English Korean Chinese
ホーム > 市場調査レポート > 電子部品/半導体 > 半導体材料 > 半導体材料分析(2009年):ガスケミカル
カテゴリ
電子部品/半導体 (2131)
MEMS (103)
コネクター (73)
センサー (204)
ディスプレイ (231)
パワーデバイス (112)
プリントエレクトロニクス (126)
照明/LED (187)
半導体材料 (79)
半導体製造 (502)
市場調査レポート

半導体材料分析(2009年):ガスケミカル

Semiconductor Material Analysis 2009: Gas Chemical

発行 DisplayBank
出版日 2009年09月 商品コード 102555
ページ情報 英文  
価格
US$ 5,500 換算 ¥ 443,795 (税抜) PDF By E-mail


原文目次

Abstract

In 2009, Displaybank newly publishes Research Reports for the Semiconductor Industry. Among our plans to publish reports regarding the material which is one of the key elements in the semiconductor industry focusing especially on chemical material, Displaybank' s Semiconductor Report series #4, ' Semiconductor Material Analysis 2009: Gas Chemical' is now available.

  • * This report deal with 6 most heavily used gases (NF3, SiH4, DCS, NH3, WF6, CF Gas)
  • * CF Gas includes CF4, C2F6 and C3F8

Chapter 1. Chemical Vapor Deposition

  • Types and Roles of Gas Chemical
  • CVD Process, Dry Etching, Chamber Cleaning Process Introductionz

Chapter 2. Major Semiconductor Maker

  • Major Semiconductor Maker List by Region (Excluding Fabless Makers)
  • 25 major semiconductor makers' Line information and manufactured products. (Intel, Samsung Electronics, Texas Instrument and Toshiba' s wafer Line Capa information by inch & manufactured product classification)

Chapter 3. Worldwide Gas Chemical Market Trend

  • Market trend and forecast (half-yearly basis) from 2008 to 2011 for Gas Chemical in Semiconductor Manufacturing Process in both Unit and Revenue base
  • Worldwide market trend and forecast (half-yearly basis) from 2008 to 2011 for NF3, SiH4, NH3, DSC, WF6 and CF Gas in both Unit and Revenue base
  • Regional segmentation of market trend and forecast from 2008 to 2011 (half-yearly basis) for the 6 items by device in regions including US (North America), Europe, Korea, Japan, Taiwan, China and others in both Unit and Revenue base

Chapter 4. Market Trend in Korea

  • Samsung Electronics, Hynix and other makers' per-Line information (Inch, Capa, Wafer injection quantity on half-year based, Manufactured product, Changes/Updates in Line)
  • Usages in Quantity for NF3, SiH4, DCS, NH3, WF6, CF(CF4, C2F6, C3F8, etc) by each Fab. (Actual usage in 2008 for half-yearly basis & expected usage in 2009 for half-yearly basis)
  • Supplier Analysis based on Each Fab
  • Suppliers by each product category for Samsung Electronics and Hynix & monthly average usage based on 2Q, 3Q of 2009)

Chapter 5. Market Analysis

  • Competition Angle Analysis by Each Item
  • Price Analysis for Each Item
  • Business Issues & Trend Analysis for Each Item

Table of Contents

Chapter 1. Chemical Vapor Deposition

  • 1. Introduction
  • 2. Semiconductor Manufacturing Process
  • 3. Gas Chemical
  • 4. CVD (Chemical Vapor Deposition)
  • 5. Dry Etching
  • 6. Chamber Cleaning

Chapter 2. Major Semiconductor Maker

  • 1. Semiconductor Maker
    • 1-1. Semiconductor Maker by Region
    • 1-2. Semiconductor by Product Category
  • 2. Major Semiconductor Maker(25#)
    • 2-1. Intel, Samsung, Texas Instruments, Toshiba
    • 2-2. STMicroelectronics, TSMC, Hynix, Renesas, SONY
    • 2-3. NXP, AMD, Infineon, NEC, Freescale , Micron Technology, Fujitsu
    • 2-4. IBM, Elpida Memory, Panasonic, UMC, Sharp, Spansion, Powerchip, ProMOS, Nanya

Chapter 3. Worldwide Gas Chemical Market Trend

  • 1. Worldwide Market Trend: 2008~2011
    • 1-1. Gas Market Trend
    • 1-2. NF3 Gas Market Trend
    • 1-3. SiH4 Gas Market Trend
    • 1-4. DCS Gas Market Trend
    • 1-5. NH3 Gas Market Trend
    • 1-6. WF6 Gas Market Trend
    • 1-7. CF Gas Market Trend
  • 2. Market Trend by Region: 2008~2011
    • 2-1. NF3 Gas Market Trend
    • 2-2. SiH4 Gas Market Trend
    • 2-3. DCS Gas Market Trend
    • 2-4. NH3 Gas Market Trend
    • 2-5. WF6 Gas Market Trend
    • 2-6. CF Gas Market Trend

Chapter 4. Market Trend in Korea

  • 1. Fab Status
    • 1-1. Samsung: Product, Capa, Wafer Size, Input Wafer Trend, Information
    • 1-2. Hynix & Others: Product, Capa, Wafer Size, Input Wafer Trend, Information
  • 2. Market Trend: NF3 Gas
    • 2-1. Market Trend by Line : Volume
    • 2-2. Market Trend by Line : Amount
    • 2-3. Supply Chain
  • 3. Market Trend: SiH4 Gas
    • 3-1. Market Trend by Line : Volume
    • 3-2. Market Trend by Line : Amount
    • 3-3. Supply Chain
  • 4. Market Trend: DCS Gas
    • 4-1. Market Trend by Line: Volume
    • 4-2. Market Trend by Line: Amount
    • 4-3. Supply Chain
  • 5. Market Trend: NH3 Gas
    • 5-1. Market Trend by Line: Volume
    • 5-2. Market Trend by Line: Amount
    • 5-3. Supply Chain
  • 6. Market Trend: WF6 Gas
    • 6-1. Market Trend by Line: Volume
    • 6-2. Market Trend by Line: Amount
    • 6-3. Supply Chain
  • 7. Market Trend: CF Gas
    • 7-1. Market Trend by Line : Volume
    • 7-2. Market Trend by Line : Amount
    • 7-3. Supply Chain
  • 8. Market Trend : Overall
    • 8-1. SEC : TEOS, TEB, TEPO, TMA, ALPIS, TEMAZr, TEMAHf, TiCl4,
    • 8-2. Hynix : TEOS, TEB, TEPO, TMB, TMOP, TMA, TCA, TEMAZr, TiCl4

Chapter 5. Market Analysis

  • 1. Market Analysis : Reaction Gas
    • 1-1. Market Forecast
    • 1-2. Price Trend : SiH4, DCS, NH3, WF6
    • 1-3. Industry Analysis
  • 2. Market Analysis : Cleaning & Etching Gas
    • 2-1. Market Forecast
    • 2-2. Price Trend : NF3, C2F6, C3F8, CF4
    • 2-3. Industry Analysis
Back to Top