市場調査レポート - 205345
携帯電話のコアチップ動向 Cellphone Core Chip Trends
発行
Forward Concepts Company
出版日
2011年07月19日 ページ情報
英文 281 Pages
価格
携帯電話のコアチップ動向
Cellphone Core Chip Trends
出版日: 2011年07月19日
ページ情報: 英文 281 Pages
概要
当レポートでは、携帯端末用コアIC市場の現状と見通しについて調査分析し、ベースバンド&アプリケーションプロセッサー、RFトランシーバー、パワーアンプ、PMUのチップタイプ別の出荷数・ASP・収益予測（〜2015年）、主要ベンダーの市場シェア（2010年）、主要サプライヤーのプロファイルなどをまとめ、概略以下の構成でお届けいたします。
第1章 エグゼクティブサマリー
第2章 ベースバンドプロセッサー
ベースバンドプロセッサー市場全体のシェア
デジタルベースバンドプロセッサー予測：エアタイム別
発表済みLTEベースバンドチップ
初期のLTE AIrcard/USBモデム
初期のマルチモード3G/4G LTEスマートフォン
デジタルベースバンドLTE予測
LTEベースバンドサプライヤーのプロファイル
WCDMAベースバンド市場 & ベンダーシェア
WCDMA・WEDGE・HEDGEベースバンドサプライヤーのプロファイル
CDMAベースバンド市場&ベンダーシェア
CDMA2000ベースバンドサプライヤーのプロファイル
TD-SCDMAベースバンドサプライヤーのプロファイル
TD-SCDMAベースバンド市場 & ベンダーシェア
GSM/GPRSベースバンド市場 & ベンダーシェア
GSM・GPRS・EDGEベースバンドサプライヤーのプロファイル
Dual-SIM・GPRS・EDGEベースバンドサプライヤーのプロファイル
低コストなモノリシックベースバンド/RFの市場 & ベンダーシェア
超低コストなモノリシックチップ予測：エアタイム別
EDGEベースバンド市場 & ベンダーシェア
PHS & iDEN & ベンダーシェア
PHSチップセットサプライヤーのプロファイル
第3章 スタンドアロン型アプリケーションプロセッサー
概要
コプロセッサー vs アプリケーションプロセッサー
通信プロセッサー市場の影響
アプリケーションプロセッサー市場 & ベンダーシェア
アプリケーションプロセッサー予測
スタンドアロン型アプリケーションプロセッサーのサプライヤー
画像&ビデオコプロセッサーサプライヤーのプロファイル
3Dビデオコプロセッサーサプライヤーのプロファイル
第4章 通信プロセッサー
通信プロセッサーの概要
DBB通信プロセッサーの予測：エアタイム別
通信プロセッサー市場のシェア
通信プロセッサーの予測
通信プロセッサーのサプライヤーのプロファイル
第5章 無線トランシーバー
概要
無線技術の進化
RFトランシーバー市場全体のシェア
GSM/GPRSトランシーバー市場のシェア
EDGEトランシーバー市場のシェア
CDMAトランシーバー市場のシェア
WCDMA/UMTSトランシーバー市場のシェア
PHS・PDC・TDMA・iDENトランシーバー市場のシェア
無線ランシーバーの予測
2G/3G RFトランシーバーのサプライヤーのプロファイル
4G LTE RFトランシーバーのチップサプライヤー
第6章 統合ベースバンド & RFチップ
ULC端末サプライヤー
ULCモデム市場の規模 & ベンダーシェア
ULCモデム市場予測
超低コスト（BB/RF）モデムサプライヤーのプロファイル
第7章 携帯用パワーアンプ
概要
携帯用パワーアンプの市場シェアのリーダー
携帯用パワーアンプの区分
携帯用パワーアンプ 5ヵ年予測
携帯用パワーアンプサプライヤーのプロファイル
携帯用LTEパワーアンプサプライヤーのプロファイル
第8章 パワーマネジメントユニット（PMU）
概要
PMU自動コーデック/スピーカフォンドライバー
PMUの市場シェア
PMUの5ヵ年予測
PMUの企業プロファイル
付録
図表
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目次
Abstract
This extensive (281-page) market study covers the core integrated circuits
that enable cellphones. In this study, we don' t just track basebands and
application processors, we also track and forecast RF transceivers, power
amplifiers, and power management units. Together, these chips comprise the
core chips of all cellphones. The report provides 2010 vendor market shares
for all of these core cellphone chip types and forecasts units, ASPs and
revenues for all of them through 2015.
Of course, the buzz is now about fourth-generation cellular, in the form of
LTE (Long Term Evolution). We highlight the currently-available LTE chips and
their “sockets” at mid-2011.
To forecast baseband processors separately from application processors would
be folly, since the two increasingly occupy the same die (or the same
package). Stand-alone basebands currently account for barely half of that
market, as illustrated below, but will see that share diminish as technology
and price pressures push for more integrated solutions.
The digital baseband processor market is now segmented into three categories:
Stand-alone digital baseband processors (SA DBB),
Integrated communication processors (Com DBB: application processors + baseband), and Integrated ultra-low-cost (ULC DBB) baseband with RF transceiver on the same die.
This study explores the dynamics of each of these baseband types and profiles
the chip providers and market shares for each of them.
In a similar vein, application processors are characterized in three different
types:
Stand-alone Application Processors (SA-Processor)
Integrated communication processors (Com-Processor), and
Video Co-Processors as adjuncts to basic RISC engines
This study explores the dynamics of each of these application processor types
and profiles the chip providers and market shares for each of them.
The RF transceiver is a key component of mobile handsets, as it is the actual
radio transmitter and receiver...once separate devices, but now available as a
single device...and increasingly being integrated onto the baseband chip (at
least for 2.5G solutions). The complexity of new radio components for advanced
handsets has pushed the leading suppliers into two camps, those that
specialize in power amplifiers bundled with transceivers as an optimized
solution, and those that offer ultra-compact, multi-band transceivers and
matching basebands fabricated with the latest CMOS technology.
Cellular handsets and other mobile devices require efficient power management
unit (PMU) devices as companions to all processors , whether baseband or
application processors, to ensure optimal system operation and long battery
life. Because power management technology requires mixed-signal capability,
analog baseband (ABB) and audio codecs are often integrated on the same die.
We believe that there is no other core cellphone chip market study available
that has the breadth or depth of coverage of this one. You are invited to scan
the table of contents to get an idea of the full extent of this valuable study
and all of the components and companies covered.
With this valuable resource, you will be better equipped to understand the
market and new business opportunities, to know your potential customers and to
be better informed about your competitors. The market metrics provided are
aimed at providing you with dependable information for your company' s next
business plans.
As with all of our reports, your satisfaction is guaranteed.
Report Statistics
Publication Date: July, 2011
AUTHOR: Carter L. Horney
EDITOR: Will Strauss, President of Forward Concepts.
Total Number of Pages: 281
Total Number of Tables: 45
Total Number of Figures: 65
plus Appendix
Table of Contents I. EXECUTIVE SUMMARY
A. Overview
B. Baseband Processors
C. Application Processors
D. RF Chips
E. Analog Baseband & Power Management Units
II. BASEBAND PROCESSORS
A. Overall Baseband Processor Market Shares
B. Digital Baseband Processor Forecast by Air Type
C. Announced LTE Baseband Chips
D. Early LTE AIrcard/USB Modems
E. Early Multimode 3G/4G LTE Smartphones
F. Digital Baseband LTE Forecast
G. LTE Baseband Supplier Profiles
1. Altair Semiconductor Ltd.
2. Broadcom/Beceem (4G LTE/WiMAX Baseband)
3. Cavium Networks (LTE, 3GPP Rel 8 baseband)
4. Innofidei (LTE baseband chip)
5. Intel-Infineon (LTE CMOS RF and 3G/LTE basebands)
6. Leadcore Technology (LTE/TD-SCDMA Platform)
7. LG Electronics
8. MediaTek
9. NVIDIA/Icera (LTE and HSPA+ /EDGE platform)
10. Qualcomm (LTE/3G multimode platform)
11. Renesas Mobile Corp. (LTE Baseband +3G HSPA Platform)
12. Samsung (LTE and WiMAX Baseband)
13. Sequans Communications (LTE and WiMAX Baseband Chip only)
14. ST-Ericsson (LTE 4/3G Platform - DBB, ABB and RF devices)
15. ZTE
H. WCDMA Baseband Market & Vendor Shares
I. WCDMA, WEDGE, HEDGE Baseband Supplier Profiles
1. Broadcom (WEDGE & HSDPA Basebands)
2. Icera Semiconductor (21 Mbps HSPA+ Baseband)
3. Intel/Infineon (7.2 Mbps HSDPA Baseband Chip Set Platform)
4. MediaTek (Othello MT6268 WEDGE Platform)
5. Qualcomm (21-42 Mbps HSPA+ Platforms)
6. ST-Ericsson (WCDMA/HSPA+ Connect Platforms)
J. CDMA Baseband Market & Vendor Shares
K. CDMA2000 Baseband Supplier Profiles
1. VIA Telecom
2. Qualcomm (CDMA2000 1x Advanced Chip Set)
3. Qualcomm (CDMA2000 EV-DO Rev. A)
4. Qualcomm (Tri-mode CDMA1x EV-DO Rev. A, HSPA+/EDGE)
L. TD-SCDMA Baseband Supplier Profiles
1. Leadcore Technology (TD-HSDPA IP)
2. MediaTek (TD-SCDMA/GSM Baseband & RF)
3. Marvell (TD-HSPA Baseband, Apps Processor)
4. Spreadtrum (TD-HSDPA DBB & RF, CMMB receiver, Triple-SIM)
5. ST-Ericsson-TG3 (TD-HSPA Baseband, RF, ABB)
M. TD-SCDMA Baseband Market & Vendor Shares
N. GSM/GPRS Baseband Market & Vendor Shares
O. GSM, GPRS & EDGE Baseband Supplier Profiles
1. Broadcom (Monolithic EDGE BB/RF Transceiver)
2. Intel/Infineon (Class 12 EDGE BB, RF & PMU Platform)
3. Marvell (Tri-band EDGE Baseband)
4. MediaTek (GPRS/EDGE Class 12 Platform)
5. MediaTek (Othello Quad EDGE Platforms)
6. MStar Semiconductor (GSM/GPRS & EDGE baseband)
7. ST-Ericsson (Quad GPRS or EDGE-RX monolithic modem)
P. Dual-SIM, GPRS & EDGE Baseband Supplier Profiles
1. Infineon (EDGE Dual-Active Standby)
2. MediaTek (MT6253 ULC GSM/GPRS, dual standby, single talk)
3. ST- Ericsson (GSM/GPRS ULC Dual- SIM, dual standby, single talk)
4. Spreadtrum (GSM/GPRS triple SIM, triple standby, single talk)
Q. Low-Cost Monolithic Baseband/RF Market & Vendor Shares
R. Ultra-Low-Cost Monolithic Chip Forecast by Air Type
S. EDGE Baseband Market & Vendor Shares
T. PHS & iDEN & Vendor Shares
U. PHS Chipset Supplier Profiles
1. Atheros Communications
2. GCT Semiconductor (CMOS PHS Xceivers)
3. OKI (W-OAM Enhanced PHS Baseband)
III. STAND-ALONE APPLICATION PROCESSORS
A. Overview
B. Coprocessors vs. Application Processors
C. Communication Processor Market Impact
D. Application Processor Market & Vendor Shares
E. Application Processor Forecast
F. Stand-alone Application Processor Suppliers
1. Huawei (Hisilicon K3, MW-Mobile 6.5 Professional)
2. Marvell (55nm ARMADA Applications Processors)
3. Marvell (PXA3xx Applications Processor Family)
4. Marvell (Triple-Core Processor)
5. MediaTek (65nm Standalone Applications Processor)
6. NVIDIA (Tegra2 Dual A9 Standalone Applications Processor)
7. NEC Electronics (40nm EMMA Mobile Dual Cortex-A9 Engine)
8. ST-Ericsson (Nova dual Cortex-A9s)
9. Renesas Electronics (SH-Mobile Application Processors)
10. Samsung (SCS3C2442 Low-Cost MCP Application Processor)
11. Samsung (45nm SC36410 MCP Application Processor)
12. Samsung (S5PC110 1 GHz Cortex-A8 Application Processor)
13. Samsung-Apple A5 (S5PV210 1.2 GHz Dual Cortex-A9+ Mali400 GPU)
14. Samsung (A5PV310, 1.0 GHz Dual Cortex A9+ Mali400 GPU)
15. ST-Ericsson (STn88xx ARM9 Application Processor)
16. Texas Instruments (OMAP343X Applications Processors)
17. Texas Instruments (1GHz OMAP4430 Dual A9 Processor)
G. Image & Video Co-Processor Supplier Profiles
1. Broadcom (VideoCore Graphics Processor)
2. MtekVision (Camera Signal Processor)
3. ST-Microelectronics (Image Signal Processor)
4. Texas Instruments (720P Video Co-Processor)
5. CoreLogic (Image & SD-D1 Co-Processors)
6. Vimicro (JPEG/M 1.3Mp Image Co-Processor)
7. Renesas (12 MP Camera Processor)
H. 3D Video Co-Processor Supplier Profiles
1. Movidius
2. Texas Instruments (OMAP 4440 and OMAP5)
3. NVIDIA (Tegra 2 3D)
IV. COMMUNICATION PROCESSORS
A. Communication Processor Overview
B. DBB Com-Processor Forecast by Air Type
C. Communications Processor Market Shares
D. Communications Processor Forecasts
E. Communications Processor Supplier Profiles
1. Broadcom (Cat 8 HSDPA Baseband-Processor)
2. Broadcom (21 Mbps HSPA+ Cortex A9 Com-Processor)
3. Texas Instruments (EGPRS Communications Processor)
4. Texas Instruments (OMAPV1030 EGPRS Com--Processor)
5. MediaTek (MT6516 EDGE ARM926 Com-processor)
6. MediaTek MT6573 HSDPA/HSUPA 7.2/5.76 Com-Processor
7. Marvell (65nm WEDGE/TD-SCDMA Com-Processor)
8. Panasonic (Single-Chip UniPhier HEDGE Com-Processor)
9. NEC Electronics/Renesas (HSDPA Cat8 /GSM Com-Processor)
10. Renesas Electronics (MP5225 HSPA+/LTE Dual-A9 Com-processor)
11. Qualcomm (Multi-chip HEDGE & EV-DO Multimedia Platforms)
12. Qualcomm (HD Snapdragon HSPA Com-Processor)
13. Qualcomm (ARM11 HSDPA/HSUPA Low Def Platform)
14. Renesas Technology (G3 HSPA/GSM Com-Processor)
15. ST-Ericsson (Hybrid U6715 ARM926EJ-S HSPA Com-Processor)
16. ST-Ericsson (Hybrid U5500 DualA9 HSPA Com-Processor)
17. ST-Ericsson (Two-chip OMAP3430 HSUPA Com-Processor)
V. RADIO TRANSCEIVERS
A. Overview
B. Radio Technology Evolution
C. Overall RF Transceiver Market Shares
D. GSM/GPRS Transceiver Market Shares
E. EDGE Transceiver Market Shares
F. CDMA Transceiver Market Shares
G. WCDMA/UMTS Transceiver Market Shares
H. PHS, PDC, TDMA, iDEN Transceiver Market Shares
I. Radio Transceiver Forecast
J. 2G/3G RF Transceiver Supplier Profiles
1. AKM ( Tri-band WCDMA/HSDPA Xceiver)
2. MediaTek (TD-SCDMA and WCDMA Xceiver
3. MediaTek (CMOS quad GSM/GPRS Xceiver)
4. Broadcom (Polar EDGE Xceiver & EDGE ULC)
5. Broadcom (65nm Bands I-X WCDMA/HSPA Xceiver & EDGE)
6. Fujitsu (90nm 10-band HSPA/ EDGE RF Subsystems)
7. GCT Semiconductor (CMOS 800 MHz CDMA2000 Xceiver)
8. Intel/Infineon (130nm CMOS WEDGE & LTE Xceivers)
9. ST-Ericsson (3GPP Rel 6 WCDMA/HSPA Xceiver)
10. ST-Ericsson (Cat 7/8 GSM/GPRS/EDGE/WCDMA Xceiver)
11. ST-Ericsson (130nm dual band CMOS TD-SCDMA Xceiver)
12. Qualcomm (CMOS Diversity WEDGE Xceiver + GLONASS GPS)
13. RDA Microelectronics (CMOS TD-SCDMA, GPRS Xceivers)
14. Renesas (SOI BiCMOS 8-band HEDGE & EDGE Xceiver)
15. Skyworks Solutions (WEDGE & EDGE Xceivers)
16. Icera (CMOS 7-band WCDMA/HEDGE Xceiver)
17. Sony Semiconductor (SiGe BiCMOS WCDMA/HSPA Xceiver)
18. Spreadtrum (7-band CMOS WEDGE, TD-SCDMA Xceiver)
K. 4G LTE RF Transceiver Chip Suppliers
1. Altair Semiconductor (1.9-2.7 GHZ CMOS Transceiver)
2. FCI/Silicon Motion (CMOS LTE Transceiver)
3. Fujitsu Microelectronics (LTE FDD1-17, TDD-34, 38 Transceiver)
4. GCT Semiconductor (R8 FDD Multiband +700 MHz)
5. Huawei-Option' s M4S (Reconfigurable RF Transceiver)
6. Icera/NVIDIA (multi LTE/HSPA+)
7. Intel/Infineon (LTE/3GPP Rel. 7/8, 1-IX band Transceiver)
8. Maxim (2.3-2.7 GHz WIMAX/TD-LTE Transceiver)
9. Huawei Technologies (M4S SAW-less reconfigurable transceiver)
10. Renesas (LTE Software Reconfigurable Radio)
11. ST-Ericsson (LTE 4 band RF bundled platform)
VI. INTEGRATED BASEBAND & RF CHIPS
A. ULC Handset Suppliers
B. ULC Modem Market Size & Vendor Shares
C. ULC Modem Market Forecast
D. Ultra-Low-Cost (BB/RF) Modem Supplier Profiles
1. Broadcom (2.5G Multimedia EDGE Modem, H.264)
2. Infineon (Monolithic GSM and EDGE, MPEG4)
3. MediaTek, Inc. (GSM/GPRS Monolithic Platform)
4. ST-Ericsson (GSM/GPRS and EDGE Monolithic)
5. Qualcomm (WCDMA/HSDPA Single-Package Modems)
6. Qualcomm (CDMA 1x Single-Chip & MCP Modems)
7. Atheros (PHS baseband/RF)
VII. CELLPHONE POWER AMPLIFIERS
A. Overview
B. Cellphone Power Amplifier Market Share Leaders
C. Cellular Power Amplifier Segmentation
D. Mobile Power Amplifier Five Year Forecast
E. Cellular PA Supplier Profiles
1. Anadigics
2. Avago Technologies
3. Maxim Semiconductor (CDMA, PDC and AMP)
4. Mitsubishi Electronic Devices (GaAs Hybrid CDMA and WCDMA)
5. Renesas Technology Corp
6. RF Micro Devices
7. RDA Microelectronics (Quad GSM & TD-SCDMA 1800)
8. Skyworks
9. TriQuint Semiconductor
F. LTE PA Supplier Profiles
1. Anadigics (FDD 1, 2, 7, 8, 20, 3/4/9/10, 5/6/18/19, 12/17,13/14; TDD
38, 40)
2. Mitsubishi Electric
3. Skyworks (FDD 1, 4/9, 5/6, 7, 8, 9, 13/14, 12/17 and TDD 38/40)
4. RFMD (Single bands 12/13 or 7)
5. TriQuint Semiconductor (band 13, 17 of the USA 700 MHz)
VIII. POWER MANAGEMENT UNITS
A. Overview
B. PMU Audio Codec/Speakerphone Drivers
1. AKM Semiconductor (CMOS 24-bit Audio)
2. Cirrus Logic (CMOS Audio Codec)
3. Texas Instruments (Audio Codec+ USB and miniDSP)
4. Maxim (Stereo Audio Codec)
5. Wolfson Microelectronics (Stereo Codec with SPKR drivers and Class W
headphone)
C. PMU Market Shares
D. PMU Five-Year Forecast
E. PMU Company Profiles
1. Anpec Electronics (Battery charge management)
2. Broadcom
3. Dialog Semiconductor (CMOS PMU/Audio subsystem)
4. Infineon (RF-Baseband Power Management)
5. Linear Technology (Energy Management)
6. Maxim Integrated Products
7. MediaTek (Baseband)
8. Micrel (BiCMOS, discrete specific PMUs)
9. National Semiconductor
10. Qualcomm (Cellular Power Management)
11. Ricoh Electronic Devices (7 channel PMU + white LED driver)
12. ST-Ericsson (Application Processor PMU)
13. Texas Instruments (Processor PMUs)
14. Wolfson Microelectronics (Audio Codec, MEMS Mics)
IX. APPENDIX
A. WIRELESS ACRONYMS & ABBREVIATIONS
FIGURES
Figure 1: 3G Baseband Growth by Cellular Standards
Figure 2: Cellphone Digital Processor Summary Forecast
Figure 3: Application Processor and Co- Processor Forecast
Figure 4: Analog Baseband, RF and Power Amplifier Chip Sales Summary
Figure 5: Baseband Sales Distribution by Segment: 2010
Figure 6: Digital Baseband Vendor Market Shares: 2010
Figure 7: Forecast Growth Patterns of Handset Types ‘09 - ‘15
Figure 8: WCDMA/HSPA/TD-SCDMA Baseband Vendor Market Shares: ' 10
Figure 9: CDMA Stand-Alone Baseband Vendor Market Shares: ' 10
Figure 10: TD-SCDMA Baseband Vendor Market Shares: ' 10
Figure 11: GSM/GPRS Baseband Market by Vendor: 2010
Figure 12: ULC Baseband/RF Vendor Market Shares: 2010
Figure 13: Monolithic Growth Shifts to EDGE and 3G
Figure 14: Monolithic Market Growth Trends: ‘09-‘15
Figure 15: EDGE Baseband Vendor Market Shares: 2010
Figure 16: PHS & iDEN Baseband Vendor Market Shares: ' 10
Figure 17: Application Processor: A Division of Labor
Figure 18: Application Processor & Coprocessor Revenues: ‘10
Figure 19: Slave Coprocessor Market by Type: ‘10
Figure 20: Baseband Processor Revenues by Type: ‘09
Figure 21: Baseband Processor Revenues by Type: ‘10
Figure 22: Standalone Application Processor vs. Com-Processor Growth
Figure 23: Standalone Application Processor Vendor Market Shares: 2010
Figure 24: Baseband+Application Processor Vendor Market Shares: 2010
Figure 25: Marvell PXA320 Standard-Definition SoC Block Diagram
Figure 26: NEC Mobile Application Processor Migration Plan
Figure 27: Block Diagram: NEC Electronics EMMA Mobile 1-D
Figure 28: Block Diagram Renesas EMMA Mobile/EV1
Figure 29: Block Diagram Renesas EMMA Mobile/EV2
Figure 30: STMicro Nomadik STn8815 Applications Processor Block Diagram
Figure 31: TI OMAP44x Block Diagram
Figure 32: Broadcom High-Def Mobile Multimedia Co-Processor Block Diagram
Figure 33: Core Logic Multimedia Device Block Diagram
Figure 34: Com-processor Growth by Air-Type over five-year period.
Figure 35: Communications Processor Market Shares: ' 10
Figure 36: Baseband-Application Processor vs. Standalone Growth Forecast
Figure 37: Com-Processor vs. Standalone Apps Processor Market: 2010
Figure 38: Broadcom' s HEDGE Communications Processor
Figure 39: OMAP850 Communications Processor Block Diagram
Figure 40: OMAPV1030 Communications Processor Block Diagram
Figure 41: NEC Electronics Medity2 Chipset
Figure 42: Qualcomm' s MSM7600 Chipset Solution
Figure 43: Renesas G4 Cortex-A8 DBB Com-Processor
Figure 44: ST-Ericsson U6715 DBB Com-Processor
Figure 45: ST-Ericsson U5500 Rel7 HSDPA Smartphone Com-Processor
Figure 46: ST-Ericsson U8500 HSPA Smartphone Com-Processor
Figure 47: ST- Ericsson U370 Com-Processor
Figure 48: Overall Cellular RF Transceiver Market by Vendor: ‘10
Figure 49: GSM/GPRS RF Transceiver Shipments by Vendor: ' 10
Figure 50: Integrated RF/Baseband Transceiver Market by Vendor: ‘10
Figure 51: EDGE RF Transceiver Shipments by Vendor: ' 10
Figure 52: CDMA/1xEV-DO Radio Transceiver Shipments by Vendor: ' 10
Figure 53: WCDMA RF Transceiver Shipments by Vendor: ' 10
Figure 54: Fujitsu' s MB86L01A: Multiband WCDMA/EDGE Radio Block Diagram
Figure 55: Cellular Monolithic BB/RF Modem Chip Market by Vendor: ' 10
Figure 56: ULC Cellular Phone Shipments by Technology: ' 10
Figure 57: ULC Shipment Forecast by 2G, 2.5G & 3G Technology
‘09-‘15
Figure 58: ULC Sales Growth by 2G, 2.5G & 3G Technology ‘09-‘15
Figure 59: ST-E PNX4902 GPRS/EDGE Modem Block Diagram
Figure 60: Cellular Power Amplifier Market by Vendor: 2010
Figure 61: 3G/4G Cellular Handset Growth over the Five Year Period
Figure 62: Phone Growth by Type: ‘09-‘15
Figure 63: TI Stereo Audio Codec Block Diagram
Figure 64: PMU Market & Vendor Shares: 2010
Figure 65: PMU Revenue Distribution by Type: 2010
TABLES
Table 1: DBB Processor Forecasts by Air Type: ‘09-‘15
Table 2: LTE Digital Baseband Forecasts by Air Type: ' 10-' 15
Table 3: Comparison of 4G Technologies: WiMAX vs. 3GPP-LTE
Table 4: DBB ULC Forecasts by Air Type: ‘09-‘15
Table 5: Tablet Usage of Application Processors & Vendor Market Share
Table 6: Application & Co-Processor Forecast by Type: ‘09-‘15
Table 7: Stand-alone Application Processor Features & Usage
Table 8: Stand-alone Application Processor Features & Usage (continued)
Table 9: Stand-alone Application Processor Features & Usage (continued2)
Table 10: NVIDIA Tegra 250 Applications Processor Features
Table 11: NEC EMMA ARM-based Application Processor Family
Table 12: TI OMAP34x, OMAP36x & OMAP44x Applications Processors
Table 13: Nokia Captive OS-Based 3G Com-Processors from TI
Table 14: O/S-Based 2G Com-Processor Supplier Usage and Features
Table 15: Monolithic O/S-Based Com-Processor Supplier Usage & Features
Table 16: DBB Com-Processor Five Year Forecast by Air Type:
‘09-‘15
Table 17: Monolithic O/S-Based Com-Processor Supplier Usage & Features
Table 18: Communication Processor Forecast ' 09-‘15
Table 19: 3G DBB Communication Processor Capability
Table 20: 3G DBB Communication Processor (Continued)
Table 21: Stand-alone Apps Processor Status by Vendor
Table 22: Stand-alone Apps Processor Status by Vendor (continued)
Table 23: Texas Instruments Modem/Application Processor Pairings
Table 24: Qualcomm' s MSM Processor Evolution: 2000 to 2008
Table 25: Qualcomm MSM7600 Chipset RF Options
Table 26: Qualcomm Snapdragon Communication Processors
Table 27: Overview of 3G/IMT-2000 Standards
Table 28: Radio Transceiver 5-Year Forecast by Wireless technology
Table 29: Frequency Bands & Channel Widths for LTE
Table 30: Integrated BB/Xceiver Chip Five Year Forecast:
‘09-‘15
Table 31: Comparison of Single-Chip GSM, CDMA & EDGE Modems
Table 32: MediaTek' s Competing Two-Chip GSM/GPRS Platforms
Table 33: Qualcomm' s Single-Chip CDMA1x Modems
Table 34: Global UMTS-FDD Paired bands and Regions of Coverage
Table 35: Cellphone Power Amplifier Unit Forecast by Air Technology:
‘09-‘15
Table 36: Cellular Power Amplifier Unit Forecast by Handset Type:
‘09-‘15
Table 37: Cellular Power Amplifier (PA & PAM) Forecast by Type:
‘09-‘15
Table 38: Selected PAM and FEM Suppliers & Popular Handset Sockets
Table 39: Anadigics Amplifier Modules for CDMA, GSM & HSPA
Table 40: Avago' s Lineup of CDMA & WCDMA Power Amplifiers
Table 41: Mitsubishi GaAs Hybrid Devices for CDMA & WCDMA
Table 42: RFMD' s 3G WCDMA/HSPA and CDMA EV-DO Power Amplifiers
Table 43: Skyworks' Cellular 2G & 3G PA/FEM Product Line
Table 44: TriQuint' s Lineup of WCDMA/HSUPA & HEDGE Power Amplifiers
Table 45: Cellphone Power Management Unit Forecast by Type:
‘09-‘15
「携帯電話のコアチップ動向 」は2011年07月19日にForward Concepts Company より発行されました。 当レポートは281 Pagesで構成され、税抜￥375,182より販売しています。
