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市場調査レポート

ZyXELのWiMAXネットワーク対応CPE:MAX-206M2

ZyXEL XOHM WiMAX CPE Model MAX-206M2

発行 EJL Wireless Research
出版日 2008年10月 商品コード 75560
ページ情報 英文 38 Pages, 11 Tables, 20 Exhibits
価格
US$ 3,495 換算 ¥ 282,011 (税抜) PDF by E-mail (Single User License)
US$ 10,485 換算 ¥ 846,034 (税抜) PDF by Email, Enterprise use license (up to five users)


原文目次

Abstract

This report covers the design analysis of a XOHM ZyXEL WiMAX access point unit. The unit was manufactured in 2008.

The following semiconductor & passive component suppliers are included in this report:

Diodes Inc., Freescale Semiconductor, Infineon Technologies, Macronix International, Maxim Integrated Products, Monolithic Power Systems, national Semiconductor, NXP Semiconductors, ON Semiconductor, PMC Sierra, Samsung Electronics, SANYO Electric Co., Ltd., Sequans Communications, Silicon Labs, Texas Instruments, TXC Corporation, Winbond Electronics Corp.

Features:

  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type

Table of Contents

EXECUTIVE SUMMARY

  • Active/Passive Component Summary
  • Important Note:

CHAPTER 1: SPRINT XOHM WIMAX TECHNOLOGY

  • 1.1 Overview of XOHM Network Technology

CHAPTER 2: ZYXEL ACCESS POINT MODEM PRODUCT

  • 2.1 Product Analysis
  • 2.2 Mechanical Analysis
  • 2.3 System Architecture Analysis

CHAPTER 3: DIGITAL NETWORK FUNCTION PCB

CHAPTER 4: RF WIMAX PCB

  • 4.1 Section A WiMAX Mobile Baseband
  • 4.2 Section B WiMAX Transceiver
  • 4.3 Section C WiMAX Power Amplifier
  • 4.4 Section D
  • 4.5 Section E
  • 4.6 RF Microstrip Circuit Diagram
  • 4.7 RF MIMO Antennas

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

  • Table 1: Digital Network Function PCB Bill of Materials, Top View
  • Table 2: Digital Network Function PCB Bill of Materials, Top View (con' t)
  • Table 3: Digital Network Function PCB Bill of Materials, Bottom View
  • Table 4: RF WiMAX PCB Section A Bill of Materials
  • Table 5: RF WiMAX PCB Section B Bill of Materials
  • Table 6: RF WiMAX PCB Section C Bill of Materials
  • Table 7: RF WiMAX PCB Section D Bill of Materials
  • Table 8: RF WiMAX PCB Section E Bill of Materials
  • Table 9: Active/Passive Component Distribution by System Subsection
  • Table 10: Passive Component Case Size Distribution by System Subsection
  • Table 11: Active Semiconductor Vendor Distribution by System Subsection

EXHIBITS

  • Exhibit 1: Xohm WiMAX Network Diagram
  • Exhibit 2: XOHM WiMAX Devices
  • Exhibit 3: XOHM ZyXEL Access Point Modem Product
  • Exhibit 4: Front View, External
  • Exhibit 5: Front View, Internal
  • Exhibit 6: Back View, External
  • Exhibit 7: Back View Internal
  • Exhibit 8: Top View
  • Exhibit 9: Bottom View
  • Exhibit 10: Side View
  • Exhibit 11: Access Point Modem Product Label
  • Exhibit 12: Ethernet and MAC Address Label
  • Exhibit 13: Access Point System
  • Exhibit 14: Digital Network Function PCB Component Diagram, Top View
  • Exhibit 15: Digital Network Function PCB Component Diagram, Bottom View
  • Exhibit 16: RF WiMAX PCB Dimensions
  • Exhibit 17: RF WiMAX PCB Section A Component Diagram
  • Exhibit 18: Sequans SQN1130 SoC Diagram
  • Exhibit 19: RF WiMAX PCB Section B Component Diagram
  • Exhibit 20: RF WiMAX PCB Section C Component Diagram
  • Exhibit 21: RF WiMAX PCB Section D Component Diagram
  • Exhibit 22: RF WiMAX PCB Section E Component Diagram
  • Exhibit 23: WiMAX Power Amplifier RF Circuit Dimensions
  • Exhibit 24: RF Antennas, Top View
  • Exhibit 25: RF Antennas, Bottom View
  • Exhibit 26: RF Antenna Pattern Dimensions
  • Exhibit 27: Passive Component Case Size Distribution
  • Exhibit 28: Active Semiconductor Component Share
  • Exhibit 29: Identified Active Semiconductor Market Share by Vendor
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