半導体デバイス向け誘電体材料の世界市場

当商品の販売は、2011年07月19日を持ちまして終了しました。

原文目次

INTRODUCTION

For more than 30 years, silicon dioxide (SiO2) has been the versatile dielectric "fence" material of choice for the semiconductor device industry. It has provided adequately high-capacitance gate insulation at the front end of the line and sufficiently low-k, crosstalk-free insulation between interconnect wiring levels at the back end. Now, thanks to scaled-down chip components, more densely populated chip real estate, and the introduction of low-resistance interconnect materials like copper, the industrys familiar, reliable SiO2 "fencing" no longer is good enough for either application.

Thus, other materials have been developed with lower dielectric constants for interconnect applications and higher dielectric constants for gate or capacitor applications. However, integrating these materials into the wafer and device has brought many challenges that have delayed their introduction. As devices continue to shrink, even lower- or higher-k materials are needed, posing even more integration challenges.

This report analyzes market segments of the semiconductor industry related to development and integration of dielectric materials into the manufacturing process for microprocessors, dynamic memory, and a range of current and emerging technologies, such as system-on-a-chip and silicon-on-insulator. Sectors covered include device manufacturers as well as materials and equipment providers, with company profiles and discussions of future research, development and engineering.

Table of Contents

• INTRODUCTION
  • STUDY GOALS AND OBJECTIVES
  • REASONS FOR DOING THE STUDY
  • CONTRIBUTIONS OF THE STUDY AND FOR WHOM
  • SCOPE AND FORMAT
  • METHODOLOGY AND INFORMATION SOURCES
  • AUTHORS CREDENTIALS
  • RELATED BCC RESEARCH CREDENTIALS
  • RELATED BCC PUBLICATIONS
  • BCC ONLINE SERVICES
  • DISCLAIMER
• EXECUTIVE SUMMARY
  • Summary Table: NORTH AMERICAN AND GLOBAL DIELECTRIC MATERIAL MARKETS, THROUGH 2010 ($ MILLIONS)
  • Summary Figure: NORTH AMERICAN AND GLOBAL DIELECTRIC MATERIAL MARKETS, 2004-2010 ($ MILLIONS)
• INDUSTRY AND MARKET OVERVIEW
  • NORTH AMERICAN MARKET
  • Table 1 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Table 2 SHARE OF THE NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
    • WORLD MARKET
  • Table 3 GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Table 4 SHARE OF THE GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
  • Table 5 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
    • COMPETITION
    • INDUSTRY STRUCTURE
  • Table 6 COMPANIES INVOLVED IN DIELECTRIC MATERIALS
  • Table 6 (CONTINUED)
  • Table 6 (CONTINUED)
• TECHNOLOGY OVERVIEW
  • HISTORY
  • Table 7 SUMMARY OF 2003 ITRS ROADMAP
  • Table 8 2004 UPDATE TO ITRS ROADMAP, 2004-2013
  • Table 9 HIGHLIGHTS OF RECENT DEVELOPMENTS IN DIELECTRIC MATERIALS
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
  • Table 9 (CONTINUED)
    • RESEARCH AND DEVELOPMENT
      • U.S. GOVERNMENT
        • Air Force
        • Argonne National Laboratory
        • Defense Advance Research Projects Agency (DARPA)
        • Lawrence Berkeley National Laboratory
        • Lawrence Livermore National Laboratory
        • National Institute of Standards and Technology
        • Oak Ridge National Laboratory
        • National Science Foundation
  • Table 10 NSF AWARDS FOR DIELECTRIC MATERIALS RESEARCH
  • Table 10 (CONTINUED)
    • Pacific Northwest National Laboratories
    • UNIVERSITY
      • SUNY-Albany
      • Chemnitz University of Technology
      • Nanyang Technological University
      • National University of Singapore
      • North Carolina State University
      • Pennsylvania State University and University of Missouri-Rolla
      • Rensselaer Polytechnic Institute
      • Rutgers University
      • Seoul National University
      • Stanford University
      • University of Arizona
      • University of California-Berkeley
      • University of California-Los Angeles
      • University College London
      • University of Leicester, UK
      • University of Minnesota
      • University of Texas at Austin
        • University of Texas・Continued)
      • Wayne State University
      • Yale University
    • INDUSTRY
      • ASUKA Project
      • Crolles2 Alliance
      • Honeywell Electronic Materials (HEM)
      • Interuniversity Microelectronics Center (IMEC)
      • Millennium Research for Advanced Information Technology (MIRAI)
      • National Microelectronics Research Center (NMRC)
      • SEMATECH
      • Semiconductor Equipment Assessment (SEA)
      • The SiLKnet Alliance
      • Wafer Technology Consortium
        • Ultrathin Gate Dielectric Characterization
        • Ultralow-K Dielectric Process Technology Development
        • Packaging of Copper/Ultralow-K ICs
      • IBM Almaden Research Center
    • OTHER
    • TYPES OF MATERIALS
  • Table 11 OVERALL SUMMARY OF DIELECTRIC MATERIALS AND APPLICATIONS
    • INORGANIC
  • Table 12 SUMMARY OF INORGANIC DIELECTRICS
  • Table 12 (CONTINUED)
    • Alumina (Al2O3)
    • Hafnium Oxides/Hafnium Silicates
    • Perovskites
    • Silica (SiO2)
    • Porous Silica
  • Table 13 COMPARISON OF POROUS SILICA PROPERTIES
    • Silicates/Phosphosilicates
    • Silicon Nitride (Si3N4)/Other Nitrides
    • Tantalum Pentoxide (Ta2O5)
    • Zirconia (ZrO2)
    • Other
    • Recent Developments
      • Multilayer Composite Dielectric Film
      • RPT-grown Oxynitride Layers for High-k Dielectrics
      • Highly Reliable Amorphous High-k Gate Dielectric ZrOXNY (U. S. Patent No. 6767795)
      • High-k Dielectric Materials and Processes for Manufacturing Them (Patent No. U.S. 6787429)
      • Lanthanide Doped TiOx Dielectric Films (U. S. Patent No. 6790791)
    • ORGANIC
  • Table 14 SUMMARY OF ORGANIC DIELECTRIC MATERIALS
    • Aromatic Thermosets
  • Table 15 DOW CHEMICAL SILK DIELECTRIC PROPERTIES
    • Benzocyclobutene (BCB) Polymers
    • Parylene/poly(arylene Ether)
    • Polyimides
    • Polytetrafluoroethylene (PTFE, Teflon)
    • Siloxanes
    • HYBRID
  • Table 16 SUMMARY OF HYBRID DIELECTRIC MATERIALS
    • Recent Developments
      • Aromatic Thermosetting Polymer for Ultralow-K Dielectric
      • Methylsiloxane Spin-on-Glass Films for Low Dielectric Constant Interlayer Dielectrics
      • Nanoscale Self-Assembled Organic Dielectrics for Ultralow Voltage High-Speed Electronic Devices
      • Spin-On Dielectrics with Low Porosity
      • Ultralow-K Materials based on Nanoporous Fluorinated Polyimide
      • Carbon-Doped Oxide Films for Dual Damascene Processes
      • Porous Low-k Dielectrics with Improved Durability
      • Nanopore Materials for Low-k Dielectrics
      • Ultralow Dielectric Constants Materials for Microelectronics and E-textiles
  • Table 17 SUMMARY OF UCLAS DIELECTRIC MATERIAL
    • Molecular Design of Triptycene-Based Polymers for Low K Dielectrics
    • Defect-Free Dielectric Coatings and Preparation Using Polymeric Nitrogenous Porogens (U.S. Patent No. 6812551)
    • DEPOSITION METHODS
  • Table 18 SUMMARY OF DEPOSITION METHODS AND MATERIALS
    • ATOMIC LAYER DEPOSITION (ALD)
    • CHEMICAL VAPOR DEPOSITION (CVD)
  • Table 19 COMPARISON OF CVD AND SOD
    • JET VAPOR DEPOSITION
    • SPIN-ON DEPOSITION (SOD)
  • Figure 1 GENERAL PROCESS FLOW FOR LOW-K SOD
  • Table 20 COST COMPARISON OF SOD SILK TO CVD AND HYBRID
    • SOL GEL
    • OTHER PROCESSES
      • Dielectric Etch
      • Dielectric CMP
    • RECENT DEVELOPMENTS
      • Atomic Layer Deposition of Single Layers
      • Atomic Vapor Deposition for High-K Materials
      • CVD of Hafnium Silicate Dielectric
      • SiO2-Aerogel Spin-On Process for Low-k Materials
  • Figure 2 PROCESS FLOW OF AEROGEL DEPOSITION AND DIELECTRIC STACK
    • Spin Coating Template Method
    • UC-ALE Deposition of High-k Dielectrics
    • UV-assisted CVD
  • Figure 3 SCHEMATIC OF UV-CVD REACTOR
    • Vapor Phase Plasma Polymerization
    • Method for Depositing Low-k Thermally Stable Dielectric Material
    • Plasma Deposition Sealing Process for Porous Low-k Dielectrics
    • Ultrathin Gate-Insulation Process for Advanced CMOS Transistors
    • Rapid Thermal Nitridation of Oxynitride Layers
    • Radical Nitridation Process
    • UV-Ozone Oxidation of Thin Films
    • RF Plasma-Polymerization for Producing Low-K Thin Polyaniline Films
    • Low Temperature Silicon Nitride Process for Sub-90nm DRAM and Logic IC Manufacturing
    • Method for Growing Ultrathin Nitrided Oxide
    • Method for Forming Airgaps for Semiconductor Devices (U.S. Patent No. 6780753)
    • DIELECTRICS IN SEMICONDUCTOR DEVICES
  • Figure 4 DIELECTRIC ISOLATION
  • Figure 5 GATE DIELECTRIC
  • Figure 6 MEMORY CELL TRENCH CAPACITOR
  • Figure 7 INTERLAYER DIELECTRIC
    • INTERCONNECT DIELECTRIC
      • From Aluminum to Copper
        • From Aluminum to Copper (Continued)
  • Figure 8 DUAL DAMASCENE ETCH VARIATIONS
    • Integration Challenges
  • Table 21 LOW-K INTERCONNECT MATERIAL REQUIREMENTS
    • THE GATE DIELECTRIC
  • Table 22 THE SHRINKING GATE DIELECTRIC LAYER, THROUGH 2016
    • The Gate Dielectric (Continued)
    • Damascene at the Gate
    • MEMORY DEVICES
      • Memory Capacitor Structures
      • Ultrathin Dielectric Layers
  • Table 23 DRAM CAPACITOR DIELECTRIC REQUIREMENTS
    • APPLICATIONS
      • Low-k
  • Table 24 SUMMARY OF LOW-K MATERIALS
  • Table 24 (CONTINUED)
  • Table 25 MATERIAL PROPERTY COMPARISON OF LOW-K DIELECTRICS
    • Low-k (Continued)
    • High-k
  • Table 26 HIGH-K MATERIALS FOR GATE DIELECTRIC APPLICATIONS
    • High-k (Continued)
  • Figure 9 TYPICAL HFSION STACK FORMATION PROCESS
    • Recent Developments
      • 4 Mb SRAM Memory with OSG Dielectric
      • Novel EEPROM Cell with Oxide-Nitride-Oxide as Split Gate Channel Dielectric
      • Low Voltage Operation of Field-effect Transistors Using Pt/SrBi2Ta2O9/Pt/SrTa2O6/SiON/Si Structures
      • Laptop Computers with Low-k Technology
      • High Performance MOSFETs with High-K Gate Dielectrics
      • Strained SiGe MOS Devices with ZrO2 Dielectric
      • GaAs MOSFET with Al2O3 Gate Dielectric
      • DSPs for Wireless Base Stations
      • ASICs Incorporating Low-k Dielectrics
  • Table 27 COMPARISON OF LOW K WITH FSG
    • pMOSFETs with HfO2 Gate Dielectric and TiN Metal Gate
    • Advanced MOSFET for 45-nm Technology
• MARKETS
  • OVERALL NORTH AMERICAN MARKETS
  • Table 28 NORTH AMERICAN DIELECTRIC MATERIAL MARKETS, THROUGH 2010 ($ MILLIONS)
    • BY MATERIAL
    • MARKET DRIVERS
    • TECHNOLOGY DRIVERS
  • Table 29 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
    • Inorganic
  • Table 30 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
    • Organic/Hybrid
      • Organic Low-K Dielectrics
  • Table 31 POLY(ARYLENE ETHER) DIELECTRICS
    • Hybrids
  • Table 32 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
    • Material Suppliers
      • Air Products/Schumacher
      • Applied Materials
  • Table 33 COMPARISON OF APPLIED MATERIALS PRODUCTS
    • Dow Chemical Co.
  • Table 34 PROPERTIES OF SILK DIELECTRICS
    • Dow Corning Co.
  • Table 35 PROPERTIES OF DOW CORNING PRECURSORS
  • Table 36 DOW CORNINGS FOX MATERIALS
    • Honeywell Electronic Materials
  • Table 37 PROPERTIES OF HONEYWELLS DIELECTRIC FILMS
  • Table 37 (CONTINUED)
    • Honeywell Electronic Materials (Continued)
  • Table 38 HISTORY OF NANOGLASS PROPERTIES
    • JSR Micro
  • Table 39 COMPARISON OF JSR DIELECTRICS
    • Novellus
    • Rohm and Haas
    • GLOBAL MARKET
  • Table 40 WORLDWIDE SEMICONDUCTOR CAPITAL EQUIPMENT SPENDING FORECAST, THROUGH 2008 ($ MILLIONS)
    • BY REGION
  • Table 41 SEMICONDUCTOR EQUIPMENT SHARE BY REGION, 2003-2005 (%)
  • Table 42 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, THROUGH 2010 ($ MILLIONS)
  • Figure 10 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, 2004-2010 ($ MILLIONS)
    • BY MATERIAL
  • Table 43 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
  • Figure 11 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, 2004-2010 ($ MILLIONS)
    • Inorganic Material
  • Table 44 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Figure 12 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, 2004-2010 ($ MILLIONS)
    • Organic/Hybrid
  • Table 45 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
  • Figure 13 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
    • BY APPLICATION
  • Table 46 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
  • Figure 14 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, 2004-2010 ($ MILLIONS)
  • Table 47 GLOBAL INTERCONNECT DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
  • Table 48 GLOBAL GATE DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
  • Table 49 GLOBAL CAPACITOR DIELECTRIC MATERIAL USE BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
  • Table 50 GLOBAL MEMORY CAPACITOR DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
    • By Application (Continued)
    • By Application (Continued)
    • BY DEPOSITION METHOD
  • Table 51 FABS ADOPTING LOW-K AT 130 NM
    • By Deposition Method (Continued)
  • Table 52 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, THROUGH 2010 ($ MILLIONS)
  • Figure 15 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, 2004-2010 ($ MILLIONS)
    • INDUSTRY DYNAMICS
  • Table 53 POTENTIAL MERGERS BY 2010
    • MAJOR PLAYERS
  • Table 54 SALES OF TOP 25 SEMICONDUCTOR COMPANIES BY RANK, 2003 AND 2004
  • Table 55 MAJOR PLAYERS IN DIELECTRIC MATERIALS
  • Table 56 MARKET SHARE BY COMPANY FOR DIELECTRIC MATERIALS, 2004 (%)
    • ACQUISITIONS, MERGERS AND EXPANSIONS
  • Table 57 SUMMARY OF ACQUISITIONS AND EXPANSIONS, 2001-2005
    • LICENSING AND MARKETING AGREEMENTS
  • Table 58 SUMMARY OF LICENSING AND MARKETING AGREEMENTS, 2000-2005
  • Table 58 (CONTINUED)
  • Table 58 (CONTINUED)
    • COMPETITION
    • PRICE TRENDS
• PROFILES OF COMPANIES IN DIELECTRIC MATERIALS
  • ACM RESEARCH INC.
  • ADVANCED MICRO DEVICES
    • ADVANCED MICRO DEVICES (CONTINUED)
  • AGERE SYSTEMS
  • AIR LIQUIDE ELECTRONICS
  • ALTERA CORPORATION
  • APPLIED MATERIALS
  • ASAHI GLASS CO. LTD.
  • ASM INTERNATIONAL
  • ATI TECHNOLOGIES, INC.
  • AVIZA TECHNOLOGY
  • AXCELIS TECHNOLOGIES
  • CHARTERED SEMICONDUCTOR MANUFACTURING
  • CYPRESS SEMICONDUCTOR
  • DAINIPPON SCREEN MANUFACTURING
  • DOW CHEMICAL
  • DOW CORNING INC.
    • DOW CORNING INC. (CONTINUED)
  • ELUME INC.
  • FREESCALE SEMICONDUCTOR
  • FSI INTERNATIONAL
  • FUJITSU MICROELECTRONICS, INC.
  • GENUS, INC.
  • HITACHI, LTD.
    • HITACHI, LTD. (CONTINUED)
  • HONEYWELL ELECTRONIC MATERIALS
  • HYNIX SEMICONDUCTOR INC.
  • INFINEON TECHNOLOGIES AG
  • INTEL CORP.
  • INTERNATIONAL BUSINESS MACHINES (IBM)
  • IPTYX CORPORATION
  • JSR CORP.
  • LAM RESEARCH CORP.
  • LSI LOGIC
  • LUCENT TECHNOLOGIES
  • MATTSON TECHNOLOGY, INC.
  • MEMSCAP
  • MICRON TECHNOLOGY, INC.
  • MITSUBISHI ELECTRIC CORP.
    • MITSUBISHI ELECTRIC CORP. (CONTINUED)
  • NEC CORP.
  • NOVELLUS
    • NOVELLUS (CONTINUED)
  • PHILIPS SEMICONDUCTOR
    • PHILIPS SEMICONDUCTOR (CONTINUED)
  • RENESAS TECHNOLOGY AMERICA INC.
  • ROHM AND HAAS ELECTRONIC MATERIALS
  • SAMSUNG ELECTRONICS
  • SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. (SELETE)
  • SCHUMACHER
  • SILECS, INC.
  • STMICROELECTRONICS
  • TAIWAN SEMICONDUCTOR MANUFACTURING CO.
    • TAIWAN SEMICONDUCTOR MANUFACTURING CO. (CONTINUED)
  • TEXAS INSTRUMENTS, INC.
    • TEXAS INSTRUMENTS, INC. (CONTINUED)
  • TOKYO ELECTRON, LTD.
  • TOSHIBA CORP.
  • TRIKON TECHNOLOGIES
  • UNITED MICROELECTRONICS CO. (UMC)
    • UNITED MICROELECTRONICS CO. (UMC) (CONTINUED)
    • UNITED MICROELECTRONICS CO・CONTINUED)
• APPENDIX
  • SUMMARY OF PATENTS IN DIELECTRIC MATERIALS, PROCESSING AND APPLICATIONS
    • PATENTS BY COUNTRY
    • PATENTS BY ASSIGNEE
  • Table 59 TOP 20 U.S. PATENT WINNERS IN 2004
  • Table 60 NUMBER OF U.S. PATENTS IN DELECTRIC MATERIALS, PROCESSING AND APPLICATIONS PER COMPANY IN 2004
  • Table 60 (CONTINUED)
  • Table 61 NUMBER OF JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGIES PER COMPANY IN 2004
    • PATENTS BY MATERIAL TYPES
    • PATENTS BY DEPOSITION TECHNOLOGIES
    • U.S. PATENTS IN INORGANIC DIELETRICS
  • Table 62 U.S. PATENTS IN INORGANIC DIELETRICS, 2000-2004
  • Table 62 (CONTINUED)
  • Table 62 (CONTINUED)
  • Table 62 (CONTINUED)
    • U.S. PATENTS IN ORGANIC DIELECTRICS
  • Table 63 U.S. PATENTS IN ORGANIC DIELECTRICS, 2000-2004
  • Table 63 (CONTINUED)
  • Table 63 (CONTINUED)
    • U.S. PATENTS IN DIELECTRIC APPLICATIONS AND PROCESSING
  • Table 64 U.S. PATENTS IN DIELECTRIC APPLICATIONS AND PROCESSING, 2000-2004
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
  • Table 64 (CONTINUED)
    • RECENT JAPANESE PATENTS IN DIELECTRICS MATERIALS AND TECHNOLOGY
  • Table 65 JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 2001-2004
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 56 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
  • Table 65 (CONTINUED)
    • RECENT INTERNATIONAL PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY
  • Table 66 INTERNATIONAL PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 1997-2004
  • Table 66 (CONTINUED)
  • Table 66 (CONTINUED)
  • Table 66 (CONTINUED)
  • Table 66 (CONTINUED)
    • OTHER RESEARCH ORGANIZATIONS INVOLVED IN DIELECTRICS RESEARCH
    • GLOSSARY OF ACRONYMS
      • GLOSSARY OF ACRONYMS (CONTINUED)
      • GLOSSARY OF ACRONYMS (CONTINUED)
• LIST OF TABLES
• Summary Table:
• Table 1 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 2 SHARE OF THE NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
• Table 3 GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 4 SHARE OF THE GLOBAL DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, 2004-2010 (%)
• Table 5 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
• Table 6 COMPANIES INVOLVED IN DIELECTRIC MATERIALS
• Table 7 SUMMARY OF 2003 ITRS ROADMAP
• Table 8 2004 UPDATE TO ITRS ROADMAP, 2004-2013
• Table 9 HIGHLIGHTS OF RECENT DEVELOPMENTS IN DIELECTRIC MATERIALS
• Table 10 NSF AWARDS FOR DIELECTRIC MATERIALS RESEARCH
• Table 11 OVERALL SUMMARY OF DIELECTRIC MATERIALS AND APPLICATIONS
• Table 12 SUMMARY OF INORGANIC DIELECTRICS
• Table 13 COMPARISON OF POROUS SILICA PROPERTIES
• Table 14 SUMMARY OF ORGANIC DIELECTRIC MATERIALS
• Table 15 DOW CHEMICAL SILK DIELECTRIC PROPERTIES
• Table 16 SUMMARY OF HYBRID DIELECTRIC MATERIALS
• Table 17 SUMMARY OF UCLAS DIELECTRIC MATERIAL
• Table 18 SUMMARY OF DEPOSITION METHODS AND MATERIALS
• Table 19 COMPARISON OF CVD AND SOD
• Table 20 COST COMPARISON OF SOD SILK TO CVD AND HYBRID
• Table 21 LOW-K INTERCONNECT MATERIAL REQUIREMENTS
• Table 22 THE SHRINKING GATE DIELECTRIC LAYER, THROUGH 2016
• Table 23 DRAM CAPACITOR DIELECTRIC REQUIREMENTS
• Table 24 SUMMARY OF LOW-K MATERIALS
• Table 25 MATERIAL PROPERTY COMPARISON OF LOW-K DIELECTRICS
• Table 26 HIGH-K MATERIALS FOR GATE DIELECTRIC APPLICATIONS
• Table 27 COMPARISON OF LOW K WITH FSG
• Table 28 NORTH AMERICAN DIELECTRIC MATERIAL MARKETS, THROUGH 2010 ($ MILLIONS)
• Table 29 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 30 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 31 POLY(ARYLENE ETHER) DIELECTRICS
• Table 32 NORTH AMERICAN DIELECTRIC MATERIAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 33 COMPARISON OF APPLIED MATERIALS PRODUCTS
• Table 34 PROPERTIES OF SILK DIELECTRICS
• Table 35 PROPERTIES OF DOW CORNING PRECURSORS
• Table 36 DOW CORNINGS FOX MATERIALS
• Table 37 PROPERTIES OF HONEYWELLS DIELECTRIC FILMS
• Table 38 HISTORY OF NANOGLASS PROPERTIES
• Table 39 COMPARISON OF JSR DIELECTRICS
• Table 40 WORLDWIDE SEMICONDUCTOR CAPITAL EQUIPMENT SPENDING FORECAST, THROUGH 2008 ($ MILLIONS)
• Table 41 SEMICONDUCTOR EQUIPMENT SHARE BY REGION, 2003-2005 (%)
• Table 42 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, THROUGH 2010 ($ MILLIONS)
• Table 43 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
• Table 44 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 45 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
• Table 46 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, THROUGH 2010 ($ MILLIONS)
• Table 47 GLOBAL INTERCONNECT DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
• Table 48 GLOBAL GATE DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
• Table 49 GLOBAL CAPACITOR DIELECTRIC MATERIAL USE BY MATERIAL TYPE, THROUGH 2010 ($ MILLIONS)
• Table 50 GLOBAL MEMORY CAPACITOR DIELECTRIC MATERIAL USE BY DIELECTRIC CONSTANT, THROUGH 2010 ($ MILLIONS)
• Table 51 FABS ADOPTING LOW-K AT 130 NM
• Table 52 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, THROUGH 2010 ($ MILLIONS)
• Table 53 POTENTIAL MERGERS BY 2010
• Table 54 SALES OF TOP 25 SEMICONDUCTOR COMPANIES BY RANK, 2003 AND 2004
• Table 55 MAJOR PLAYERS IN DIELECTRIC MATERIALS
• Table 56 MARKET SHARE BY COMPANY FOR DIELECTRIC MATERIALS, 2004 (%)
• Table 57 SUMMARY OF ACQUISITIONS AND EXPANSIONS, 2001-2005
• Table 58 SUMMARY OF LICENSING AND MARKETING AGREEMENTS, 2000-2005
• Table 59 TOP 20 U.S. PATENT WINNERS IN 2004
• Table 60 NUMBER OF U.S. PATENTS IN DELECTRIC MATERIALS, PROCESSING AND APPLICATIONS PER COMPANY IN 2004
• Table 61 NUMBER OF JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGIES PER COMPANY IN 2004
• Table 62 U.S. PATENTS IN INORGANIC DIELETRICS, 2000-2004
• Table 63 U.S. PATENTS IN ORGANIC DIELECTRICS, 2000-2004
• Table 64 U.S. PATENTS IN DIELECTRIC APPLICATIONS AND PROCESSING, 2000-2004
• Table 65 JAPANESE PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 2001-2004
• Table 66 INTERNATIONAL PATENTS IN DIELECTRIC MATERIALS AND TECHNOLOGY, 1997-2004
• LIST OF FIGURES
• Summary Figure:
• Figure 1 GENERAL PROCESS FLOW FOR LOW-K SOD
• Figure 2 PROCESS FLOW OF AEROGEL DEPOSITION AND DIELECTRIC STACK
• Figure 3 SCHEMATIC OF UV-CVD REACTOR
• Figure 4 DIELECTRIC ISOLATION
• Figure 5 GATE DIELECTRIC
• Figure 6 MEMORY CELL TRENCH CAPACITOR
• Figure 7 INTERLAYER DIELECTRIC
• Figure 8 DUAL DAMASCENE ETCH VARIATIONS
• Figure 9 TYPICAL HFSION STACK FORMATION PROCESS
• Figure 10 GLOBAL MARKET FOR DIELECTRIC MATERIALS BY REGION, 2004-2010 ($ MILLIONS)
• Figure 11 GLOBAL DIELECTRIC MATERIAL MARKET BY MATERIAL TYPE, 2004-2010 ($ MILLIONS)
• Figure 12 GLOBAL MARKET BY TYPE OF INORGANIC MATERIAL, 2004-2010 ($ MILLIONS)
• Figure 13 GLOBAL MARKET BY TYPE OF ORGANIC/HYBRID MATERIAL, THROUGH 2010 ($ MILLIONS)
• Figure 14 GLOBAL DIELECTRIC MATERIALS MARKET BY APPLICATION, 2004-2010 ($ MILLIONS)
• Figure 15 GLOBAL DIELECTRIC MATERIALS MARKET BY DEPOSITION METHOD, 2004-2010 ($ MILLIONS)

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