconductor (Resistive, Capacitive Buttons)
• H. Fingerprint and Optical Chip Company Profiles
  • 1. Atmel (Thermo Fingerprint Sensor)
  • 2. Avago Technologies (Optical Finger Navigator Chip/Sensor)
  • 3. Austriamicrosystems (Hall Effect Finger Sensor)
  • 4. AuthenTec (64mm3 Secure Finger Swipe Sensor)
  • 5. Cypress (Optical Track PAD
  • 6. Knowles Electronics (31mm3 ultra low power MEMS Joystick)

X. MEMS and SENSORS

• A. Market Leaders
  • 1. MEMS & Sensor Forecast
• B. MEMS Gyroscopes
  • 1. Gyro Market Share by Supplier and Consumer
  • 2. Gyro Supplier Profiles
    • a) Bosch (30.4mm3, 3-axis Gyro+3-axis Accelerometer)
    • b) Epson Toyocom (30.4mm3, 3-axis Gyro+3-axis Accelerometer)
    • c) InvenSense (16mm3 3- axis yaw and pitch Gyros)
    • d) Kionix-ROHM (14.4mm3 3- Axis Gyro
    • e) Maxim- SensorDynamics AG (Combo Accelerometer and Gyro)
    • f) Panasonic (single axis Yaw Vibration-based Gyros)
    • g) Sony (2-Axis Gyros)
    • h) STMicroelectronics (16mm2 3-axis pitch, roll and yaw Gyro)
    • i) Virtus Advanced Sensors (22.4mm3 SOI 3-Axis Accelerometer
    • j) Murata-VTI (12.7mm2 3-axis Gyro, 4 mm2 3-axis ACC)
• C. Accelerometers and Supplier Profiles
  • 1. MEMS Accelerometer Market Share Leaders
  • 2. MEMS Accelerometer Supplier Profiles
    • a) Analog Devices (MEMS Accelerometers)
    • b) Bosch Sensortec (9mm3 3-axis Accelerometer)
    • c) Freescale (9mm3 capacitive 3-axis Accelerometer)
    • d) Hokuriku Electric Industry (9mm3 3-axis Accelerometer)
    • e) Kionix-Rohm (MEMS 3 axis-Capacitive Accelerometer)
    • f) MEMSIC (3-Axis 88mm3 CMOS thermal- Accelerometers)
    • g) Lapis Semiconductor (28.7mm3 3-axis Piezoresistive ACC)
    • h) Murata-VTI Technologies (3- Axis Piezoresistive)
    • i) Panasonic (25.5mm3 2-axis Angular Rate MEMS Sensor)
    • j) VTI Technologies (19.8mm3 3- axis Capacitive Accelerometer)
    • k) STMicroelectronics (9mm3 Accelerometer, 16mm3 Gyros)
• D. Digital Compass Supplier Profiles
  • 1. MEMS Compass (Magnetometer) Market Share Leaders
  • 2. MEMS Digital Compass Supplier Profiles
    • a) AKM (19.5 mm3, 6 axis Compass and Accelerometer)
    • b) Bosch Sensortec (8.55mm3 6 axis Magnetometer and ACC)
    • c) MEMSIC
    • d) Honeywell Microelectronics (8.1mm3, Magnetoresistive (AMR))
    • e) STMicroelectronics (15mm3 6-axis Compass + Accelerometer)
    • f) Yamaha (4mm2 3-axis geomagnetic sensor chip)
• E. Ambient Light and Proximity Sensors
  • 1. MEMS Proximity and Light Sensor Market Share Leaders
  • 2. MEMS Proximity and Light Sensor Profiles
    • a) Analog Devices (Proximity sensor))
    • b) Austriamicrosystems-TAOS (ALS and ALS/PS combo)
    • c) Avago Technologies (3.146 mm2 ALS, PS)
    • d) Intersil (2.8mm3 Digital PS and ALS)
    • e) Capella Microsystems (ALS)
    • f) OSRAM Opto Semiconductor (13mm3 PS and 2.8mm3 ALS)
    • g) Lapis-Rohm Semiconductor (Optical ALS/Proximity combo)
    • h) Sharp Optronics (PS/ALS combo)
    • i) Silicon Laboratories (PS or PS/ ALS Combo)
• F. MEMS Pressure Sensors
  • 1. MEMS Pressure Sensor Market Share
  • 2. MEMS Pressure Sensor Supplier Profiles
    • a) VTI Technologies (1.67mm3 Pressure Sensor)
    • b) Freescale (16.5mm3 Pressure Sensor)
    • c) Bosch Sensortec (1.27mm2 Barometric Pressure Sensor
• G. MEMS Microphones & Supplier Profiles
  • 1. MEMS Microphone Market Share Leaders and Consumers
  • 2. MEMS Microphone Supplier Profiles
    • a) AAC Acoustics Technologies, (MEMS Microphones)
    • b) Analog Devices
    • c) Bosch-Akustica MEMS (CMOS Single chip Microphone)
    • d) BSE
    • e) GoerTek Acoustics, China (MEMS Microphones)
    • f) Infineon and Hosiden (MEMS Microphones)
    • g) Knowles Electronics (11.5mm2 MEMS Microphones)
    • h) MemsTech, Malaysia (MEMS Microphones)
    • i) STMicroelectronics
    • j) Wolfson Microelectronics (22 mm3, silicon Microphones)
    • k) Omron (14.6mm3, MEMS Microphone)
    • l) MEMSensing Microsystems (MEMS Microphones)
• H. RF MEMS Devices
• I. RF MEMS (Tunable Capacitors)
  • 1. Digital Tunable Capacitive Device Usage
  • 2. Tunable RF and CMOS, SOI Antenna Forecast
  • 3. WiSpry (RF MEMS Tunable Capacitors)
  • 4. RFMD (RF transmit/receive and 3G mode switch)
  • 5. Baolab Microsystems (Tunable RF Switch in CMOS)
  • 6. Paratek Adaptive RF (BST Tunable RF CMOS Switch)
  • 7. Peregrine Semiconductor (Digitally Tuned Capacitor)
  • 8. TDK-EPCOS (Tunable RF MEMS capacitor)
• J. FBAR and BAW Duplexers and Filters
  • 1. Duplexors and Multiplexors
  • 2. Filters
  • 3. FBAR/BAW Filter and Multiplexor Supplier Profiles
    • a) Avago Technologies (FBAR Multiplexers, filters)
    • b) Murata (BPAW GPS, WCDMA, TDSCDMA filters)
    • c) Skyworks Solutions (BAW WLAN filter)
    • d) TDK-EPCOS (BAW-SAW Filters & Duplexers)
    • e) TriQuint (BAW filters & Duplexers)
• K. Antenna Switch Modules (AMS) Suppliers
  • 1. SOI Switches and Antenna Switch Module Suppliers
  • 2. Murata Manufacturing Co. (Duplexer, Filters, Switchplexor)
  • 3. Peregrine Semiconductor (CMOS-on-sapphire Antenna Switches)
  • 4. RDA Microelectronics
  • 5. RFMD (CMOS-silicon-on-sapphire SP10T AMS)
  • 6. Skyworks Solutions (GaAs & SOI Switch Modules)
  • 7. Sony (GaAs Antenna Switches)
• L. MEMS Silicon Resonator
  • 1. Early Supplier Technologies
  • 2. Market Opportunity Emerging
  • 3. Silicon MEMS Resonators Supplier Profiles
    • a) Diiscera
    • b) NXP Semiconductors
    • c) SiTime Corporation
• M. MEMS Pico Projector Modules
  • 1. Texas Instruments (Micromirror DLP based)
  • 2. MicroVision Inc. (Laser scanned)
  • 3. Micron (FLCOS based)
  • 4. Btendo Laser Beam Projectors
  • 5. Luminus Devices (PhlatLight LEDs)
• N. MEMS Auto Focus (AF) Actuators for Cameras
  • 1. Cambridge Mechatronics
  • 2. New Scale Technology (Squiggle motor)
  • 3. Varioptic (Liquid Lens)
  • 4. Samsung Electronics
  • 5. Tessera Technologies (Siimpel)

XI. HDMI & MHL for Mobile (MHDI)

• A. HDMI (High-Definition Multimedia Interface)
• B. MHL™ Standard Overview
  • 1. HDMI 1.1
  • 2. HDMI 1.2
  • 3. HDMI 1.2a
  • 4. HDMI 1.3
  • 5. HDMI 1.4
• C. HDMI/MHL Transmitter Supplier Market Shares
• D. HDMI/MHL Five Year Forecast
• E. HDMI & MHL Transmitter Supplier Profiles
  • 1. Analog Devices (1080P HDMI 1.4 Tx)
  • 2. Chrontel (1080P HDMI Tx)
  • 3. Explore Microelectronics (HDMI TV-out Interface device)
  • 4. NXP Semiconductor (Low Power 1.4 Compliant HDMI Tx)
  • 5. Parade Technologies (Display Port/HDMI Dual mode Tx)
  • 6. Silicon Image (1080P MHL TV Interface)
  • 7. Silicon Image (MHL, HDMI)
  • 8. Silicon Image (Low Power HDMI Transmitter) Interface
  • 9. Sunplus Technology
  • 10. Texas Instruments (LVDS Transmitter)
  • 11. Texas Instruments (HDMI Companion interface with 5 volt booster)

XII. APPENDIX

• A.WIRELESS ACRONYMS & ABBREVIATIONS

• Figure 1: Cellular Terminal Peripheral Chip Summary Forecast '11-'16
• Figure 2: Growth of Mobile Phones & Computing Tablets
• Figure 3: Wireless Peripheral Summary Forecast '10-'16
• Figure 4: Camera Image Summary Forecast 2010-2016
• Figure 5: MEMS Summary Forecast 2009-2016
• Figure 6: Image Sensor Unit Market by Image Size: 2011
• Figure 7: Image Sensor Revenue by Image Size: 2011
• Figure 8: Camera Image Sensor Unit Forecast by Pixel Sizes: '11-'16
• Figure 9: Estimated Cellular Device Shipments by Type: 2011
• Figure 10: Image Sensor Chip Market & Vendor Shares: '11
• Figure 11: Image Sensor Volume Vendor Shares: '11
• Figure 12: Typical Hynix Camera Image Sensor
• Figure 13: Global MTV Receiver Shipments by Type: 2011
• Figure 14: Global MTV Receiver Shipments by Type: 2010
• Figure 15: Mobile TV Receiver Shipment Growth by Standard: '07-'16
• Figure 16: World View of Mobile TV Broadcast Standards
• Figure 17: GPS Growth by Mobile Phone Segment
• Figure 18: Cellphone GPS Chip Market & Vendor Shares-All Types: '11
• Figure 19: GPS Dedicated Chip Market & Vendor Shares: '11
• Figure 20: Feature and Mid-Range Market Share for Bluetooth+ FM combo
• Figure 21: FM Growth by Phone Segment: '09-'16
• Figure 22: Cellphone FM Stereo Chip Market & Vendor Shares: '11
• Figure 23: Wi-Fi+BT+GPS Combo Growth Forecast Patterns:'10-'16
• Figure 24: Wi-Fi Chip Market & Vendor Shares: '11.
• Figure 25: MSM7227 Smartphone Module with embedded Wi-Fi/BT SiP Module
• Figure 26: Cellphone Bluetooth Market & Vendor Shares: '11
• Figure 27: Expected Growth of Different Bluetooth combos: '10-'16
• Figure 28: Growth Levels of NFC/FeliCa driven by Handset and Tablets
• Figure 29: Near Field Wireless Chips by Type for 2011
• Figure 30: Near Field Wireless by Type for 2011
• Figure 31: ST33 NFC Secure Element Chip employment diagram
• Figure 32: Touch Overlay Growth by Phone Type: '10-'16
• Figure 33: Touch Overlay Growth by Touch Technology: '10-'16
• Figure 34: Sales Mix of All Touch Controllers: 2011
• Figure 35: Total Touch Controller Market & Vendor Shares: 2011
• Figure 36: 2010 Capacitive Controller Vendor Market Shares: 2011
• Figure 37: Resistive Controller Supplier Market Shares: 2011
• Figure 38: Capacitive Opportunity Mid Range and Feature Phones: '09-'16
• Figure 39: Epson SID13524 Resistive Touch System Block Diagram
• Figure 40: Cypress Optical Finger Navigation Device
• Figure 41: Comparison of Battery Life by Knowles Joystick vs. Others
• Figure 42: Knowles Acoustics MEMS Joystick
• Figure 43: MEMS Cellular Terminal Revenues by Type: 2011
• Figure 44: MEMS Cellular Terminal Revenues by Type: 2010
• Figure 45: Cellular Terminal Sensor Revenue by Segment: 2011
• Figure 46: Emerging Cellular Terminal MEMS Sales: 2011
• Figure 47: Cellular RF MEMS Sales Distribution: 2011
• Figure 48: MEMS Shipment Growth by Type: '09-'16
• Figure 49: Sensor Shipment Growth by Type: '09-'16
• Figure 50: MEMS Cellphone Gyro Revenue by Vendor: 2011
• Figure 51: MEMS Cellular Terminal Accelerometer Market by Vendor: 2011
• Figure 52: MEMS Compass Market Shares by Revenue: 2011
• Figure 53: MEMS Cellular Proximity/ALS Market & Vendor Shares: '11
• Figure 54: Lapis Semiconductor Proximity and ALS Sensor
• Figure 55: MEMS Pressure Sensor Market by Supplier Share: '11
• Figure 56: MEMS Microphone Revenue & Vendor Shares:'11
• Figure 57: RF MEMS Sales by Type 2011
• Figure 58: CMOS Antenna Switch & Digital Tuner Capacitor Forecast: '11-'16
• Figure 59: RFMD/Jazz Semiconductor Prototype TF-SOI PA Module
• Figure 60: Architecture of a Clock Generator
• Figure 61: HDMI/MHL Market Share Leaders
• Figure 62: Functional Block Diagram of ADI HDMI/DVI Transmitter

• Table 1: Camera Usage by Handset Suppliers
• Table 2: Camera Sensor, Modules and Lens Optics Supplier Shares
• Table 3: Cellular Camera Image Sensor Five Year Forecast: '11-'16
• Table 4: Aptina's 1.7μm, 2.2 μm CIS Line up
• Table 5: Hynix Image Sensor Lineup
• Table 6: OmniVision's CIS Lineup
• Table 7: Samsung's Lineup of Camera Sensors and SOC Options
• Table 8: Sharp's CMOS Sensor Module Lineup
• Table 9: Toshiba's Dynastron™ CIS Components based on 1.75μm pixel size
• Table 10: Country Switchover from Analog TV to Digital
• Table 11: Mobile TV Receiver Forecast by Type: '11-'16
• Table 12: Mobile TV Broadcasting Standards
• Table 13: Latin American Status & Launch Dates of ISDB-Tb
• Table 14: Suppliers of DVB-H, DMB, ISDB, & CMMB Devices
• Table 15: Silicon Motion Tuner and Receiver Chips
• Table 16: Cellphone GPS Chip Five-Year Forecast: '11-'16
• Table 17: Cellphone GPS Chip By Type: '11-'16
• Table 18: Forecast of Stereo FM Chip Sales and Volume: '11-'16
• Table 19: ST-Ericsson/NXP RDS FM Stereo & AM Radio Offerings
• Table 20: Cellular Wi-Fi Chip Shipments & Penetration by Phone Type: '11-'16
• Table 21: Cellular Wi-Fi Chip Five-Year Forecast: '11-'16
• Table 22: Bluetooth Data Rates
• Table 23: Comparison of BLTE vs. Standard Bluetooth Protocol
• Table 24: Bluetooth Forecast without Wi-Fi: '11-'16
• Table 25: Bluetooth Forecast with Wi-Fi: '11-'16
• Table 26: Qualcomm Bluetooth Integrated and Standalone Capability
• Table 27: Qualcomm Integrated Digital Baseband Bluetooth Solutions
• Table 28: NFC Stacks
• Table 92: Operators involved In NFC Mobile & Public Transport Payments
• Table 93: Various SIM Standards & Dimensions
• Table 94: NFC Handset Models by Vendor
• Table 95: Near-Field Communications Chipset Forecast: '10-'16
• Table 96: Touch Screen Technology Comparisons
• Table 97: Touch Screen Technology Used in Popular Smart phones
• Table 98: Touch Sensor Chipset Forecast: '11-'16
• Table 99: TSP Type Comparison
• Table 37: CrucialTech OTP Clients
• Table 38: Cypress Programmable System-On-Chip Family Migration
• Table 39: Cypress Capacitive Touch Controller Lineup
• Table 40: Ilitek Capacitive Touch Screen Controller Family of Devices
• Table 41: Silicon Labs Capacitive Small Array Touch Family
• Table 42: STM's Small Array Capacitive Family
• Table 43: STM Full Touch Capacitive Controllers
• Table 44: MEMS Supplier Rankings and Growths 2011-2012
• Table 45: MEMS Five Year Forecast by Type: '11-'16
• Table 46: Gyroscope Applications by Angular Velocity
• Table 47: Gyro Device Markets by Handset Vendor: 2010-2011
• Table 48: Characteristics of Competing tri-axis Gyro Devices
• Table 49: Largest Cellular Consumers of MEMS Accelerometers & Growth '10-'11
• Table 50: Bosch Sensotec Accelerometer family
• Table 51: MEMSIC Thermal-Based vs. Capacitive Accelerometers
• Table 52: Cellular Consumers of Compass Devices from '10-'11
• Table 53: Comparison of Competing 6-Axis Compass/Accelerometers
• Table 54: Top Consumers of ALS & Proximity Sensors
• Table 55: Leading Cellular Pressure Sensor Clients: 2011
• Table 56: Largest Consumers of MEMS Microphones '10-'11
• Table 57: MEMS Microphone Markets by Vendor: '10-'11
• Table 58: Infineon/Hosiden MEMS Microphones
• Table 59: Wolfson Silicon Microphone List
• Table 60: Peregrine Semiconductor Switch Listing
• Table 61: RFMD SP8T & SP10T Switches
• Table 62: Skyworks Solutions GaAs & SOI Switch Modules
• Table 63: Auto-Focus Competition
• Table 64: HDMI and MHL Transmitter Chip Comparisons
• Table 65: HDMI/MHL Shipments in Tablets & Smartphones by Company
• Table 66: HDMI/MHL Five-Year Forecast

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