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市場調査レポート

ソーラーグレードシリコン、インゴット、ウエハ技術および市場動向

Solar Grade-Silicon, Ingot, Wafer Technology and Market Trend

発行 DisplayBank
出版日 2009年02月 商品コード 83630
ページ情報 英文  
価格
こちらの商品の販売は終了いたしました。

当商品の販売は、2011年09月05日を持ちまして終了しました。

原文目次

Abstract

The solar cell market recorded more than 40% average annual growth rate from 2007 to 3Q 2008 due to the government support policies of many countries and the importance of the photovoltaic business considering the global environmental issues. The poly-silicon, a raw material for the crystalline solar cell, became scarce due to the high growth rate, and the spot price of short-term contract recorded an increase up to USD 400/Kg to show the scarcity in the raw material supply. A number of companies announced their plans to join the poly-silicon business which showed a high earning rate.

The graph below illustrates a data collected by analyzing trends of 80 new companies including the 7 major global poly-silicon makers. It shows a forecast of solar cell p-Si supply volume by three scenarios. The p-Si supply volume was projected to exceed the demand starting in 2009 and will record the highest surplus in supply in 2010.

A short-term (2009~2010) surplus in supply, like in Scenario 2, was expected when considering the potentials to delay the large-scale investment by newly joining companies due to the global economic slump by 2009 to the first half of 2010 and to cut the productions of the conventional p-Si makers. It appeared possible to see a reverse effect of the scarcity in the raw material supply starting in 2011. The conventional makers focused in the product differentiation by enhancing the quality and purity of the poly-silicon and propelled to secure a stable poly-silicon price.

Table of Contents

1. Introduction

  • 1.1. Renewable Energy and Photovoltaic
  • 1.2. Low-cost Strategy for Solar cell
  • 1.3. Poly Silicon Process

2. Poly silicon Technologies

  • 2.1. Metallurgical Grade-Silicon (MG-Si) Process
  • 2.2. Solar Grade-Silicon (SoG-Si) Process
  • 2.3. Current Technologies (Siemens Process)
    • 2.3.1. Siemens Process using TCS (TrichloroSilane)
    • 2.3.2. Siemens Process using MS (Monosilane)
    • 2.3.3. Hydrogen reduction Process using Tetrachlorosilane
  • 2.4. Alternative Technologies 1 (FBR, VLD, FSR Process)
    • 2.4.1. Fluidized Bed Reactor (FBR) : MEMC, Wacker, REC etc.
    • 2.4.2. Vapor to Liquid Deposition (VLD) : Tokuyama
    • 2.4.3. Free Space Reactor (FSR) : Joint Solar Silicon
  • 2.5. Alternative Technologies 2 (Metallurgical Process)
    • 2.5.1. Acid Leaching
    • 2.5.3. SOLSILC Process (Netherlands, Norway)
    • 2.5.4. UMG-Si Process (Elkem, Norway)
    • 2.5.5. Vacuum Refining Process (Kawasaki Steel Corporation, Japan)
  • 2.5.6. Dow Corning' s route - NREL

3. Ingot/ Wafer Process

  • 3.1. Ingot Process
    • 3.2.1. Czochralski Process (CZ)
    • 3.2.2. Float-Zone Process (FZ)
  • 3.3. Multicrystalline ingot
    • 3.3.1. Block Casting Process
    • 3.3.2. Electromagnetic Casting Process
  • 3.4. Wafering Process
  • 3.5. New Wafer Technology
    • 3.5.1. Ribbon Wafer
    • 3.5.2. Ribbon Wafer (Type I)
    • 3.5.3. Ribbon Wafer (Type =±)
    • 3.5.4. EFG (Edge-defined Film Growth, type 1)
    • 3.5.5. SR (String Ribbon, type 1)
    • 3.5.6. DW (Dentric Web, type 1)
    • 3.5.7. RGS (Ribbon Growth on Substrate, type 2)
    • 3.5.8. CDS (Crystallization on Dipped Substrate, type 2)
    • 3.5.9. SSP Ribbon ( Silicon sheets from powder )
  • 3.6. Thin Wafer
    • 3.6.1. DFT (Direct Film Transfer)
    • 3.6.2. SLIM (Stress-Induced Lift-off Method)

4. Polysilicon Manufacturers Status

  • 4.1. Current Producer
    • 4.1.1. Hemlock Semiconductor (HSC)
    • 4.1.2. Wacker Chemi
    • 4.1.3. Renewable Energy Corporation (REC)
    • 4.1.4. Tokuyama
    • 4.1.5. Monsanto Electronic Materials (MEMC)
    • 4.1.6. Mitsubishi Materials Corporation (MMC)
    • 4.1.7. Sumitomo
  • 4.2. New Entrants - Current Technologies
    • 4.2.1. Silicium De Provence (SilPro)
    • 4.2.3. Other Korean
    • 4.2.4. Isofoton and ENDESA
    • 4.2.5. Hoku Scientific
    • 4.2.6. M. Setek
    • 4.2.7. LDK Solar
    • 4.2.8. Emei
    • 4.2.9. LuoYang China Silicon
    • 4.2.10. Sichuan Xinguang
    • 4.2.11. Nitol Solar
  • 4.3. New Entrants-Alternative Technologies
    • 4.3.1. Elkem Solar
    • 4.3.2. Joint Solar Silicon (JSSI)
    • 4.3.3. Solarvalue AG
    • 4.3.4. Dow Corning
    • 4.3.5. Becancour Silicon (BSI)
    • 4.3.6. AE Polysilicon

5. Ingot/Wafer Producers

  • 5.1. PCMP (Podolsky Chemical & Metallurgical Plant)
  • 5.2. Pillar JSC
  • 5.3. PV Crystalox Solar
  • 5.4. M. Setek
  • 5.5. REC-Sitech, Scanwafer
  • 5.6. Wacker Shott Solar
  • 5.7. MEMC
  • 5.8. Silicon Ltd (Soetlorodsk)
  • 5.9. Swiss Wafer
  • 5.10. Solar World
  • 5.11. Kyocera
  • 5.12. ASi Industries GmbH

6. Poly-Si Market Forecast (2007~2012)

  • 6.1. poly-Silicon Production & Capacity
  • 6.2. p-Si supply & Demand forecast for solar cell
  • 6.3. p-Si Production & Capacity by company
  • 6.4. Poly Silicon Price (Contract, Spot)
  • 6.5. poly-Silicon Revenue forecast (Solar)
  • 6.6. poly Silicon Production Cost by Technology
  • 6.7. poly-Silicon Capacity by Region
  • 6.8. poly-Silicon Production Forecast by Region
  • 6.9. poly-Silicon production by technology
  • 6.10. UMG-Si
  • 6.11. Ingot/Wafer Production
  • 6.12. Wafer Revenue
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